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公开(公告)号：US20050012928A1
公开(公告)日：2005-01-20
申请号：US10858587
申请日：2004-06-02
CPC分类号： G03F7/70633 , G01B11/26 , G01J3/2823
摘要： A method for measuring overlay in a sample includes obtaining an image of an overlay target that includes a series of grating stacks each having an upper and lower grating, each grating stack having a unique offset between its upper and lower grating. The image is obtained with a set of illumination and collection optics where the numerical aperture of the collection optics is larger than the numerical aperture of the illumination optics and with the numerical apertures of the illumination and collection optics are selected so that the unit cells of gratings are not resolved, the grating stacks are resolved and they appear to have a uniform color within the image of the overlay target.
摘要翻译： 用于测量样本中覆盖层的方法包括获得包括一系列具有上和下光栅的一系列光栅堆叠的覆盖目标的图像，每个光栅堆叠在其上和下光栅之间具有唯一的偏移。 利用一组照明和收集光学器件获得图像，其中收集光学器件的数值孔径大于照明光学器件的数值孔径，并且选择照明和收集光学器件的数值孔径，使得光栅的单元电池 没有解决，光栅堆栈被解决，并且它们在覆盖目标的图像内看起来具有均匀的颜色。
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公开(公告)号：US07230703B2
公开(公告)日：2007-06-12
申请号：US10858587
申请日：2004-06-02
IPC分类号： G01B11/00
CPC分类号： G03F7/70633 , G01B11/26 , G01J3/2823
摘要： A method for measuring overlay in a sample includes obtaining an image of an overlay target that includes a series of grating stacks each having an upper and lower grating, each grating stack having a unique offset between its upper and lower grating. The image is obtained with a set of illumination and collection optics where the numerical aperture of the collection optics is larger than the numerical aperture of the illumination optics and with the numerical apertures of the illumination and collection optics are selected so that the unit cells of gratings are not resolved, the grating stacks are resolved and they appear to have a uniform color within the image of the overlay target.
摘要翻译： 用于测量样本中覆盖层的方法包括获得包括一系列具有上和下光栅的一系列光栅堆叠的覆盖目标的图像，每个光栅堆叠在其上和下光栅之间具有唯一的偏移。 利用一组照明和收集光学器件获得图像，其中收集光学器件的数值孔径大于照明光学器件的数值孔径，并且选择照明和收集光学器件的数值孔径，使得光栅的单元电池 没有解决，光栅堆栈被解决，并且它们在覆盖目标的图像内看起来具有均匀的颜色。
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公开(公告)号：US07030018B2
公开(公告)日：2006-04-18
申请号：US10358101
申请日：2003-02-04
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
IPC分类号： H01L21/302
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.
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4.发明授权Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool 有权用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样本的损伤或抛光垫或工具的特性公开(公告)号：US08010222B2
公开(公告)日：2011-08-30
申请号：US12032112
申请日：2008-02-15
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
IPC分类号： G06F19/00
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.
摘要翻译： 提供了用于在抛光期间监测测量装置的参数的方法和系统，抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。 一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还包括确定输出信号是否在输出信号的范围之外。 超出范围的输出信号可能表示测量设备的参数失控。 在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。 另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。 该方法还包括从输出信号确定抛光垫的特性。
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5.发明申请公开(公告)号：US20060148383A1
公开(公告)日：2006-07-06
申请号：US11362044
申请日：2006-02-24
申请人： Kurt Lehman , Charles Chen , Ronald Allen , Robert Shinagawa , Anantha Sethuraman , Christopher Bevis , Thanassis Trikas , Haiguang Chen , Ching Meng
发明人： Kurt Lehman , Charles Chen , Ronald Allen , Robert Shinagawa , Anantha Sethuraman , Christopher Bevis , Thanassis Trikas , Haiguang Chen , Ching Meng
IPC分类号： B24B51/00
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Systems and methods for detecting a presence of blobs on a specimen are provided. One method may include scanning measurement spots across a specimen during polishing of the specimen. The method may also include determining if the blobs are present on the specimen at the measurement spots. Each of the blobs may include unwanted material disposed upon a contiguous portion of the measurement spots. In some instances, the blobs may include copper. In some embodiments, scanning the measurement spots may include measuring an optical property and/or an electrical property of the specimen at the measurement spots. Another embodiment includes dynamically determining a signal threshold distinguishing a presence of the blobs from an absence of the blobs. An additional embodiment includes determining an endpoint of polishing if, for example, blobs are not determined to be present on the specimen.
