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公开(公告)号：US20180163040A1
公开(公告)日：2018-06-14
申请号：US15672933
申请日：2017-08-09
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHIEH LIN , CHING-FENG LIN , MING-TSUNG CHEN
Abstract: The instant disclosure provides a polymer composite material, the method for manufacturing the polymer composite material, a capacitor package structure using the polymer composite material and the method for manufacturing the capacitor package structure. The polymer composite material is used for the cathode of a capacitor, wherein the polymer composite material includes poly(3,4-ethylenedioxythiophene), polystyrene sulfonate and a nanomaterial. Polystyrene sulfonate is connected between the nanomaterial and poly(3,4-ethylenedioxythiophene), and polystyrene sulfonate is bonded to the poly(3,4-ethylenedioxythiophene) through a polymerization process. The content of the nanomaterial ranges from 0.01-1.5 wt. % based on the weight of the polymer composite material.
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2.发明申请METHOD OF MANUFACTURING A WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE WITHOUT USING A LEAD FRAME 有权不使用引线框架制造卷绕型固体电解电容器封装结构的方法公开(公告)号：US20150371783A1
公开(公告)日：2015-12-24
申请号：US14840281
申请日：2015-08-31
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： MING-TSUNG CHEN , CHING-FENG LIN
IPC: H01G9/00
CPC classification number: H01G9/0029 , H01G4/228 , H01G4/32 , H01G9/008 , H01G9/012 , H01G9/016 , H01G2009/0014 , H01G2009/0018 , Y10T29/302 , Y10T29/417 , Y10T29/42
Abstract: A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body.
Abstract translation: 不使用任何引线框的绕线式固体电解电容器封装结构包括绕组电容器和封装体。 绕组电容器具有由封装体包围的绕组体，从绕组体的第一侧面延伸的正极导体引线和从绕组体的第二侧面延伸的负极导电引线。 正导电引脚具有由封装主体封装的第一嵌入部分和暴露在封装主体外部并沿封装主体的第一侧表面和底表面延伸的第一暴露部分。 负导电引脚具有由封装主体封闭的第二嵌入部分和暴露在封装主体外部并沿封装主体的第二侧表面和底表面延伸的第二暴露部分。
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公开(公告)号：US20140218842A1
公开(公告)日：2014-08-07
申请号：US14049437
申请日：2013-10-09
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHING-FENG LIN , MING-TSUNG CHEN , YI-YING WANG
CPC classification number: H01G9/0425 , B82Y30/00 , B82Y40/00 , H01G9/0029 , Y10S977/948 , Y10T29/302
Abstract: The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400° C. to 1000° C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.
Abstract translation: 本公开涉及电容器阴极箔结构的制造方法，包括以下步骤。 第一步是提供基箔，随后将箔插入反应器。 下一步是执行将基底箔加热到400℃至1000℃的温度区域的加热过程。下一步是将含碳前体气体引入反应器。 最后一步是执行用于将基底箔冷却到低于100℃的温度的冷却过程，以在基底箔的一个表面上沉积基于石墨烯的层，其中石墨烯层由多个石墨烯层组成， 基于薄膜的堆叠布置。
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公开(公告)号：US20170110256A1
公开(公告)日：2017-04-20
申请号：US15147120
申请日：2016-05-05
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHING-FENG LIN , LIANG-MIN KAO , CHUN-CHIA HUANG
Abstract: The instant disclosure provides a solid electrolytic capacitor package structure and method of manufacturing the same. The solid electrolytic capacitor package structure includes a capacitor assembly, at least one electrode pin and a package body enclosing the capacitor assembly and the electrode pin. The electrode pin includes an embedded portion enclosed by the package body and an exposed portion positioned outside the package body. The method of manufacturing the solid electrolytic capacitor package structure includes a protection step including forming a protecting film on the exposed portion; a coating step including depositing a nanomaterial on the solid electrolytic capacitor package structure to form a nanofilm, wherein the nanomaterial penetrates into defects of the solid electrolytic capacitor package structure; and a deprotection step including removing the protecting film. The instant disclosure provides improved air-tight and water-tight properties of the solid electrolytic capacitor package structure, thereby increasing the lifetime thereof.
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5.发明申请WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE WITHOUT USING A LEAD FRAME AND METHOD OF MANUFACTURING THE SAME 有权不使用引线框架的卷绕型固体电解电容器封装结构及其制造方法公开(公告)号：US20140268503A1
公开(公告)日：2014-09-18
申请号：US13845183
申请日：2013-03-18
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： MING-TSUNG CHEN , CHING-FENG LIN
CPC classification number: H01G9/0029 , H01G4/228 , H01G4/32 , H01G9/008 , H01G9/012 , H01G9/016 , H01G2009/0014 , H01G2009/0018 , Y10T29/302 , Y10T29/417 , Y10T29/42
Abstract: A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body.
