公开(公告)号：US11424212B2

公开(公告)日：2022-08-23

申请号：US16514966

申请日：2019-07-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Wei Chang ,  Shang-Wei Yeh ,  Chung-Hsi Wu ,  Min Lung Huang

IPC: H01L23/00 ,  H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L25/11

Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.

公开(公告)号：US12040312B2

公开(公告)日：2024-07-16

申请号：US17893037

申请日：2022-08-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien-Wei Chang ,  Shang-Wei Yeh ,  Chung-Hsi Wu ,  Min Lung Huang

IPC: H01L25/065 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L25/04 ,  H01L25/07 ,  H01L25/075 ,  H01L25/11 ,  H01L25/16

CPC classification number: H01L25/0652 ,  H01L21/566 ,  H01L21/76871 ,  H01L23/3107 ,  H01L23/3192 ,  H01L24/09 ,  H01L24/49 ,  H01L24/85 ,  H01L25/071 ,  H01L25/112 ,  H01L25/042 ,  H01L25/043 ,  H01L25/0756 ,  H01L25/162 ,  H01L2224/02371

Abstract: A semiconductor package structure includes a conductive structure, at least one semiconductor element, an encapsulant, a redistribution structure and a plurality of bonding wires. The semiconductor element is disposed on and electrically connected to the conductive structure. The encapsulant is disposed on the conductive structure to cover the semiconductor element. The redistribution structure is disposed on the encapsulant, and includes a redistribution layer. The bonding wires electrically connect the redistribution structure and the conductive structure.