公开(公告)号：US20040163946A1

公开(公告)日：2004-08-26

申请号：US10744904

申请日：2003-12-23

Applicant: APPLIED MATERIALS, INC.

Inventor： Shou-Sung Chang ,  Stan D. Tsai ,  Donald J.K. Olgado ,  Liang-Yuh Chen ,  Alain Duboust ,  Ralph M. Wadensweiler

IPC: C25D017/00

CPC classification number: B24B37/22 ,  B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/11 ,  B24B37/24 ,  B24B37/26 ,  B24B49/16 ,  B24B53/017 ,  C25D17/10 ,  H01L21/32125

Abstract: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.

Abstract translation: 提供了用于处理基板的垫组件的实施例。 焊盘组件包括处理层，其具有适于处理衬底的工作表面，耦合到处理层的下层并设置在处理层下方的电极，以及具有设置在处理层的工作表面下方和下方的上表面的电极 。 电极的上表面至少部分地暴露于工作表面，以在电极的上表面和工作表面之间提供电解质通路。

公开(公告)号：US20040121708A1

公开(公告)日：2004-06-24

申请号：US10727724

申请日：2003-12-03

Applicant: Applied Materials, Inc.

Inventor： Yongqi Hu ,  Stan D. Tsai ,  Yan Wang ,  Feng Q. Liu ,  Shou-Sung Chang ,  Liang-Yuh Chen

IPC: B24B007/19

CPC classification number: B24B37/26 ,  B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/042 ,  B24B37/046 ,  B24B37/22 ,  B24B37/24 ,  B24B49/16 ,  B24B53/017 ,  C25D17/14 ,  H01L21/32125

Abstract: Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.

Abstract translation: 提供了用于处理衬底的处理衬垫组件的实施例。 处理垫组件包括具有处理表面的上层和具有联接到上层的顶侧和与顶侧相对的底侧的电极。 通过上层形成第一组孔，用于将电极暴露于处理表面。 通过上层和电极形成至少一个孔。

公开(公告)号：US20030114087A1

公开(公告)日：2003-06-19

申请号：US10163796

申请日：2002-06-04

Applicant: Applied Materials, Inc.

Inventor： Alain Duboust ,  Shou-Sung Chang ,  Liang-Yuh Chen ,  Yan Wang ,  Siew Neo ,  Lizhong Sun ,  Feng Q. Liu

IPC: B24B001/00

CPC classification number: B24B37/046 ,  B23H5/08 ,  B24B37/042

Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a basin and a polishing head. A carrier is disposed in the basin and has a substrate supporting surface. A retaining ring is disposed on the carrier and at least partially circumscribes the substrate supporting surface. The polishing head is supported above the basin and includes a conductive polishing pad. Embodiments may further include a vent to allow gas to escape through the polishing head. Embodiments may further include an electrolyte supply that flows electrolyte into the polishing head and out through a permeable electrode and the conductive pad to the substrate. Embodiments may also be configured with a polishing head diameter smaller than the substrate supported by the carrier.

Abstract translation: 提供了一种用于抛光衬底表面的方法和装置。 一方面，用于抛光衬底的装置包括盆和抛光头。 载体布置在盆中并具有基底支撑表面。 保持环设置在载体上并且至少部分地限定基板支撑表面。 抛光头支撑在盆面上方，并包括导电抛光垫。 实施例还可包括通气孔，以允许气体通过抛光头逸出。 实施例还可以包括将电解质流入抛光头并通过可渗透电极流出并将导电垫流到基底的电解质供应。 实施例还可以被配置为具有小于由载体支撑的基板的抛光头直径。