Abstract translation: 不使用任何引线框的绕线式固体电解电容器封装结构包括绕组电容器和封装体。 绕组电容器具有由封装体包围的绕组体，从绕组体的第一侧面延伸的正极导体引线和从绕组体的第二侧面延伸的负极导电引线。 正导电引脚具有由封装主体封装的第一嵌入部分和暴露在封装主体外部并沿封装主体的第一侧表面和底表面延伸的第一暴露部分。 负导电引脚具有由封装主体封闭的第二嵌入部分和暴露在封装主体外部并沿封装主体的第二侧表面和底表面延伸的第二暴露部分。
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Patent Agency Ranking
6.发明申请WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE USING A CARRIER BOARD AND METHOD OF MANUFACTURING THE SAME 有权使用承载板的卷绕型固体电解电容器包装结构及其制造方法公开(公告)号：US20140262459A1
公开(公告)日：2014-09-18
申请号：US13845175
申请日：2013-03-18
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： MING-TSUNG CHEN , CHING-FENG LIN
CPC classification number: H01G9/0029 , H01G9/012 , H01G9/151 , H01G13/006 , Y10T29/417
Abstract: A winding-type solid electrolytic capacitor package structure includes a substrate body, a winding capacitor, a package body and an electrode unit. The winding capacitor has a winding body, a positive conductive lead pin having a positive end surface, and a negative conductive lead pin having a negative end surface. The package body is disposed on the substrate body to enclose the winding body, and the package body has a first lateral surface substantially flushed with the positive end surface and a second lateral surface substantially flushed with the negative end surface. The electrode unit includes a positive electrode structure for covering the first lateral surface and electrically contacting the positive end surface and a negative electrode structure for covering the second lateral surface and electrically contacting the negative end surface.
Abstract translation: 卷绕式固体电解电容器封装结构包括基板主体，绕组电容器，封装体和电极单元。 绕组电容器具有绕组体，具有正端面的正导电引脚和具有负端面的负导电引脚。 封装体设置在基板主体上以包围绕组体，并且封装主体具有基本上被正端面冲洗的第一侧表面和基本上被负端面冲洗的第二侧表面。 电极单元包括用于覆盖第一侧表面并与正端面电接触的正电极结构和用于覆盖第二侧表面并与底端表面电接触的负电极结构。
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公开(公告)号：US20210296054A1
公开(公告)日：2021-09-23
申请号：US17024897
申请日：2020-09-18
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHIEH LIN , CHUNG-JUI SU , CHING-FENG LIN , MING-TSUNG CHEN
Abstract: A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly and a conductive assembly. The winding assembly includes a winding conductive positive foil and a winding conductive negative foil. The package assembly fully encloses the winding assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The package assembly includes a casing structure, a filling body and a bottom enclosing structure. The casing structure has an accommodating space for receiving the winding assembly. The filling body is filled in the accommodating space for surrounding the winding assembly. The bottom enclosing structure is disposed on a bottom portion of the casing structure for carrying the winding assembly and enclosing the accommodating space. The bottom enclosing structure is surrounded by the casing structure and tightly connected to the filling body.
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公开(公告)号：US20170133158A1
公开(公告)日：2017-05-11
申请号：US15414963
申请日：2017-01-25
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHING-FENG LIN , MING-TSUNG CHEN
CPC classification number: H01G9/0029 , B82Y30/00 , B82Y40/00 , H01G9/0425 , H01G9/045 , H01G9/048 , Y10S977/948 , Y10T29/302
Abstract: The instant disclosure relates to a manufacturing method of capacitor cathode foil structure, comprising the following steps. The first step is providing a base foil, subsequently inserting the foil into a reactor. The next step is executing a heating process for heat the base foil to a temperature region of 400° C. to 1000° C. The next step is directing a carbon containing precursor gas into the reactor. The last step is executing a cooling process for cooling the base foil to a temperature below 100° C. to deposit a graphene-based layer on one surface of the base foil, wherein the graphene-based layer is consisted of a plurality of graphene-based thin films in stacked arrangement.
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公开(公告)号：US20160379761A1
公开(公告)日：2016-12-29
申请号：US15263706
申请日：2016-09-13
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHING-FENG LIN , MING-TSUNG CHEN
CPC classification number: H01G9/151 , B22F3/02 , C22C21/00 , H01G9/0029 , H01G9/0032 , H01G9/0036 , H01G9/0425 , H01G9/045 , H01G9/052 , H01G9/0525 , H01G9/07 , H01G9/15
Abstract: The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high- temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit.
Abstract translation: 本公开涉及一种用于生产固体电解电容器的改进方法，包括以下步骤。 首先，提供绝缘基板。 接下来，在绝缘基板上形成包括铝粉末的多个导电凝胶。 第三，执行高温烧结工艺以使导电凝胶金属化以形成多个铝板。 接下来，在每个铝板上形成电介质层。 然后在每个电介质层上形成隔离层，以限定阳极区域和阴极区域。 最后，在每个阴极区域的电介质层上形成导电层，由此限定了一个固体电解电容器单元。
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公开(公告)号：US20240431032A1
公开(公告)日：2024-12-26
申请号：US18417051
申请日：2024-01-19
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHING-FENG LIN , CHIEH LIN , MING-TSUNG LIANG , CHUNG-JUI SU
Abstract: A laterally placed capacitor package assembly and an assembly method thereof are provided. The laterally placed capacitor package assembly includes a wound capacitor package structure and a capacitor supporting structure. The wound capacitor package structure includes a wound assembly, a conductive assembly and a package assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The capacitor supporting structure includes a supporting portion configured to support the wound capacitor package structure and a plurality of positioning portions extending outward from the supporting portion. When the laterally placed capacitor package assembly is configured to be laterally disposed on a circuit substrate, a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin can be laterally and electrically connected to the circuit substrate without bending.
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