公开(公告)号：US11784296B2

公开(公告)日：2023-10-10

申请号：US17564065

申请日：2021-12-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi Wu ,  Lu-Ming Lai ,  Yu-Ying Lee ,  Yung-Yi Chang

IPC: H01L33/62 ,  H01L33/48 ,  B81C1/00 ,  B81B7/00 ,  H01L33/60

CPC classification number: H01L33/62 ,  B81C1/00269 ,  H01L33/483 ,  B81B7/007 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2933/0066 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

公开(公告)号：US10508935B2

公开(公告)日：2019-12-17

申请号：US14884065

申请日：2015-10-15

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Yung-Yi Chang ,  Ying-Chung Chen

IPC: G01D5/34

Abstract: The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the surface of the carrier. The molding compound encapsulates the light source and the light detector, and includes at least one guiding structure. The lid is disposed between the light source and the light detector, and surrounds the light source and the light detector.

公开(公告)号：US20220123192A1

公开(公告)日：2022-04-21

申请号：US17564065

申请日：2021-12-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi Wu ,  Lu-Ming Lai ,  Yu-Ying Lee ,  Yung-Yi Chang

IPC: H01L33/62 ,  H01L33/48 ,  B81C1/00

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

公开(公告)号：US10665765B2

公开(公告)日：2020-05-26

申请号：US15860567

申请日：2018-01-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi Wu ,  Lu-Ming Lai ,  Yu-Ying Lee ,  Yung-Yi Chang

IPC: H01L33/62 ,  H01L33/48 ,  B81C1/00 ,  B81B7/00 ,  H01L33/60

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

公开(公告)号：US11211536B2

公开(公告)日：2021-12-28

申请号：US16862447

申请日：2020-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi Wu ,  Lu-Ming Lai ,  Yu-Ying Lee ,  Yung-Yi Chang

IPC: H01L33/62 ,  H01L33/48 ,  B81C1/00 ,  B81B7/00 ,  H01L33/60

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

公开(公告)号：US09881845B1

公开(公告)日：2018-01-30

申请号：US15291971

申请日：2016-10-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yung-Yi Chang ,  Hsun-Wei Chan ,  Ching-Han Huang

IPC: H01L27/14 ,  H01L23/055 ,  G01N27/12 ,  G01N33/00

CPC classification number: H01L23/055 ,  G01N27/12 ,  G01N27/125 ,  G01N33/0011 ,  G01N33/0027

Abstract: An electronic device includes a transducer including a sensing area and a covering structure that covers the transducer. The covering structure includes a shelter portion and defines at least one aperture. The shelter portion covers the sensing area. The aperture includes a first curved surface and a second curved surface farther away from the sensing area than the first curved surface, and a first center of a first curvature of the first curved surface is at a different location than a second center of a second curvature of the second curved surface.