公开(公告)号：US20190157535A1

公开(公告)日：2019-05-23

申请号：US16257441

申请日：2019-01-25

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Pritha Choudhury ,  Siuli Sarkar ,  Ranjit Pandher ,  Nicholas G. Herrick ,  Amit Patel ,  Ravindra M. Bhatkal ,  Bawa Singh

IPC: H01L33/62 ,  B23K1/005 ,  B23K1/002 ,  H01L23/00 ,  C22C13/02 ,  B23K35/26 ,  B23K1/00 ,  B23K1/08

Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

公开(公告)号：US11411150B2

公开(公告)日：2022-08-09

申请号：US16257441

申请日：2019-01-25

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Pritha Choudhury ,  Siuli Sarkar ,  Ranjit Pandher ,  Nicholas G Herrick ,  Amit Patel ,  Ravindra M Bhatkal ,  Bawa Singh

IPC: B23K35/26 ,  C22C13/02 ,  H01L33/62 ,  H01L23/00 ,  B23K1/00 ,  B23K1/002 ,  B23K1/005 ,  B23K1/08 ,  H01L33/64

Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

公开(公告)号：US20180102464A1

公开(公告)日：2018-04-12

申请号：US15286759

申请日：2016-10-06

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Pritha Choudhury ,  Siuli Sarkar ,  Ranjit Pandher ,  Nicholas G. Herrick ,  Amit Patel ,  Ravindra M Bhatkal ,  Bawa Singh

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/64 ,  B23K1/00 ,  B23K1/08 ,  B23K1/002 ,  B23K1/005 ,  B23K35/26 ,  C22C13/02

CPC classification number: H01L33/62 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/085 ,  B23K35/262 ,  C22C13/02 ,  H01L24/13 ,  H01L24/29 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/13211 ,  H01L2224/13313 ,  H01L2224/1332 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/29211 ,  H01L2224/29313 ,  H01L2224/2932 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/20106 ,  H01L2924/351 ,  H01L2933/0066

Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.