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    Electronic Device With Antenna
    1.
    发明申请
    Electronic Device With Antenna 审中-公开

    公开(公告)号：US20170170545A1

    公开(公告)日：2017-06-15

    申请号：US14966446

    申请日：2015-12-11

    Applicant: Apple Inc.

    Inventor： Francesco Merli ,  Yi Jiang ,  Boon W. Shiu ,  Carlo Di Nallo ,  Javier Gomez Tagle ,  Mattia Pascolini

    IPC: H01Q1/22 ,  H04R1/02 ,  H01Q9/04

    CPC classification number: H01Q1/2291 ,  H01Q1/243 ,  H01Q1/44 ,  H01Q9/0421 ,  H01Q9/0457 ,  H01Q9/42 ,  H04R1/02

    Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include an antenna. The electronic device may have a housing in which control circuitry and radio-frequency transceiver circuitry is mounted. The transceiver circuitry may be used to transmit and receive radio-frequency signals with the antenna. The housing may have a housing wall with a locally thinned portion aligned with the antenna. The antenna may have a sheet metal layer attached to a plastic cavity with a layer of adhesive. Recesses in a printed circuit may receive prongs formed from a sheet metal layer. The plastic carrier may have cavities separated by ribs. The sheet metal layer may form a planar inverted-F antenna resonating element, a ground plane, a return path between the resonating element and ground plane, and a feed path that extends along one of the ribs and into an opening in the printed circuit.

    Electronic device with foam antenna carrier
    2.
    发明授权
    Electronic device with foam antenna carrier 有权
    带泡沫天线载体的电子设备

    公开(公告)号：US09520643B2

    公开(公告)日：2016-12-13

    申请号：US13860437

    申请日：2013-04-10

    Applicant: Apple Inc.

    Inventor： Boon W. Shiu ,  Chun-Lung Chen

    IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q9/04

    CPC classification number: H01Q1/38 ,  H01Q1/243 ,  H01Q9/0421 ,  Y10T29/49016

    Abstract: Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include a dielectric carrier such as a foam carrier. The foam carrier may be formed from a material that can withstand elevated temperatures. Metal traces for antennas can be formed on the foam carrier by selectively activating areas on a powder coating with a laser and plating the laser-activated areas. Metal for the antennas may also be formed by attaching layers such as flexible printed circuit layers and metal foil layers to the foam carrier. Solder may be used to attach a coaxial cable or other transmission line, electrical components, and other electrical structures to the metal antenna structures on the foam carrier. The foam carrier may be formed from open cell or closed cell foam. The surface of the foam may be smoothed to facilitate formation of metal antenna structures.

    Abstract translation: 电子设备可以包括射频收发器电路和天线结构。 天线结构可以包括介电载体，例如泡沫载体。 泡沫载体可以由能够承受高温的材料形成。 通过用激光选择性地激活粉末涂层上的区域并镀覆激光激活区域，可以在泡沫载体上形成用于天线的金属迹线。 用于天线的金属也可以通过将诸如柔性印刷电路层和金属箔层的层附着到泡沫载体上而形成。 焊料可用于将同轴电缆或其它传输线，电气部件和其他电气结构连接到泡沫载体上的金属天线结构。 泡沫载体可以由开孔或闭孔泡沫形成。 泡沫的表面可以被平滑以便于形成金属天线结构。

    Electronic Devices with Light Sensors
    3.
    发明申请
    Electronic Devices with Light Sensors 有权
    带光传感器的电子设备

    公开(公告)号：US20140166867A1

    公开(公告)日：2014-06-19

    申请号：US13718850

    申请日：2012-12-18

    Applicant: APPLE INC.

    Inventor： Boon W. Shiu ,  David Lin Lee ,  Michael DiVincent

    IPC: G01J1/02

    CPC classification number: G01J1/0271 ,  G01J1/0425 ,  G01J1/0444 ,  G01J1/4204 ,  G01J1/4228 ,  H04M1/22

    Abstract: Electronic devices may be provided with light sensors. Light sensors may be proximity sensors or ambient light sensors. Proximity sensors may include a light-emitting component and a light-sensitive component. The electronic device may include an enclosure formed from housing structures and some or all of a display for the device. The enclosure may include openings such as openings formed from clusters of smaller openings. Each light sensor may receive light through one of the clusters of openings. The light sensor may receive the light directly through the openings or may receive light that passes through the openings and is guided to the light sensor by light guiding structures. The light guiding structures may include fiber optic structures or light-reflecting structures. Fiber optic structures may fill or partially fill the openings. Light reflecting structures may be machined cavities in an internal support structure.

