公开(公告)号：US20250029862A1

公开(公告)日：2025-01-23

申请号：US18223690

申请日：2023-07-19

Applicant: Applied Materials, Inc.

Inventor： Trung H. DAO ,  Sagir Bipin KADIWALA ,  Sam KIM ,  Minh Quoc TRAN ,  Gu LIU

IPC: H01L21/68 ,  B25J9/16 ,  G01B11/14 ,  G06T7/80

Abstract: Methods, systems, and apparatus for measuring a gap between a support surface for a substrate and an opposing upper surface of a processing chamber. The methods comprise: disposing a sensor substrate at a location spaced between the support surface and the upper surface, the sensor substrate comprising a body having a first side and a second side opposite the first side, the first side facing the support surface and the second side facing the upper surface, the first side having a first sensor and the second side having a second sensor; measuring, using the first sensor, a first distance between the first side and the support surface; measuring, using the second sensor, a second distance between the second side and the upper surface; and determining a gap between the support surface and the upper surface using the first distance and the second distance.

公开(公告)号：US20240404848A1

公开(公告)日：2024-12-05

申请号：US18239783

申请日：2023-08-30

Applicant: Applied Materials, Inc.

Inventor： Sam KIM ,  Kon Tae PARK ,  Yao-Hung YANG ,  Michael John PERRY ,  Michael LEVKOVITCH ,  Ram Chandra PALSANIYA ,  Nitin KHURANA ,  Derek MCQUARRIE

IPC: H01L21/67 ,  H02J7/00

Abstract: Methods and apparatus for commissioning a semiconductor processing tool include connecting a mobile facilities cart to a semiconductor processing tool; supplying facilities from the mobile facilities cart to the semiconductor processing tool; and operating the semiconductor processing tool using facilities supplied by the connected mobile facilities cart.

公开(公告)号：US20240290580A1

公开(公告)日：2024-08-29

申请号：US18421872

申请日：2024-01-24

Applicant: Applied Materials, Inc.

Inventor： Sam KIM

IPC: H01J37/32

CPC classification number: H01J37/3244 ,  H01J37/32082

Abstract: Embodiments of gas distribution plates for use with process chambers are provided herein. In some embodiments, a gas distribution plate includes: a body comprising a substantially flat plate made from a first material; a plurality of gas distribution holes extending through the body, wherein the plurality of gas distribution holes have a diameter that varies through the body, and wherein a throat of the plurality of gas distribution holes corresponds with a location where the diameter of the gas distribution holes is smallest; and a bushing at least partially disposed in each of the plurality of gas distribution holes, wherein the bushing comprises a bottom plate that includes an orifice with a diameter smaller than the diameter of the throat and sidewalls extending from the bottom plate, and wherein the bushing is made of a second material different from the first material.