公开(公告)号：US20230274998A1

公开(公告)日：2023-08-31

申请号：US17681695

申请日：2022-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-Chih PAN ,  Hung-Chun KUO

IPC: H01L23/367 ,  H01L23/538 ,  H01L25/065 ,  H01L25/18 ,  H01L23/495

CPC classification number: H01L23/367 ,  H01L23/5384 ,  H01L25/0657 ,  H01L25/18 ,  H01L23/49575 ,  H01L23/49568

Abstract: An electronic device is disclosed. The electronic device includes an active component, a power regulating component disposed on the active component, and a patterned conductive element disposed between the active component and the power regulating component. The patterned conductive element is configured to provide one or more heat dissipation paths for the active component and to provide a power path between the active component and the power regulating component.

公开(公告)号：US20180131094A1

公开(公告)日：2018-05-10

申请号：US15348854

申请日：2016-11-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu HO ,  Chen-Chao WANG ,  Chun-Yen TING ,  Ming-Fong JHONG ,  Po-Chih PAN

IPC: H01Q9/04 ,  H01L23/66 ,  H01L23/538 ,  H01L25/065 ,  H01L23/552

CPC classification number: H01Q9/045 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/17 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2924/01028 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1421 ,  H01L2924/3025 ,  H01Q9/0457 ,  H01Q13/10 ,  H01Q19/30 ,  H01Q21/28

Abstract: Various embodiments of the present disclosure relate to a semiconductor device package including a carrier, an electrical component, an antenna, a conductive pad and a conductive line. The carrier includes a top surface. The electrical component is disposed over the top surface of the carrier. The antenna is disposed over the top surface of the carrier and spaced away from the electrical component. The conductive pad is disposed over the top surface of the carrier and beneath the antenna, wherein the conductive pad includes a resonant structure. The conductive line is electrically connected to the electrical component and extends within the carrier. A part of the conductive line is beneath the antenna and the resonant structure of the conductive pad.

公开(公告)号：US20250054829A1

公开(公告)日：2025-02-13

申请号：US18929490

申请日：2024-10-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-Chih PAN ,  Hung-Chun KUO

IPC: H01L23/367 ,  H01L23/495 ,  H01L23/538 ,  H01L25/065 ,  H01L25/18

Abstract: An electronic device is disclosed. The electronic device includes an active component, a power regulating component disposed on the active component, and a patterned conductive element disposed between the active component and the power regulating component. The patterned conductive element is configured to provide one or more heat dissipation paths for the active component and to provide a power path between the active component and the power regulating component.