公开(公告)号：US20190385825A1

公开(公告)日：2019-12-19

申请号：US16418274

申请日：2019-05-21

Applicant: Applied Materials, Inc.

Inventor： Jian WU ,  Wei LIU ,  Theresa Kramer GUARINI ,  Linlin WANG ,  Malcolm BEVAN ,  Lara HAWRYLCHAK

IPC: H01J37/32 ,  C23C26/00

Abstract: Embodiments described herein generally relate to a method and apparatus for fabricating a chamber component for a plasma process chamber. In one embodiment a chamber component used within a plasma processing chamber is provided that includes a metallic base material comprising a roughened non-planar first surface, wherein the roughened non-planar surface has an Ra surface roughness of between 4 micro-inches and 80 micro-inches, a planar silica coating formed over the roughened non-planar surface, wherein the planar silica coating has a surface that has an Ra surface roughness that is less than the Ra surface roughness of the roughened non-planar surface, a thickness between about 0.2 microns and about 10 microns, less than 1% porosity by volume, and contains less than 2E12 atoms/centimeters2 of aluminum.

公开(公告)号：US20230245863A1

公开(公告)日：2023-08-03

申请号：US18131306

申请日：2023-04-05

Applicant: Applied Materials, Inc.

Inventor： Jian WU ,  Wei LIU ,  Theresa Kramer GUARINI ,  Linlin WANG ,  Malcolm BEVAN ,  Lara HAWRYLCHAK

IPC: H01J37/32 ,  C23C26/00

CPC classification number: H01J37/32495 ,  C23C26/00 ,  H01J37/32477

Abstract: Embodiments described herein generally relate to a method and apparatus for fabricating a chamber component for a plasma process chamber. In one embodiment a chamber component used within a plasma processing chamber is provided that includes a metallic base material comprising a roughened non-planar first surface, wherein the roughened non-planar surface has an Ra surface roughness of between 4 micro-inches and 80 micro-inches, a planar silica coating formed over the roughened non-planar surface, wherein the planar silica coating has a surface that has an Ra surface roughness that is less than the Ra surface roughness of the roughened non-planar surface, a thickness between about 0.2 microns and about 10 microns, less than 1% porosity by volume, and contains less than 2E12 atoms/centimeters2 of aluminum.

公开(公告)号：US20230187262A1

公开(公告)日：2023-06-15

申请号：US18106739

申请日：2023-02-07

Applicant: Applied Materials, Inc.

Inventor： Jian WU ,  Toshiyuki NAKAGAWA ,  Koji NAKANISHI

IPC: H01L21/687 ,  H01L21/67 ,  C23C16/24 ,  C23C16/50

CPC classification number: H01L21/68757 ,  H01L21/67115 ,  C23C16/24 ,  C23C16/50 ,  H01L21/68735 ,  H01L2221/683

Abstract: The present disclosure relates to a support ring for a thermal processing chamber. The support ring has a polysilicon coating. The polysilicon coating is formed using a plasma spray deposition process.

公开(公告)号：US20190287845A1

公开(公告)日：2019-09-19

申请号：US16294603

申请日：2019-03-06

Applicant: Applied Materials, Inc.

Inventor： Jian WU ,  Toshiyuki NAKAGAWA ,  Koji NAKANISHI

IPC: H01L21/687 ,  H01L21/67 ,  C23C16/24 ,  C23C16/50

Abstract: The present disclosure relates to a support ring for a thermal processing chamber. The support ring has a polysilicon coating. The polysilicon coating is formed using a plasma spray deposition process.

公开(公告)号：US20230295789A1

公开(公告)日：2023-09-21

申请号：US17695475

申请日：2022-03-15

Applicant: Applied Materials, Inc.

Inventor： David JORGENSEN ,  Jian WU ,  Abhilash J. MAYUR

IPC: C23C4/134 ,  C23C4/04

CPC classification number: C23C4/134 ,  C23C4/04

Abstract: This application generally relates to a chamber component for a thermal processing chamber comprising a base component having a coating disposed thereon, the coating having a base component having a coating disposed thereon, the coating includes a surface, a thickness, and a plurality of cracks extending from the surface of the coating through at least 40 percent of the thickness of the coating.

公开(公告)号：US20220013336A1

公开(公告)日：2022-01-13

申请号：US16926104

申请日：2020-07-10

Applicant: Applied Materials, Inc.

Inventor： Jian WU ,  Lara A. HAWRYLCHAK ,  Ren-Guan DUAN ,  Bernard L. HWANG ,  Malcolm J. BEVAN ,  Wei LIU

IPC: H01J37/32 ,  H01L21/683 ,  B08B7/00

Abstract: A method and apparatus for the use of hydrogen plasma treatments is described herein. The process chamber includes a plurality of chamber components. The plurality of chamber components may be coated with a yttrium zirconium oxide composition, such as a Y2O3—ZrO2 solid solution. Some of the plurality of chamber components are replaced with a bulk yttrium zirconium oxide ceramic. Yet other chamber components are replaced with similar components of different materials.

公开(公告)号：US20240079252A1

公开(公告)日：2024-03-07

申请号：US17903964

申请日：2022-09-06

Applicant: Applied Materials, Inc.

Inventor： Dongming IU ,  Jian WU

IPC: H01L21/67

CPC classification number: H01L21/67115 ,  H01L21/67103 ,  H01L21/67248

Abstract: A reflector plate assembly for processing a substrate includes a reflector plate having a first surface, wherein the first surface is a bare polished surface, a reflector disk embedded within the reflector plate from the first surface, a coating layer on the reflector disk, and a pyrometer disposed through an opening of the reflector disk.