公开(公告)号：US20150070622A1

公开(公告)日：2015-03-12

申请号：US14293998

申请日：2014-06-02

Applicant: Apple Inc.

Inventor： Miguel C. CHRISTOPHY ,  Silvio GRESPAN ,  Richard Hung Minh DINH ,  John O. CEIDEBURG ,  Kingsuk BRAHMA

IPC: H05F3/04 ,  G06F1/18 ,  G02F1/1333

CPC classification number: G06F1/182 ,  G02F1/133308 ,  G02F2201/50 ,  G06F1/1656 ,  H05K9/0067

Abstract: An electrostatic discharge (ESD) blocking component is set forth for a computing device. The computing device can include a housing formed of non-conducting material and an overlaying display assembly supported by the housing. The display assembly can further include a plurality of display elements such as thin film transistors (TFTs) interconnected by corresponding metallic traces. The ESD block is used to block static charges associated with an ESD event so that essentially no ESD event related static charge is accumulated on the metallic traces thereby preventing ESD related damage to the plurality of TFTs.

Abstract translation: 为计算设备阐述了静电放电（ESD）阻挡部件。 计算设备可以包括由非导电材料形成的壳体和由壳体支撑的覆盖显示组件。 显示组件还可以包括多个显示元件，例如通过相应的金属迹线互连的薄膜晶体管（TFT）。 ESD块用于阻止与ESD事件相关的静电荷，使得基本上不会在金属迹线上积累ESD事件相关的静电荷，从而防止与多个TFT相关的ESD相关的损害。

公开(公告)号：US20140071417A1

公开(公告)日：2014-03-13

申请号：US13766393

申请日：2013-02-13

Applicant: APPLE INC.

Inventor： Silvio GRESPAN ,  Shih-Min HSU ,  Heng-Hsi WU ,  Kuo-Hua SUNG ,  Cyrus Y. LIU

IPC: B32B38/00 ,  G01B11/14 ,  G03F7/20 ,  G01N33/00

CPC classification number: B32B38/0008 ,  G01B11/14 ,  G01N33/00 ,  G03F7/70008 ,  G06F3/0412 ,  G06F2203/04103

Abstract: Methods and devices for using liquid optically clear adhesives (LOCAs) are described. A method for detecting uncured LOCA between a first substrate and a second substrate is described. In addition, an improved method for curing a laminated stack up having LOCA between a first substrate and a second substrate is described. The method includes a pre-curing method involving variable exposure of the LOCA. In addition, an improved light emitting diode (LED) unit assembly for exposing a laminated stack up to ultraviolet (UV) light during a pre-curing process is described. A method for testing the LED unit assembly prior to a pre-curing process is described.

Abstract translation: 描述了使用液体光学透明粘合剂（LOCA）的方法和装置。 描述了用于检测第一基板和第二基板之间的未固化LOCA的方法。 另外，描述了在第一基板和第二基板之间固化具有LOCA的叠层叠层的改进方法。 该方法包括涉及LOCA可变暴露的预固化方法。 另外，还描述了一种改进的发光二极管（LED）单元组件，用于在预固化过程中将层压叠层暴露于紫外（UV）光。 描述了在预固化过程之前测试LED单元组件的方法。

公开(公告)号：US20140321075A1

公开(公告)日：2014-10-30

申请号：US13869881

申请日：2013-04-24

Applicant: APPLE INC.

Inventor： Kuo-Hua SUNG ,  Silvio GRESPAN

IPC: H05K13/04 ,  H05K1/11

CPC classification number: H05K1/118 ,  H01R12/62 ,  H01R43/0249 ,  H05K1/117 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09481 ,  H05K2201/09572 ,  H05K2201/0969 ,  H05K2201/0979 ,  H05K2201/09854 ,  H05K2203/0126

Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.

Abstract translation: 所描述的实施例通常涉及电子设备，更具体地涉及用于在电子设备内的组件之间形成机械和电连接的方法。 在一个实施例中，诸如柔性电缆的互连部件附接到诸如印刷电路板的基板。 可以在互连部件中产生穿过位于互连部件的一端上的接合焊盘的多个孔。 然后可以将互连部件与衬底上的接合焊盘对准，并使互连部件上的接合焊盘背离衬底。 可以通过互连部件将导电化合物注入孔中，在接合焊盘之间形成机械和电连接。 在一些实施例中，可以使用粘合剂层来进一步加强互连部件和基底之间的结合。