公开(公告)号：US20030019741A1

公开(公告)日：2003-01-30

申请号：US09912578

申请日：2001-07-24

Applicant: Applied Materials, Inc.

Inventor： Arnold V. Kholodenko ,  Yan Rozenzon

IPC: C25D017/00 ,  C25D017/04 ,  B05C003/00

CPC classification number: C25D7/12 ,  C25D17/004 ,  C25D17/06

Abstract: Apparatus for securing a substrate in an electrochemical deposition system are provided. In one aspect, an apparatus is provided for securing a substrate in an electrochemical deposition system having a contact ring for contacting a plating surface of the substrate, a thrust plate having an annular shoulder at least partially formed therein, the thrust plate adapted to move axially relative to the contact surface, and a flexible seal disposed on the thrust plate comprising a base portion for attaching to the annular shoulder of the thrust plate and a body portion extending outwardly from the base portion and defining a sealing surface for engaging a back surface of the substrate. The apparatus may be disposed in an electrochemical deposition system.

Abstract translation: 提供了用于将基板固定在电化学沉积系统中的装置。 一方面，提供了一种用于将基板固定在电化学沉积系统中的装置，该电化学沉积系统具有用于接触基板的电镀表面的接触环，具有至少部分地形成在其中的环形肩部的推力板，该推力板适于轴向移动 以及设置在推力板上的柔性密封件，包括用于附接到推力板的环形肩部的基部和从基部向外延伸的主体部分，并且限定用于接合 底物。 该设备可以设置在电化学沉积系统中。

公开(公告)号：US20030129835A1

公开(公告)日：2003-07-10

申请号：US10041838

申请日：2002-01-07

Applicant: Applied Materials Inc.

Inventor： Arnold V. Kholodenko ,  Peter Porshnev

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H01J37/32862 ,  B08B7/0035 ,  C23C14/564 ,  C23C16/4405 ,  H01J37/321

Abstract: An electro-negative cleaning or etchant gas, such as fluorine, that was ionized from a stable supply gas such as NH3 in a secondary chamber and recombined in the primary chamber, is re-ionized within the primary chamber by electron attachment by ionizing an electron donor gas, such as helium, in the primary chamber.

Abstract translation: 在次级室中从稳定的供应气体例如NH 3离子化并在初级室中重新组合的电负性清洁或蚀刻剂气体，例如氟，通过电子附着电离电离在主室内 供体气体，如氦气，在主室中。

公开(公告)号：US20030033979A1

公开(公告)日：2003-02-20

申请号：US09930938

申请日：2001-08-16

Applicant: Applied Materials, Inc.

Inventor： Arnold V. Kholodenko ,  Dan Katz ,  Wing L. Cheng

IPC: C23C016/00 ,  C23F001/00

CPC classification number: C23C16/45519 ,  C23C16/455

Abstract: A substrate processing chamber has a substrate support to support a substrate, and an exhaust conduit about the substrate support. A first process gas distributor directs a first process gas, such as a non-reactive gas, about the substrate perimeter and toward the exhaust conduit at a first flow rate to form a curtain of non-reactive gas about the substrate. A second process gas distributor directs a second process gas, such as reactive CVD or etchant gas, toward a central portion of the substrate at a second flow rate which is lower than the first flow rate. A gas energizer energizes the first and second process gases in the chamber. A controller operates the substrate support, gas flow meters, gas energizer, and throttle valve, to process the substrate in the energized gas.

Abstract translation: 基板处理室具有用于支撑基板的基板支撑件和围绕基板支撑件的排气导管。 第一工艺气体分配器以第一流量引导诸如非反应性气体的第一工艺气体，例如基板周边和朝向排气管道，以在衬底周围形成非反应性气体帘幕。 第二工艺气体分配器以比第一流量低的第二流量向衬底的中心部分引导第二工艺气体，例如反应性CVD或蚀刻剂气体。 气体激发器激励腔室中的第一和第二处理气体。 控制器操作衬底支撑件，气体流量计，气体激励器和节流阀，以处理通电气体中的衬底。

公开(公告)号：US20030010292A1

公开(公告)日：2003-01-16

申请号：US09907328

申请日：2001-07-16

Applicant: Applied Materials, Inc.

Inventor： Arnold V. Kholodenko ,  Michael G. Chafin ,  Brad Mays ,  Tetsuya Ishikawa ,  Ananda H. Kumar ,  Dennis S. Grimard

IPC: C23F001/00 ,  C23C016/00

CPC classification number: C23C16/45568 ,  C23C16/4581 ,  C23C16/4586 ,  H01L21/6831 ,  H01L21/6833

Abstract: Generally, an electrostatic chuck having a dielectric coating is provided. In one embodiment, an electrostatic chuck includes a support surface, a mounting surface disposed opposite the support surface and at least one side separating the support surface and the mounting surface which defines a support body. One or more conductive members are disposed within the support body to generate an electrostatic attraction between the body and a substrate disposed thereon. A dielectric coating is disposed on the mounting surface of the support body to minimize undesired current leakage therethrough. Optionally, the dielectric coating may be additionally disposed on one or more of the sides and/or the support surface.

Abstract translation: 通常，提供具有电介质涂层的静电卡盘。 在一个实施例中，静电卡盘包括支撑表面，与支撑表面相对设置的安装表面和分开支撑表面和限定支撑体的安装表面的至少一个侧面。 一个或多个导电构件设置在支撑体内，以在主体和其上设置的基板之间产生静电吸引力。 电介质涂层设置在支撑体的安装表面上，以最大限度地减少不必要的电流泄漏。 可选地，电介质涂层可以另外设置在一个或多个侧面和/或支撑表面上。