公开(公告)号：US11300889B2

公开(公告)日：2022-04-12

申请号：US17267974

申请日：2019-07-03

Applicant: ASML NETHERLANDS B.V.

Inventor： Leon Paul Van Dijk ,  Richard Johannes Franciscus Van Haren ,  Subodh Singh ,  Ilya Malakhovsky ,  Ronald Henricus Johannes Otten ,  Amandev Singh

IPC: G03F7/20

Abstract: Methods and apparatuses for determining in-plane distortion (IPD) across a substrate having a plurality of patterned regions. A method includes obtaining intra-region data indicative of a local stress distribution across one of the plurality of patterned regions; determining, based on the intra-region data, inter-region data indicative of a global stress distribution across the substrate; and determining, based on the inter-region data, the IPD across the substrate.

公开(公告)号：US11226567B2

公开(公告)日：2022-01-18

申请号：US16638552

申请日：2018-08-08

Applicant: ASML NETHERLANDS B.V.

Inventor： Richard Johannes Franciscus Van Haren ,  Leon Paul Van Dijk ,  Ilya Malakhovsky ,  Ronald Henricus Johannes Otten ,  Mahdi Sadeghinia

IPC: G03F7/20 ,  G03F9/00

Abstract: Methods and associated apparatus for reconstructing a free-form geometry of a substrate, the method including: positioning the substrate on a substrate holder configured to retain the substrate under a retaining force that deforms the substrate from its free-form geometry; measuring a height map of the deformed substrate; and reconstructing the free-form geometry of the deformed substrate based on an expected deformation of the substrate by the retaining force and the measured height map.

公开(公告)号：US11300888B2

公开(公告)日：2022-04-12

申请号：US16485499

申请日：2018-02-07

Applicant: ASML NETHERLANDS B.V.

Inventor： Richard Johannes Franciscus Van Haren ,  Leon Paul Van Dijk ,  Ilya Malakhovsky ,  Ronald Henricus Johannes Otten

IPC: G03F7/20 ,  G03F9/00

Abstract: A method and control system for determining stress in a substrate. The method includes determining a measured position difference between a measured position of at least one first feature and a measured position of at least one second feature which have been applied on a substrate, and determining local stress in the substrate from the measured position difference.

公开(公告)号：US10192772B2

公开(公告)日：2019-01-29

申请号：US15766740

申请日：2016-09-08

Applicant: ASML NETHERLANDS B.V.

Inventor： Satish Achanta ,  Tiannan Guan ,  Raymond Wilhelmus Louis LaFarre ,  Ilya Malakhovsky ,  Bas Johannes Petrus Roset ,  Siegfried Alexander Tromp ,  Johannes Petrus Martinus Bernardus Vermeulen

IPC: G03F7/20 ,  H01L21/687 ,  H01L21/683 ,  G03F7/00

Abstract: A substrate table to support a substrate, the substrate table including a main body, burls extending from the main body and having first upper ends that define a support surface to support the substrate, and support pins having second upper ends. The support pins are movable between a retracted position and an extended position. The support pins are arranged to support the substrate in the extended position. The support pins are arranged to be switched to a first stiffness mode and a second stiffness mode. In the first stiffness mode, the support pins have a first stiffness in a direction parallel to the support surface. In the second stiffness mode, the support pins have a second stiffness in the direction parallel to the support surface. The first stiffness is different from the second stiffness.