公开(公告)号：US20230095132A1

公开(公告)日：2023-03-30

申请号：US17931198

申请日：2022-09-12

Applicant: AGC Inc.

Inventor： Mamoru ISOBE ,  Kohei HORIUCHI ,  Satoshi NAKAYAMA

IPC: C03C23/00 ,  C03C15/00

Abstract: A manufacturing method of a glass plate having holes, includes: (1) having a first surface of a glass base material irradiated with a laser, to form initial holes each having a first initial opening, wherein each initial hole is an initial through hole or non-through hole, wherein the first initial opening has a maximum dimension φ1S of 5 μm or greater, and wherein in each initial hole, denoting a depth as d1, an aspect ratio (d1/φ1S) is 15 or greater; and (2) etching the glass base material with an alkaline solution, to form processed holes from the initial holes, wherein each processed hole has a first opening on the first surface, and wherein the first opening has a diameter φ1 defined as an average of diameters of circumscribed and inscribed circles of the first opening, and a roundness P1, and a ratio P1/φ1 is 10% or less.

公开(公告)号：US20190021170A1

公开(公告)日：2019-01-17

申请号：US16030216

申请日：2018-07-09

Applicant: AGC Inc.

Inventor： Mamoru ISOBE ,  Motoshi ONO ,  Shigetoshi MORI ,  Kohei HORIUCHI

IPC: H05K3/00 ,  H05K1/11 ,  H05K1/03 ,  B23K26/046 ,  B23K26/064 ,  B23K26/142 ,  B23K26/382 ,  B23K26/402

Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 μm or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.

公开(公告)号：US20230183130A1

公开(公告)日：2023-06-15

申请号：US18059034

申请日：2022-11-28

Applicant: AGC Inc.

Inventor： Mamoru ISOBE ,  Kohei HORIUCHI ,  Katsuaki MIYATANI ,  Naoki UEMURA ,  Akiko OSAKI

IPC: C03C23/00 ,  C03C15/00 ,  C03C19/00

CPC classification number: C03C23/0025 ,  C03C15/00 ,  C03C19/00 ,  C03C23/0075

Abstract: A method of manufacturing a glass substrate having a penetrating structure, the method includes: (1) preparing a glass substrate that has a first surface and a second surface opposite to each other, and includes 3 mol % to 30 mol % of B2O3 in terms of oxide; (2) having the glass substrate irradiated with a laser from a first surface side, to form an initial penetrating structure; (3) wet etching the glass substrate having the initial penetrating structure formed; (4) polishing the wet-etched glass substrate from the first surface side, by using an abrasive including acid-soluble abrasive grains; and (5) cleaning the glass substrate with an acid solution.

公开(公告)号：US20210197320A1

公开(公告)日：2021-07-01

申请号：US17120717

申请日：2020-12-14

Applicant: AGC Inc.

Inventor： Mamoru ISOBE ,  Kohei HORIUCHI

IPC: B23K26/384 ,  C03C15/00 ,  B23K26/0622 ,  B23K26/50 ,  B23K26/402

Abstract: A glass substrate for a semiconductor package includes a first principal surface, a second principal surface, at least one hollowed-out portion, and at least one through hole formed in a surrounding of the at least one hollowed-out portion, wherein in a section of the at least one hollowed-out portion taken in a direction perpendicular to the first principal surface, a minimum diameter of the at least one hollowed-out portion is smaller than an opening diameter of the at least one hollowed-out portion at each of the first principal surface and the second principal surface.

公开(公告)号：US20240246854A1

公开(公告)日：2024-07-25

申请号：US18419877

申请日：2024-01-23

Applicant: AGC Inc.

Inventor： Mamoru ISOBE ,  Yuha KOBAYASHI ,  Izuru SUWA

IPC: C03C23/00

CPC classification number: C03C23/0025

Abstract: A glass substrate is a glass substrate in which a dot is formed on a surface. A region in which the dot is formed does not include a crack, and a retardation in the region in which the dot is formed is equal to or smaller than 50 nm.

公开(公告)号：US20230250382A1

公开(公告)日：2023-08-10

申请号：US18163341

申请日：2023-02-02

Applicant: AGC Inc.

Inventor： Kensuke ONO ,  Kiyohisa NAKAMURA ,  Mamoru ISOBE ,  Kohei HORIUCHI

IPC: C12M1/12 ,  C12M1/32

CPC classification number: C12M25/00 ,  C12M23/12

Abstract: To provide a substrate of a cell culture container in which cells are appropriately maintained in dents and the cells in the dents are appropriately observed, and a cell culture container.
The substrate of a cell culture container of the present invention has a bottom face and a surface having a dent-formed region having a plurality of dents formed, wherein the average depth of the plurality of dents is 200 µm or more, the formula θ1

公开(公告)号：US20230086962A1

公开(公告)日：2023-03-23

申请号：US18071241

申请日：2022-11-29

Applicant: AGC Inc.

Inventor： Mamoru ISOBE ,  Shigetoshi MORI ,  Kohei HORIUCHI

IPC: B23K26/362 ,  B23K26/382 ,  B23K26/402

Abstract: A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.