Variable radius dual magnetron
    1.
    发明授权
    Variable radius dual magnetron 有权
    可变半径双磁控管

    公开(公告)号:US09281167B2

    公开(公告)日:2016-03-08

    申请号:US13777010

    申请日:2013-02-26

    Abstract: A dual magnetron particularly useful for RF plasma sputtering includes a radially stationary open-loop magnetron comprising opposed magnetic poles and rotating about a central axis to scan an outer region of a sputter target and a radially movable open-loop magnetron comprising opposed magnetic poles and rotating together with the stationary magnetron. During processing, the movable magnetron is radially positioned in the outer region with an open end abutting an open end of the stationary magnetron to form a single open-loop magnetron. During cleaning, part of the movable magnetron is moved radially inwardly to scan and clean an inner region of the target not scanned by the stationary magnetron. The movable magnetron can be mounted on an arm pivoting about an axis at periphery of a rotating disk-shaped plate mounting the stationary magnetron so the arm centrifugally moves between radial positions dependent upon the rotation rate or direction.

    Abstract translation: 特别适用于RF等离子体溅射的双重磁控管包括径向固定的开环磁控管,其包括相对的磁极并围绕中心轴线旋转以扫描溅射靶的外部区域和包括相对的磁极的可径向移动的开环磁控管 连同固定磁控管。 在处理过程中,可移动磁控管径向定位在外部区域中,开口端与固定磁控管的开口端相接触以形成单个开环磁控管。 在清洁期间,可移动磁控管的一部分径向向内移动以扫描和清洁未被固定磁控管扫描的目标的内部区域。 可移动磁控管可以安装在围绕安装固定磁控管的旋转盘形板的周边处的轴线枢转的臂上,使得臂根据旋转速率或方向离心地在径向位置之间移动。

    Process kit for improving edge film thickness uniformity on a substrate

    公开(公告)号:US11236424B2

    公开(公告)日:2022-02-01

    申请号:US16672327

    申请日:2019-11-01

    Abstract: Embodiments of process kits for us in a substrate processing chamber are provided herein. In some embodiments, a process kit for use in a substrate processing chamber includes an annular body configured to surround a substrate support and having an upper portion, a lower portion, and a central opening through the upper portion and the lower portion, wherein the upper portion includes sidewalls coupled to an upper flange that defines an outer diameter of the annular body, wherein the upper portion includes a plurality of first holes disposed through the sidewalls, and wherein the upper portion includes one or more heating elements; and a shield disposed about the annular body, wherein the shield includes an exhaust port fluidly connected to the plurality of first holes.

    PROCESS KIT FOR IMPROVING EDGE FILM THICKNESS UNIFORMITY ON A SUBSTRATE

    公开(公告)号:US20210130953A1

    公开(公告)日:2021-05-06

    申请号:US16672327

    申请日:2019-11-01

    Abstract: Embodiments of process kits for us in a substrate processing chamber are provided herein. In some embodiments, a process kit for use in a substrate processing chamber includes an annular body configured to surround a substrate support and having an upper portion, a lower portion, and a central opening through the upper portion and the lower portion, wherein the upper portion includes sidewalls coupled to an upper flange that defines an outer diameter of the annular body, wherein the upper portion includes a plurality of first holes disposed through the sidewalls, and wherein the upper portion includes one or more heating elements; and a shield disposed about the annular body, wherein the shield includes an exhaust port fluidly connected to the plurality of first holes.

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