公开(公告)号：US20140332839A1

公开(公告)日：2014-11-13

申请号：US14267358

申请日：2014-05-01

申请人： Byeong Kyun CHOI ,  Jae Won SEO ,  Sung Ho CHOO

发明人： Byeong Kyun CHOI ,  Jae Won SEO ,  Sung Ho CHOO

IPC分类号： H01L33/38

CPC分类号： H01L33/387 ,  H01L24/14 ,  H01L24/17 ,  H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/16245 ,  H01L2924/12041 ,  H01L2924/00

摘要： A light emitting device package includes a body having a cavity therein and first and second recesses inside the cavity of the body. The first and second electrode layers are provided in the first and second recesses, and a light emitting device is provided on the first and second electrode layers. The first and second bumps are provided under the light emitting device and attached to the first and second recesses.

摘要翻译： 发光器件封装包括其中具有空腔的主体和位于主体的空腔内的第一和第二凹部。 第一和第二电极层设置在第一和第二凹部中，并且发光器件设置在第一和第二电极层上。 第一和第二凸块设置在发光器件的下面并附接到第一和第二凹部。

公开(公告)号：US20120326199A1

公开(公告)日：2012-12-27

申请号：US13399751

申请日：2012-02-17

申请人： Sung Kyoon KIM ,  Sung Ho CHOO ,  Hyun Seoung JU ,  Jae Won SEO

发明人： Sung Kyoon KIM ,  Sung Ho CHOO ,  Hyun Seoung JU ,  Jae Won SEO

IPC分类号： H01L33/62

CPC分类号： H01L33/20 ,  H01L33/38 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, a first electrode on the first conductive semiconductor layer, a transparent electrode on the second conductive semiconductor layer, and a second electrode on the transparent electrode. The first electrode includes a first electrode pad on a first region of the first conductive semiconductor layer exposed from the second conductive semiconductor layer and the active layer and a first electrode finger part extending from the first electrode pad toward a second region, in which the first conductive semiconductor layer is exposed. A gap between the transparent electrode and the first electrode finger part is gradually narrowed from the first region toward the second region.

摘要翻译： 公开了一种发光器件和发光器件封装。 发光器件包括发光结构，其包括第一导电半导体层，第一导电半导体层上的有源层和有源层上的第二导电半导体层，第一导电半导体层上的第一电极，透明电极 在第二导电半导体层上的第二电极和透明电极上的第二电极。 第一电极包括在从第二导电半导体层和有源层暴露的第一导电半导体层的第一区域上的第一电极焊盘和从第一电极焊盘朝向第二区域延伸的第一电极指部分，其中第一电极焊盘 导电半导体层被暴露。 透明电极和第一电极指部之间的间隙从第一区域朝向第二区域逐渐变窄。

公开(公告)号：US20100155752A1

公开(公告)日：2010-06-24

申请号：US12646908

申请日：2009-12-23

申请人： Woo Sik LIM ,  Sung Ho CHOO

发明人： Woo Sik LIM ,  Sung Ho CHOO

IPC分类号： H01L33/00

CPC分类号： H01L33/382 ,  H01L33/20 ,  H01L33/38 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A semiconductor light emitting device that includes a first conductive type semiconductor layer, a first electrode, a insulating layer, and an electrode layer. The first electrode has at least one branch on the first conductive type semiconductor layer. The insulating layer is disposed on the first electrode. The electrode layer is disposed on the insulating layer.

摘要翻译： 一种半导体发光器件，包括第一导电类型半导体层，第一电极，绝缘层和电极层。 第一电极在第一导电类型半导体层上具有至少一个分支。 绝缘层设置在第一电极上。 电极层设置在绝缘层上。