    Abstract translation: 电子设备可以设置有光传感器。 光传感器可以是接近传感器或环境光传感器。 接近传感器可以包括发光部件和感光部件。 电子设备可以包括由壳体结构形成的外壳和用于该装置的显示器的部分或全部。 外壳可以包括开口，例如由较小开口的簇形成的开口。 每个光传感器可以通过一组开口接收光。 光传感器可以直接通过开口接收光，或者可以接收穿过开口的光，并通过光导结构被引导到光传感器。 光引导结构可以包括光纤结构或光反射结构。 光纤结构可以填充或部分填充开口。 光反射结构可以在内部支撑结构中被加工成腔。

    Methodology and Apparatus for Testing Conductive Adhesive Within Antenna Assembly
    8.
    发明申请
    Methodology and Apparatus for Testing Conductive Adhesive Within Antenna Assembly 有权
    天线组件内导电胶粘剂测试方法与装置

    公开(公告)号：US20150050893A1

    公开(公告)日：2015-02-19

    申请号：US13968166

    申请日：2013-08-15

    Applicant: Apple Inc.

    Inventor： Joshua G. Nickel ,  Chun-Lung Chen ,  Tseng-Mau Yang ,  Nicholas G. Merz ,  Robert W. Schlub ,  Boon W. Shiu ,  Erica J. Tong

    IPC: G01N3/56 ,  H04B17/00

    CPC classification number: G01N3/56 ,  G01N3/08 ,  G01N3/24 ,  G01N19/04 ,  H04B17/16

    Abstract: Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.

    Abstract translation: 用作电子设备内的导电结构之间桥接连接的导电材料的损坏可能导致射频（RF）和其他无线通信的缺陷。 提供了一种用于测试被测设备结构的测试系统。 被测器件结构可以包括衬底和衬底之间的导电材料。 测试系统可以包括用于增加被测装置结构上的拉伸或压缩应力以评估导电材料的弹性的测试夹具。 测试系统还可以包括用于发送RF测试信号并从被测设备结构接收测试数据的测试单元。 所接收的测试数据可以包括来自被测器件结构的散射参数测量，其可以用于确定被测器件结构是否满足期望的RF性能标准。

    Electronic Device With Foam Antenna Carrier
    9.
    发明申请
    Electronic Device With Foam Antenna Carrier 有权
    具有泡沫天线载体的电子设备

    公开(公告)号：US20140306845A1

    公开(公告)日：2014-10-16

    申请号：US13860437

    申请日：2013-04-10

    Applicant: APPLE INC.

    Inventor： Boon W. Shiu ,  Chun-Lung Chen

    IPC: H01Q1/38

    CPC classification number: H01Q1/38 ,  H01Q1/243 ,  H01Q9/0421 ,  Y10T29/49016

    Abstract: Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include a dielectric carrier such as a foam carrier. The foam carrier may be formed from a material that can withstand elevated temperatures. Metal traces for antennas can be formed on the foam carrier by selectively activating areas on a powder coating with a laser and plating the laser-activated areas. Metal for the antennas may also be formed by attaching layers such as flexible printed circuit layers and metal foil layers to the foam carrier. Solder may be used to attach a coaxial cable or other transmission line, electrical components, and other electrical structures to the metal antenna structures on the foam carrier. The foam carrier may be formed from open cell or closed cell foam. The surface of the foam may be smoothed to facilitate formation of metal antenna structures.

    Abstract translation: 电子设备可以包括射频收发器电路和天线结构。 天线结构可以包括介电载体，例如泡沫载体。 泡沫载体可以由能够承受高温的材料形成。 通过用激光选择性地激活粉末涂层上的区域并镀覆激光激活区域，可以在泡沫载体上形成用于天线的金属迹线。 用于天线的金属也可以通过将诸如柔性印刷电路层和金属箔层的层附着到泡沫载体上而形成。 焊料可用于将同轴电缆或其它传输线，电气部件和其他电气结构连接到泡沫载体上的金属天线结构。 泡沫载体可以由开孔或闭孔泡沫形成。 泡沫的表面可以被平滑以便于形成金属天线结构。

    Electronic device with antenna
    10.
    发明授权
    Electronic device with antenna 有权

    公开(公告)号：US10141631B2

    公开(公告)日：2018-11-27

    申请号：US14966446

    申请日：2015-12-11

    Applicant: Apple Inc.

    Inventor： Francesco Merli ,  Yi Jiang ,  Boon W. Shiu ,  Carlo Di Nallo ,  Javier Gomez Tagle ,  Mattia Pascolini

    IPC: H01Q1/22 ,  H01Q9/04 ,  H04R1/02 ,  H01Q1/24 ,  H01Q1/44 ,  H01Q9/42

    Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include an antenna. The electronic device may have a housing in which control circuitry and radio-frequency transceiver circuitry is mounted. The transceiver circuitry may be used to transmit and receive radio-frequency signals with the antenna. The housing may have a housing wall with a locally thinned portion aligned with the antenna. The antenna may have a sheet metal layer attached to a plastic cavity with a layer of adhesive. Recesses in a printed circuit may receive prongs formed from a sheet metal layer. The plastic carrier may have cavities separated by ribs. The sheet metal layer may form a planar inverted-F antenna resonating element, a ground plane, a return path between the resonating element and ground plane, and a feed path that extends along one of the ribs and into an opening in the printed circuit.

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