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公开(公告)号：US09812401B2
公开(公告)日：2017-11-07
申请号：US15246481
申请日：2016-08-24
Applicant: Apple Inc.
Inventor： Anne M. Mason , Peter J. Johnston , Christine A. Laliberte , Dominic P. McCarthy , Shawn X. Arnold , Souvik Mukherjee
CPC classification number: H01L23/5386 , H01C7/00 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H01L24/17 , H01L25/18 , H01L2224/13147 , H01L2224/16227 , H01L2924/1434 , H01L2924/19043 , H05K1/113 , H05K1/167 , H05K1/181 , H05K3/3436 , H05K3/4076 , H05K2201/096 , H05K2201/10159 , H05K2201/10378 , H05K2201/10734 , Y02P70/613
Abstract: A routing apparatus includes a PCB having first and second arrays of contact pads, an interposer having third, fourth and fifth arrays of contact pads, the third and fourth arrays of contact pads being disposed on opposing surfaces of the interposer, the third array of contact pads being electrically connected to the first array of contact pads. First and second integrated circuits are respectively mounted on the second and fourth arrays of contact pads. The interposer includes a first group of conductive traces insulated from one another, a first array of conductive vias extending perpendicularly to the first group of conductive traces, the first array of conductive vias including through-vias connecting the third array of contact pads to corresponding contact pads in the fourth array of contact pads. The interposer further including isolation resistors embedded within the first array of conductive vias, each isolation resistor being configured to produce a copy of a signal flowing through the conductive via that is coupled to one end of the isolation resistor on the conductive trace that is coupled to an opposite end of the isolation resistor.
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Patent Agency Ranking
公开(公告)号：US20170265304A1
公开(公告)日：2017-09-14
申请号：US15068474
申请日：2016-03-11
Applicant: Apple Inc.
Inventor： Anne M. Mason , Peter J. Johnston , Christine A. Laliberte , Dominic P. McCarthy , Shawn X. Arnold , Souvik Mukherjee
CPC classification number: H01L23/5386 , H01C7/00 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H01L24/17 , H01L25/18 , H01L2224/13147 , H01L2224/16227 , H01L2924/1434 , H01L2924/19043 , H05K1/113 , H05K1/167 , H05K1/181 , H05K3/3436 , H05K3/4076 , H05K2201/096 , H05K2201/10159 , H05K2201/10378 , H05K2201/10734 , Y02P70/613
Abstract: A circuit board includes conductive traces being sandwiched by an upper insulating layer and a lower insulating layer, a first array of conductive vias extending perpendicularly to the conductive traces, the vias in the first array of conductive vias being arranged such that any two adjacent vias in a row of vias extending along any given dimension in the first array of conductive vias are equally spaced from each other, and isolation resistors embedded within the first array of conductive vias such that each isolation resistor is disposed between at least two adjacent vias in the first array of conductive vias, each isolation resistor being disposed closer to the conductive via to which the isolation resistor is coupled than all other conductive vias surrounding the isolation resistor.
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公开(公告)号：US09763329B1
公开(公告)日：2017-09-12
申请号：US15068474
申请日：2016-03-11
Applicant: Apple Inc.
Inventor： Anne M. Mason , Peter J. Johnston , Christine A. Laliberte , Dominic P. McCarthy , Shawn X. Arnold , Souvik Mukherjee
CPC classification number: H01L23/5386 , H01C7/00 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H01L24/17 , H01L25/18 , H01L2224/13147 , H01L2224/16227 , H01L2924/1434 , H01L2924/19043 , H05K1/113 , H05K1/167 , H05K1/181 , H05K3/3436 , H05K3/4076 , H05K2201/096 , H05K2201/10159 , H05K2201/10378 , H05K2201/10734 , Y02P70/613
Abstract: A circuit board includes conductive traces being sandwiched by an upper insulating layer and a lower insulating layer, a first array of conductive vias extending perpendicularly to the conductive traces, the vias in the first array of conductive vias being arranged such that any two adjacent vias in a row of vias extending along any given dimension in the first array of conductive vias are equally spaced from each other, and isolation resistors embedded within the first array of conductive vias such that each isolation resistor is disposed between at least two adjacent vias in the first array of conductive vias, each isolation resistor being disposed closer to the conductive via to which the isolation resistor is coupled than all other conductive vias surrounding the isolation resistor.
