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公开(公告)号：US20200315033A1
公开(公告)日：2020-10-01
申请号：US16367578
申请日：2019-03-28
发明人： Roland Wilfing
摘要： A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, at least one first electrically conductive track extending from a vertical level defined by one of the layer structures up to a first height, at least one second electrically conductive track extending from the vertical level defined by the one of the layer structures up to a second height being larger than the first height, and at least one further electrically insulating layer structure in which the at least one first electrically conductive track and the at least one second electrically conductive track are embedded.
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2.发明公开公开(公告)号：US20230411247A1
公开(公告)日：2023-12-21
申请号：US18460632
申请日：2023-09-04
发明人： Roland Wilfing
CPC分类号： H01L23/481 , H01L24/19 , H01L24/20 , H01L2224/2101 , H01L2224/214 , H01L2224/215 , H01L2224/19
摘要： A component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure. At least one of the at least one electrically insulating layer structure(s) has at least partly tapered through holes filled substantially completely with an electrically conductive filling. The at least one electrically conductive layer structure and the electrically conductive filling are made of the same material. Different ones of the through holes of one electrically insulating layer structure are tapering in opposite directions.
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公开(公告)号：US11784115B2
公开(公告)日：2023-10-10
申请号：US17444266
申请日：2021-08-02
发明人： Roland Wilfing
IPC分类号： H05K1/02 , H05K1/11 , H01L23/498 , H01L21/48
CPC分类号： H01L23/49822 , H01L21/4857 , H05K1/0271 , H05K1/11 , H05K1/0204 , H05K1/0206 , H05K2201/041 , H05K2201/06 , H05K2201/096 , H05K2201/09827
摘要： A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. At least one electrically insulating layer structure has at least partly tapering through holes filled substantially completely with an electrically conductive filling. The at least one electrically conductive layer structure and the electrically conductive filling are made of the same material. In addition, different ones of the through holes of one electrically insulating layer structure are tapering in opposite directions.
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公开(公告)号：US20230035496A1
公开(公告)日：2023-02-02
申请号：US17444266
申请日：2021-08-02
发明人： Roland Wilfing
IPC分类号： H01L23/498 , H01L21/48
摘要： A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. At least one electrically insulating layer structure has at least partly tapering through holes filled substantially completely with an electrically conductive filling. The at least one electrically conductive layer structure and the electrically conductive filling are made of the same material. In addition, different ones of the through holes of one electrically insulating layer structure are tapering in opposite directions.
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公开(公告)号：US10888002B2
公开(公告)日：2021-01-05
申请号：US16367578
申请日：2019-03-28
发明人： Roland Wilfing
摘要： A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, at least one first electrically conductive track extending from a vertical level defined by one of the layer structures up to a first height, at least one second electrically conductive track extending from the vertical level defined by the one of the layer structures up to a second height being larger than the first height, and at least one further electrically insulating layer structure in which the at least one first electrically conductive track and the at least one second electrically conductive track are embedded.
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