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6.发明授权Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool 有权用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样本的损坏或抛光垫或工具的特性公开(公告)号：US08831767B2
公开(公告)日：2014-09-09
申请号：US13219607
申请日：2011-08-27
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.
摘要翻译： 提供了用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。 一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还包括确定输出信号是否在输出信号的范围之外。 超出范围的输出信号可能表示测量设备的参数失控。 在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。 另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。 该方法还包括从输出信号确定抛光垫的特性。
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7.发明授权Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing 有权用于在抛光期间在样品上的测量点的相对或绝对位置产生特征的二维图的方法和系统公开(公告)号：US06935922B2
公开(公告)日：2005-08-30
申请号：US10358106
申请日：2003-02-04
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing are provided. One method includes scanning a specimen with a measurement device during polishing to generate output signals at measurement spots on the specimen. The method may also include determining a characteristic of polishing at the measurement spots from the output signals. In addition, the method may include determining relative or absolute locations of the measurement spots on the specimen. The method may further include generating a two-dimensional map of the characteristic at the relative or absolute locations of the measurement spots on the specimen. In some embodiments, the relative locations of the measurement spots may be determined from a representative scan path of the measurement device and an average spacing between starting points on individual scans.
摘要翻译： 提供了用于在抛光期间在样本上的测量点的相对或绝对位置处产生特征的二维图的方法和系统。 一种方法包括在抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还可以包括从输出信号确定测量点处的抛光特性。 此外，该方法可以包括确定样本上的测量点的相对或绝对位置。 该方法还可以包括在样本上的测量点的相对或绝对位置处生成特征的二维图。 在一些实施例中，测量点的相对位置可以从测量装置的代表性扫描路径和单个扫描上的起始点之间的平均间隔来确定。
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8.发明申请METHODS AND SYSTEMS FOR MONITORING A PARAMETER OF A MEASUREMENT DEVICE DURING POLISHING, DAMAGE TO A SPECIMEN DURING POLISHING, OR A CHARACTERISTIC OF A POLISHING PAD OR TOOL 有权用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样品的损害，或抛光抛光或工具的特性公开(公告)号：US20110313558A1
公开(公告)日：2011-12-22
申请号：US13219607
申请日：2011-08-27
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
IPC分类号： G06F19/00
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.
摘要翻译： 提供了用于在抛光期间监测测量装置的参数的方法和系统，抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。 一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还包括确定输出信号是否在输出信号的范围之外。 超出范围的输出信号可能表示测量设备的参数失控。 在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。 另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。 该方法还包括从输出信号确定抛光垫的特性。
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9.发明授权Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool 有权用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样本的损坏或抛光垫或工具的特性公开(公告)号：US07332438B2
公开(公告)日：2008-02-19
申请号：US11353899
申请日：2006-02-14
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
IPC分类号： H01L21/302
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.
摘要翻译： 提供了用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。 一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还包括确定输出信号是否在输出信号的范围之外。 超出范围的输出信号可能表示测量设备的参数失控。 在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。 另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。 该方法还包括从输出信号确定抛光垫的特性。
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10.发明授权Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad 失效窗口可配置为联接到处理工具或被布置在抛光垫的开口内公开(公告)号：US06866559B2
公开(公告)日：2005-03-15
申请号：US10358107
申请日：2003-02-04
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad are provided. One window includes a first portion and a second portion. The first portion includes a first material, and the second portion includes a second material different than the first. Another window includes a substantially transparent gel. In some instances, the gel includes a triblock copolymer and a plasticizing oil. An additional window includes an upper window, a housing, and a diaphragm. The housing may allow a fluid to flow into and out of a space between the housing and the diaphragm. In another embodiment, a window includes a layer of material coupled to lateral surfaces of the window. In some cases, the window may be disposed within an opening in a polishing pad, and movement of the window within the polishing pad may compress the layer of material.
摘要翻译： 提供了可配置为耦合到处理工具或设置在抛光垫的开口内的窗口。 一个窗口包括第一部分和第二部分。 第一部分包括第一材料，第二部分包括不同于第一材料的第二材料。 另一窗口包括基本上透明的凝胶。 在一些情况下，凝胶包括三嵌段共聚物和增塑油。 附加的窗口包括上窗，外壳和隔膜。 壳体可以允许流体流入和流出壳体和隔膜之间的空间。 在另一个实施例中，窗口包括耦合到窗口的侧表面的材料层。 在一些情况下，窗口可以设置在抛光垫的开口内，并且窗口在抛光垫内的运动可以压缩材料层。
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