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公开(公告)号：US20160261128A1
公开(公告)日：2016-09-08
申请号：US14987718
申请日：2016-01-04
Applicant: APPLE INC.
Inventor： Peter J. Johnston , Neal V. Cecil , Robert McKeever, II , William O. Ferry , Steven P. Hier , Clinton Bauder , Aaron J. Barber , Reese A. Schreiber
IPC: H02J7/00
CPC classification number: H02J7/0036 , H02J7/0052 , H02J7/0068 , H02J2007/0062
Abstract: Circuits, methods, and apparatus where a dongle or adapter may provide continuous power in the event of a disconnection of a charging device. One example may provide a dongle having a charge storage circuit. A charging device connected to the dongle may be used to power an accessory also connected to the dongle. Following a disconnection of the charging device, the dongle may use the charger storage circuit to provide power to the accessory for a first duration. After the first duration, a host device also connected to the dongle may provide power to the accessory via the dongle.
Abstract translation: 电源，方法和设备，其中加密狗或适配器可能在充电设备断开的情况下提供连续的电力。 一个示例可以提供具有电荷存储电路的加密狗。 连接到加密狗的充电装置可以用于为也连接到加密狗的附件供电。 在充电装置断开之后，加密狗可以使用充电器存储电路为附件提供第一持续时间的电力。 在第一个持续时间之后，也连接到加密狗的主机设备可以经由加密狗向附件提供电力。
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公开(公告)号：US10236697B2
公开(公告)日：2019-03-19
申请号：US14987718
申请日：2016-01-04
Applicant: APPLE INC.
Inventor： Peter J. Johnston , Neal V. Cecil , Robert Il McKeever , William O. Ferry , Steven P. Hier , Clinton Bauder , Aaron J. Barber , Reese A. Schreiber
Abstract: Circuits, methods, and apparatus where a dongle or adapter may provide continuous power in the event of a disconnection of a charging device. One example may provide a dongle having a charge storage circuit. A charging device connected to the dongle may be used to power an accessory also connected to the dongle. Following a disconnection of the charging device, the dongle may use the charger storage circuit to provide power to the accessory for a first duration. After the first duration, a host device also connected to the dongle may provide power to the accessory via the dongle.
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公开(公告)号：US20170263561A1
公开(公告)日：2017-09-14
申请号：US15246481
申请日：2016-08-24
Applicant: Apple Inc.
Inventor： Anne M. Mason , Peter J. Johnston , Christine A. Laliberte , Dominic P. McCarthy , Shawn X. Arnold , Souvik Mukherjee
CPC classification number: H01L23/5386 , H01C7/00 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H01L24/17 , H01L25/18 , H01L2224/13147 , H01L2224/16227 , H01L2924/1434 , H01L2924/19043 , H05K1/113 , H05K1/167 , H05K1/181 , H05K3/3436 , H05K3/4076 , H05K2201/096 , H05K2201/10159 , H05K2201/10378 , H05K2201/10734 , Y02P70/613
Abstract: A routing apparatus includes a PCB having first and second arrays of contact pads, an interposer having third, fourth and fifth arrays of contact pads, the third and fourth arrays of contact pads being disposed on opposing surfaces of the interposer, the third array of contact pads being electrically connected to the first array of contact pads. First and second integrated circuits are respectively mounted on the second and fourth arrays of contact pads. The interposer includes a first group of conductive traces insulated from one another, a first array of conductive vias extending perpendicularly to the first group of conductive traces, the first array of conductive vias including through-vias connecting the third array of contact pads to corresponding contact pads in the fourth array of contact pads. The interposer further including isolation resistors embedded within the first array of conductive vias, each isolation resistor being configured to produce a copy of a signal flowing through the conductive via that is coupled to one end of the isolation resistor on the conductive trace that is coupled to an opposite end of the isolation resistor.
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