公开(公告)号：US20250043423A1

公开(公告)日：2025-02-06

申请号：US18228549

申请日：2023-07-31

Applicant: Applied Materials, Inc.

Inventor： William Durand ,  Abdullah Zafar ,  Usman Chowdhury ,  Amir Bayati ,  Farzad Houshmand ,  David J. Coumou ,  Kasturi Sarang ,  Kenric Choi

IPC: C23C16/455 ,  G01N21/3504

Abstract: Vapor concentration sensors for deposition process or deposition chamber condition monitoring are described. In an example, a deposition system includes a deposition chamber, a deposition precursor source coupled to an inlet of the deposition chamber, and a non-dispersive infrared (NDIR) vapor concentration sensor between the deposition precursor source and the deposition chamber.

公开(公告)号：US12198903B2

公开(公告)日：2025-01-14

申请号：US17548219

申请日：2021-12-10

Applicant: Applied Materials, Inc.

Inventor： Joseph Frederick Sommers ,  Joseph Frederick Behnke ,  Xue Yang Chang ,  Anwar Husain ,  Alexander Alhajj Sulyman ,  Timothy Joseph Franklin ,  David J. Coumou

IPC: H01J37/32 ,  B05D1/12 ,  B05D3/12 ,  B05D7/00

Abstract: A method includes depositing a first layer of a first material onto a surface of a chamber component of a processing chamber. The first material comprises a polymer, the polymer having a dielectric strength of at least 40 MV/m. The method further includes depositing a second layer of a second material onto the first layer. The second material comprises a first ceramic material impregnated into the first polymer or a second polymer. The method further includes depositing a third layer. The third layer is of a third material. The third material includes the first ceramic material or a second ceramic material. The third material does not adhere to the first polymer or the second polymer. The third material does adhere to the first ceramic material or the second ceramic material of the second layer.

公开(公告)号：US20230187182A1

公开(公告)日：2023-06-15

申请号：US17548219

申请日：2021-12-10

Applicant: Applied Materials, Inc.

Inventor： Joseph Frederick Sommers ,  Joseph Frederick Behnke ,  Xue Yang Chang ,  Anwar Husain ,  Alexander Alhajj Sulyman ,  Timothy Joseph Franklin ,  David J. Coumou

IPC: H01J37/32 ,  B05D7/00 ,  B05D1/12 ,  B05D3/12

CPC classification number: H01J37/32495 ,  B05D7/58 ,  B05D1/12 ,  B05D3/12 ,  H01J37/32715 ,  H01J37/32467 ,  H01J2237/334

Abstract: A method includes depositing a first layer of a first material onto a surface of a chamber component of a processing chamber. The first material comprises a polymer, the polymer having a dielectric strength of at least 40 MV/m. The method further includes depositing a second layer of a second material onto the first layer. The second material comprises a first ceramic material impregnated into the first polymer or a second polymer. The method further includes depositing a third layer. The third layer is of a third material. The third material includes the first ceramic material or a second ceramic material. The third material does not adhere to the first polymer or the second polymer. The third material does adhere to the first ceramic material or the second ceramic material of the second layer.