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公开(公告)号:US11366332B2
公开(公告)日:2022-06-21
申请号:US16702639
申请日:2019-12-04
Applicant: Apple Inc.
Inventor: Christopher Hu , Ahmed Rashid , Colleen F. Mischke , Peng Chen , Talisa Mohammad Nejad , Xiao Hu , Yazan Z. Alnahhas
Abstract: An optical module includes an enclosure and an optical output assembly mounted on the enclosure. An emitter mounted in the enclosure is configured to emit a beam of light toward the optical output assembly. A connector, which includes two conductive layers separated by a dielectric layer, has a first side connected to the enclosure and a second side connected to the optical output assembly. An electrical trace disposed on the enclosure is connected to the first side of the connector so as to define a test circuit having a capacitance. Control circuitry is coupled to sense the capacitance of the test circuit, and configured to inhibit operation of the emitter upon sensing a change in the capacitance that exceeds a predetermined threshold.
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公开(公告)号:US20200292839A1
公开(公告)日:2020-09-17
申请号:US16702639
申请日:2019-12-04
Applicant: Apple Inc.
Inventor: Christopher Hu , Ahmed Rashid , Colleen F. Mischke , Peng Chen , Talisa Mohammad Nejad , Xiao Hu , Yazan Z. Alnahhas
Abstract: An optical module includes an enclosure and an optical output assembly mounted on the enclosure. An emitter mounted in the enclosure is configured to emit a beam of light toward the optical output assembly. A connector, which includes two conductive layers separated by a dielectric layer, has a first side connected to the enclosure and a second side connected to the optical output assembly. An electrical trace disposed on the enclosure is connected to the first side of the connector so as to define a test circuit having a capacitance. Control circuitry is coupled to sense the capacitance of the test circuit, and configured to inhibit operation of the emitter upon sensing a change in the capacitance that exceeds a predetermined threshold.
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公开(公告)号:US20210175180A1
公开(公告)日:2021-06-10
申请号:US16703911
申请日:2019-12-05
Applicant: Apple Inc.
Inventor: Colleen F. Mischke , Kayo Yanagisawa , Yazan Z. Alnahhas
IPC: H01L23/552 , H01L33/48 , H01L33/58 , H01L25/16
Abstract: An electronic module includes a circuit substrate including conductive pads interconnected by traces, including a ground pad for connection to an electrical ground. One or more electronic components are mounted on the circuit substrate. A housing including a dielectric material is mounted on the circuit substrate so as to cover the one or more electronic components. A metal lead, which has first and second ends, is embedded in the dielectric material such that the first end contacts the ground pad on the circuit substrate when the housing is mounted on the circuit substrate, and the second end is exposed at an outer surface of the dielectric material. A conductive coating is disposed over the outer surface of the housing in galvanic contact with the exposed second end of the metal lead.
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公开(公告)号:US20210007248A1
公开(公告)日:2021-01-07
申请号:US16502059
申请日:2019-07-03
Applicant: APPLE INC.
Inventor: Lidu Huang , Alaa Al-okaily , Anuranjini Pragada , Colleen F. Mischke , Derek J. Iredale , Michael R. Monson , Nagarajan Kalyanasundaram , Peng Chen , Pierre P. Souloumiac
Abstract: An electronic module includes an operational subunit, having upper, lower and lateral surfaces, and including one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation. A heat sink is disposed in proximity to the lower surface of the operational subunit. A heat spreader, including a continuous sheet of a heat-conducting material, is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit.
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公开(公告)号:US11056441B2
公开(公告)日:2021-07-06
申请号:US16703911
申请日:2019-12-05
Applicant: Apple Inc.
Inventor: Colleen F. Mischke , Kayo Yanagisawa , Yazan Z. Alnahhas
IPC: H01L23/552 , H01L33/48 , H01L25/16 , H01L33/58
Abstract: An electronic module includes a circuit substrate including conductive pads interconnected by traces, including a ground pad for connection to an electrical ground. One or more electronic components are mounted on the circuit substrate. A housing including a dielectric material is mounted on the circuit substrate so as to cover the one or more electronic components. A metal lead, which has first and second ends, is embedded in the dielectric material such that the first end contacts the ground pad on the circuit substrate when the housing is mounted on the circuit substrate, and the second end is exposed at an outer surface of the dielectric material. A conductive coating is disposed over the outer surface of the housing in galvanic contact with the exposed second end of the metal lead.
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公开(公告)号:US20210080546A1
公开(公告)日:2021-03-18
申请号:US16574129
申请日:2019-09-18
Applicant: Apple Inc.
Inventor: Eamon H. O'Connor , Gregory A. Cohoon , Calvin K. Wong , Colleen F. Mischke
Abstract: An optical device includes a substrate and an optical transmitter, which is mounted on the substrate and includes an optical emitter, which is configured to emit a beam of optical radiation, and a transmission lens assembly, which is configured to direct the beam along a transmit axis toward a target. An optical receiver is mounted on the substrate alongside the optical transmitter and includes an optical sensor and an objective lens assembly, which is configured to focus the optical radiation that is reflected from the target along a receive axis onto the optical sensor. An optical baffle is disposed asymmetrically relative to the transmit axis and has an asymmetrical shape configured to block preferentially stray radiation emitted from the optical transmitter toward the receive axis.
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公开(公告)号:US10667341B1
公开(公告)日:2020-05-26
申请号:US16554651
申请日:2019-08-29
Applicant: Apple Inc.
Inventor: Moshe Kriman , Adar Magen , Arun Kumar Nallani Chakravartula , Zhenbin Ge , Gregory A. Cohoon , Eamon H. O'Connor , Calvin K. Wong , Colleen F. Mischke , Christopher Hu , Yazan Z. Alnahhas
Abstract: An optical module includes a diffractive optical element (DOE) with a transparent conductive trace disposed over a surface of the DOE. An emitter is configured to direct a beam of optical radiation through the DOE. Control circuitry is coupled to measure a resistance of the transparent conductive trace and to control operation of the emitter responsively to the resistance.
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