公开(公告)号：US20230187374A1

公开(公告)日：2023-06-15

申请号：US17548333

申请日：2021-12-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hui-Ping JIAN ,  Ming-Hung CHEN ,  Jia-Feng HO

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/13 ,  H01L21/56 ,  H01Q1/22

CPC classification number: H01L23/552 ,  H01L23/49838 ,  H01L23/13 ,  H01L21/561 ,  H01Q1/2283 ,  H01L23/49822 ,  H01L23/3121

Abstract: An electronic device is disclosed. The electronic device includes a carrier having a first surface and a first lateral surface, an antenna adjacent to the first surface of the carrier, and a shielding layer covering a portion of the first lateral surface of the carrier. The shielding layer is configured to allow a gain of the antenna to be greater than 20 dB.

公开(公告)号：US20210358859A1

公开(公告)日：2021-11-18

申请号：US16874524

申请日：2020-05-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Hui-Ping JIAN ,  Wei-Zhen QIU

IPC: H01L23/552

Abstract: The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers.

公开(公告)号：US20240126327A1

公开(公告)日：2024-04-18

申请号：US17966700

申请日：2022-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chao Wei LIU ,  Wei-Hao CHANG ,  Yung-I YEH ,  Jen-Chieh KAO ,  Tun-Ching PI ,  Ming-Hung CHEN ,  Hui-Ping JIAN ,  Shang-Lin WU

IPC: G06F1/16

CPC classification number: G06F1/163 ,  G06F1/1632

Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.