公开(公告)号：US11960435B2

公开(公告)日：2024-04-16

申请号：US17692147

申请日：2022-03-10

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Pradeep Jayaraman ,  Dean Gonzales ,  Gerald R. Talbot ,  Ramon A. Mangaser ,  Michael J. Tresidder ,  Prasant Kumar Vallur ,  Srikanth Reddy Gruddanti ,  Krishna Reddy Mudimela Venkata ,  David H. McIntyre

IPC: G06F13/42 ,  H01L25/065

CPC classification number: G06F13/4291 ,  G06F13/4286 ,  H01L25/0652

Abstract: A semiconductor package for skew matching in a die-to-die interface, including: a first die; a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is substantially equidistant to a corresponding connection point of a second plurality of connection points of the second die; and a plurality of connection paths of a substantially same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.

公开(公告)号：US20190205492A1

公开(公告)日：2019-07-04

申请号：US15859156

申请日：2017-12-29

Applicant: Advanced Micro Devices, Inc.

Inventor： David A. Roberts ,  Dean Gonzales

IPC: G06F17/50

Abstract: An electronic device includes a first integrated circuit chip including a processing functional block, and a second integrated circuit chip including an input-output (IO) functional block. The IO functional block performs one or more IO processing operations on behalf of the processing functional block in the first integrated circuit chip. The first integrated circuit chip lacks at least some elements of the IO functional block, so that the processing functional block is unable to perform corresponding IO operations without the IO functional block.

公开(公告)号：US10515173B2

公开(公告)日：2019-12-24

申请号：US15859156

申请日：2017-12-29

Applicant: Advanced Micro Devices, Inc.

Inventor： David A. Roberts ,  Dean Gonzales

IPC: G06F17/50 ,  H01L25/00 ,  G06F9/38 ,  G06F12/10 ,  H01L25/065 ,  G06F12/1081 ,  H01L23/60

Abstract: An electronic device includes a first integrated circuit chip including a processing functional block, and a second integrated circuit chip including an input-output (IO) functional block. The IO functional block performs one or more IO processing operations on behalf of the processing functional block in the first integrated circuit chip. The first integrated circuit chip lacks at least some elements of the IO functional block, so that the processing functional block is unable to perform corresponding IO operations without the IO functional block.