公开(公告)号：US09960137B1

公开(公告)日：2018-05-01

申请号：US15340803

申请日：2016-11-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Chin Huang ,  Yung I. Yeh ,  Che-Ming Hsu

IPC: H01L23/48 ,  H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/11 ,  H01L2224/11462 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13026 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14051 ,  H01L2224/16221 ,  H01L2224/16238 ,  H01L2924/014 ,  H01L2924/3511

Abstract: A semiconductor device package ready for assembly includes: a semiconductor substrate; a first under-bump-metallurgy (UBM) layer disposed on the semiconductor substrate; a first conductive pillar disposed on the first UBM layer; and a second conductive pillar disposed on the first conductive pillar. A material of the first conductive pillar is different from a material of the second conductive pillar, and the material of the second conductive pillar includes an antioxidant.