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公开(公告)号：US20250112371A1
公开(公告)日：2025-04-03
申请号：US18477868
申请日：2023-09-29
Applicant: Apple Inc.
Inventor： Behnam Ghassemiparvin , Jingni Zhong , Ming Chen , Bhaskara R Rupakula , Yiren Wang , Han Wang , Yuan Tao , Victor C Lee , Salih Yarga , Erdinc Irci , Jennifer M Edwards , Hao Xu , Hongfei Hu , Carlo Di Nallo , Mattia Pascolini
Abstract: An electronic device may be provided with an antenna module having a substrate. An antenna may be disposed on the substrate. The antenna may have a directly fed patch and parasitic patches. The antenna may be fed by a feed via. The parasitic patches may include a first layer of parasitic patches separated by a gap overlapping the directly fed patch. The parasitic patches may include an additional parasitic patch formed in a second layer. The additional parasitic patch may overlap the gap. A floating ground via may couple a center of the additional parasitic patch and a center of the directly fed patch to a landing pad in a ground layer. The landing pad may short the via to the ground layer at the radiating frequency of the antenna. The landing pad may be electrically floating at DC frequencies.
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公开(公告)号：US20250087869A1
公开(公告)日：2025-03-13
申请号：US18465014
申请日：2023-09-11
Applicant: Apple Inc.
Inventor： Ming Chen , Enrique Ayala Vazquez , Joel Ravi , Woonyong Bae , Laura M Burke , Yuancheng Xu , Bhaskara R Rupakula , Haozhan Tian , Salih Yarga , Erdinc Irci , Tiejun Yu , Seyed Mohammad Amjadi , Ahmed Ali Abdelhaliem Nafe , Hongfei Hu , Carlo Di Nallo , Mattia Pascolini
Abstract: An electronic device may be provided with sidewalls and a conductive plate. A segment of the sidewalls may form a radiating arm of an antenna. A display may be mounted to the sidewalls. The display may include a conductive frame and a flexible printed circuit. The flexible circuit may have a bend. Conductive foam may short a conductive trace on the flexible circuit to the conductive frame near the bend. Low injection pressure overmolding (LIPO) may be molded over the flexible circuit, the foam, and the frame. A conductive spring may short the frame to the conductive plate. The spring may include a wider and/or thinner portion that optionally includes one or more notches for reducing its inductance. The conductive plate, the spring, the frame, the foam, and the conductive trace may form part of the antenna ground for the antenna.
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公开(公告)号：US20250087868A1
公开(公告)日：2025-03-13
申请号：US18464969
申请日：2023-09-11
Applicant: Apple Inc.
Inventor： Alden T Rush , Salih Yarga , Joel Ravi , Woonyong Bae , Laura M Burke , Bhaskara R Rupakula , Haozhan Tian , Erdinc Irci , Hongfei Hu , Carlo Di Nallo
Abstract: An electronic device may be provided with a housing having sidewalls, a dielectric cover, and a conductive plate. A display may be mounted to the sidewalls opposite the dielectric cover. A logic board may be interposed between the display and the plate. The device may include a phased antenna array on a first module and an ultra-wideband (UWB) on a second module. The first and second modules may be surface-mounted to the main body of a flexible printed circuit between the plate and the dielectric cover. The UWB antenna and the array may convey radio-frequency signals through the dielectric cover. The flexible printed circuit may have a tail that carries the transmission lines for the UWB antenna and the array. The tail may be folded through a hole in the mid-chassis and coupled to a radio-frequency connector on the logic board.
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公开(公告)号：US20240079761A1
公开(公告)日：2024-03-07
申请号：US18458835
申请日：2023-08-30
Applicant: Apple Inc.
Inventor： Jingni Zhong , Ming Chen , Han Wang , Alden T Rush , Behnam Ghassemiparvin , Bhaskara R Rupakula , Yiren Wang , Yuan Tao , Hao Xu , Jennifer M Edwards , Hongfei Hu , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/48 , H01Q9/0407
Abstract: An electronic device may be provided with a flexible printed circuit and a rigid printed circuit mounted to the flexible printed circuit using a board-to-board (B2B) connector. The flexible printed circuit may include signal conductors coupled to one or more antennas on the rigid printed circuit through the B2B connector. A given one of the signal conductors may include a phase shifter segment on the flexible printed circuit and/or a thick impedance matching segment on the rigid printed circuit that help to form a smooth impedance transition from the flexible printed circuit to the rigid printed circuit and the antenna(s). The B2B connector may include signal contacts interleaved with a ground contacts. The B2B connector may include ground bars laterally surrounding the signal and ground contacts to maximize the strength of mechanical coupling between the flexible printed circuit and the rigid printed circuit.
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