公开(公告)号：US20230118345A1

公开(公告)日：2023-04-20

申请号：US18066505

申请日：2022-12-15

Applicant: AGC INC.

Inventor： Kazutaka ONO ,  Takatoshi YAOITA ,  Reo USUI ,  Kenichi EBATA ,  Jun AKIYAMA

IPC: H01L27/12 ,  B32B7/12 ,  B32B17/00 ,  B32B17/06 ,  B32B38/10 ,  B32B43/00 ,  C03C3/091 ,  C03C27/10 ,  H01L21/683 ,  H01L29/786 ,  B32B7/06

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

公开(公告)号：US20230154938A1

公开(公告)日：2023-05-18

申请号：US18066497

申请日：2022-12-15

Applicant: AGC INC.

Inventor： Kazutaka ONO ,  Takatoshi YAOITA ,  Reo USUI ,  Kenichi EBATA ,  Jun AKIYAMA

IPC: H01L27/12 ,  B32B7/12 ,  B32B17/00 ,  B32B17/06 ,  B32B38/10 ,  B32B43/00 ,  C03C3/091 ,  C03C27/10 ,  H01L21/683 ,  H01L29/786 ,  B32B7/06

CPC classification number: H01L27/1266 ,  B32B7/12 ,  B32B17/00 ,  B32B17/06 ,  B32B38/10 ,  B32B43/006 ,  C03C3/091 ,  C03C27/10 ,  H01L21/6835 ,  H01L27/1222 ,  H01L29/78672 ,  B32B7/06 ,  H01L2221/68386 ,  B32B2307/30 ,  B32B2307/308 ,  B32B2307/546 ,  B32B2307/734 ,  B32B2315/08 ,  B32B2457/00 ,  G02F1/1341

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.