公开(公告)号：US20010029155A1

公开(公告)日：2001-10-11

申请号：US09775214

申请日：2001-01-31

Applicant: Applied Materials, Inc.

Inventor： Doyle E. Bennett ,  Yutao Ma ,  Jui-Lung Li

IPC: B24B001/00

CPC classification number: B24B53/017 ,  B24B37/042 ,  B24B53/013

Abstract: Methods and apparatuses are provided that may remove the build up of polishing by products from the polishing pad without the reduction in throughput associated with conventional ex-situ conditioning. The conditioning method comprises holding a wafer against a polishing pad with a 0 psi force, and applying a conditioning fluid to the polishing pad while holding the wafer against the polishing pad with a 0 psi force. Thereafter the conditioning fluid may be rinsed from the polishing pad or may remain on the polishing pad while polishing is commenced. The polishing apparatus has a controller programmed to perform the conditioning method.

Abstract translation: 提供的方法和装置可以通过产品从抛光垫去除抛光的积累，而不会降低与常规的非原位调节相关的生产量。 调节方法包括以0psi的力将晶片保持在抛光垫上，并且在以0psi的力保持晶片抵靠抛光垫的同时将调理流体施加到抛光垫。 此后，可以从抛光垫冲洗调理流体，或者可以在抛光开始时保留在抛光垫上。 抛光装置具有被编程为执行调节方法的控制器。

公开(公告)号：US20030224678A1

公开(公告)日：2003-12-04

申请号：US10159183

申请日：2002-05-31

Applicant: APPLIED MATERIALS, INC.

Inventor： Wei-Yung Hsu ,  Yutao Ma ,  Sen-Hou Ko ,  Daniel A. Carl

IPC: D04B001/00 ,  D04C001/00 ,  D04G001/00 ,  D03D009/00 ,  D03D019/00 ,  D04B021/00 ,  D04H001/00 ,  B32B005/02 ,  B32B027/04 ,  B32B027/12 ,  D03D015/00 ,  B32B027/02

CPC classification number: B24B37/24 ,  B24D3/28 ,  Y10T442/10 ,  Y10T442/102 ,  Y10T442/159 ,  Y10T442/172 ,  Y10T442/176 ,  Y10T442/183 ,  Y10T442/2738 ,  Y10T442/2861

Abstract: An article and method are provided for polishing a substrate surface. In one aspect, the invention provides polishing articles including a linear strip of backing material and a fibrous polishing material disposed on the backing material. The polishing material may be in the form of individual fibers, a mesh of fibers, a web of fibers, an interwoven cloth of fibers, or felt. The polishing material may be impregnated or coated with a polishing enhancing material. The polishing article may be disposed in an apparatus for processing a substrate on a platen. In operation, a substrate is contacted with the polishing article and relative motion is provided between the substrate and the polishing article to remove material from the substrate surface.

Abstract translation: 提供用于抛光衬底表面的制品和方法。 在一个方面，本发明提供抛光制品，其包括背衬材料的线性条和设置在背衬材料上的纤维抛光材料。 抛光材料可以是单根纤维，纤维网，纤维织物，纤维交织布或毛毡的形式。 抛光材料可以用抛光增强材料浸渍或涂覆。 抛光制品可以设置在用于在台板上处理基板的装置中。 在操作中，衬底与抛光制品接触，并且在衬底和抛光制品之间提供相对运动，以从衬底表面去除材料。

公开(公告)号：US20020090886A1

公开(公告)日：2002-07-11

申请号：US10044379

申请日：2002-01-09

Applicant: Applied Materials, Inc.

Inventor： Ajoy Zutshi ,  Rajeev Bajaj ,  Fred C. Redeker ,  Yutao Ma ,  Kapila Wijekoon

IPC: B24B049/00

CPC classification number: B24B37/12 ,  B24B37/042 ,  B24B37/24

Abstract: Methods and apparatus for planarizing a substrate surface having copper containing materials thereon is provided. In one aspect, the invention provides a system for processing substrates comprising a first platen adapted for polishing a substrate with a hard polishing pad disposed on the first platen, a second platen adapted for polishing a substrate with a hard polishing pad disposed on the second platen, and a third platen adapted for polishing a substrate with a hard polishing pad disposed on the third platen. In another aspect, the invention provides a method for planarizing a substrate surface by the system described above including substantially removing bulk copper containing materials on the first platen, removing residual copper containing materials on the second platen, and then removing a barrier layer on the third platen. A computer readable program may also be provided for performing the methods described herein.

Abstract translation: 提供了在其上具有含铜材料的基板表面平坦化的方法和装置。 一方面，本发明提供了一种用于处理衬底的系统，其包括适于用设置在第一压板上的硬抛光垫抛光衬底的第一压板，适于用设置在第二压板上的硬抛光垫抛光衬底的第二压板 以及适于用设置在第三压板上的硬抛光垫抛光衬底的第三压板。 另一方面，本发明提供了一种用于通过上述系统对衬底表面进行平面化的方法，其包括在第一压板上基本上除去含铜材料，在第二压板上除去残余的含铜材料，然后在第三压板上除去阻挡层 滚筒。 还可以提供用于执行本文描述的方法的计算机可读程序。