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公开(公告)号：US20230044556A1
公开(公告)日：2023-02-09
申请号：US17967354
申请日：2022-10-17
Applicant: CORNING INCORPORATED
Inventor： Jin Su Kim , Yu Xiao
Abstract: A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion αcore, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion αclad, where αclad>αcore; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.
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公开(公告)号：US20220144681A1
公开(公告)日：2022-05-12
申请号：US17435539
申请日：2020-02-24
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Timothy Michael Gross , Jin Su Kim , Jesse Kohl , Hung Cheng Lu , Yu Xiao , Liying Zhang , Lu Zhang
Abstract: Methods for manufacturing glass articles having a target effective coefficient of thermal expansion CTETeff averaged over a temperature range comprise selecting a glass core composition having an average core glass coefficient of thermal expansion CTEcore that is greater than the target effective CTETeff and a glass clad composition having an average clad glass coefficient of thermal expansion CTEclad that is less than the target effective CTETeff; and manufacturing a glass laminate comprising a glass core layer formed from the glass core composition and two or more glass cladding layers fused to the glass core layer, each of the two or more glass cladding layers formed from the glass clad composition such that a ratio of a thickness of the glass core layer to a total thickness of the two or more glass cladding layers is selected to produce the glass laminate having an effective coefficient of thermal expansion CTEeff that is within ±0.5 ppm/° C. of the target effective CTETeff.
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公开(公告)号：US10953633B2
公开(公告)日：2021-03-23
申请号：US14423956
申请日：2013-08-27
Applicant: Corning Incorporated
Inventor： Kiat Chyai Kang , Govindarajan Natarajan , Yu Xiao
IPC: B29C65/02 , B32B7/12 , B32B27/06 , B32B17/06 , B32B17/10 , B29C65/54 , B29C65/00 , B32B27/30 , B29K105/00 , B29L9/00 , B29L31/34
Abstract: A glass-polymer laminate structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A polymer layer is laminated to a surface of the flexible glass substrate having a coefficient of thermal expansion (CTE) that is at least about 2 times a CTE of the flexible glass substrate. The polymer layer is laminated to the surface of the flexible glass substrate after thermally expanding the polymer layer to provide the flexible glass substrate with an in-plane compressive stress of at least about 30 MPa along a thickness of the flexible glass substrate.
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公开(公告)号：US20150258750A1
公开(公告)日：2015-09-17
申请号：US14423956
申请日：2013-08-27
Applicant: Corning Incorporated
Inventor： Kiat Chyai Kang , Govindarajan Natarajan , Yu Xiao
CPC classification number: B32B17/064 , B29C65/02 , B29C65/54 , B29C66/7465 , B29K2105/0097 , B29K2105/253 , B29K2833/12 , B29K2909/08 , B29K2995/0026 , B29L2009/00 , B29L2031/3412 , B32B7/12 , B32B17/10018 , B32B17/10036 , B32B17/101 , B32B17/10743 , B32B17/10752 , B32B27/06 , B32B27/308 , B32B2250/02 , B32B2255/10 , B32B2457/00 , Y10T428/24628 , Y10T428/266
Abstract: A glass-polymer laminate structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A polymer layer is laminated to a surface of the flexible glass substrate having a coefficient of thermal expansion (CTE) that is at least about 2 times a CTE of the flexible glass substrate. The polymer layer is laminated to the surface of the flexible glass substrate after thermally expanding the polymer layer to provide the flexible glass substrate with an in-plane compressive stress of at least about 30 MPa along a thickness of the flexible glass substrate.
Abstract translation: 玻璃 - 聚合物层压结构包括厚度不大于约0.3mm的柔性玻璃基底。 聚合物层被层压到柔性玻璃基板的表面，其具有至少约为柔性玻璃基板的CTE的约2倍的热膨胀系数（CTE）。 在将聚合物层热膨胀之后，将聚合物层层压到柔性玻璃基板的表面上，以沿柔性玻璃基板的厚度提供具有至少约30MPa的平面内压缩应力的柔性玻璃基板。
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公开(公告)号：US20240400434A1
公开(公告)日：2024-12-05
申请号：US18800607
申请日：2024-08-12
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Timothy Michael Gross , Jin Su Kim , Jesse Kohl , HungCheng Lu , Yu Xiao , Liying Zhang , Lu Zhang
Abstract: Methods for manufacturing glass articles having a target effective coefficient of thermal expansion CTETeff averaged over a temperature range comprise selecting a glass core composition having an average core glass coefficient of thermal expansion CTEcore that is greater than the target effective CTETeff and a glass clad composition having an average clad glass coefficient of thermal expansion CTEclad that is less than the target effective CTETeff; and manufacturing a glass laminate comprising a glass core layer formed from the glass core composition and two or more glass cladding layers fused to the glass core layer, each of the two or more glass cladding layers formed from the glass clad composition such that a ratio of a thickness of the glass core layer to a total thickness of the two or more glass cladding layers is selected to produce the glass laminate having an effective coefficient of thermal expansion CTEeff that is within ±0.5 ppm/° C. of the target effective CTETeff.
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Patent Agency Ranking
公开(公告)号：US20210170722A1
公开(公告)日：2021-06-10
申请号：US17181135
申请日：2021-02-22
Applicant: CORNING INCORPORATED
Inventor： Kiat Chyai Kang , Govindarajan Natarajan , Yu Xiao
IPC: B32B17/06 , B29C65/00 , B32B17/10 , B29C65/02 , B32B27/30 , B32B7/12 , B29C65/54 , B32B27/06 , B29L9/00 , B29L31/34 , B29K105/00
Abstract: A glass-polymer laminate structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A polymer layer is laminated to a surface of the flexible glass substrate having a coefficient of thermal expansion (CTE) that is at least about 2 times a CTE of the flexible glass substrate. The polymer layer is laminated to the surface of the flexible glass substrate after thermally expanding the polymer layer to provide the flexible glass substrate with an in-plane compressive stress of at least about 30 MPa along a thickness of the flexible glass substrate.
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公开(公告)号：US20150336357A1
公开(公告)日：2015-11-26
申请号：US14759354
申请日：2014-01-06
Applicant: Kiat Chyai KANG , Sue Camille LEWIS , Govindarajan NATARAJAN , Yu XIAO , Chunhe ZHANG , CORNING INCORPORATED
Inventor： Kiat Chyai Kang , Sue Camille Lewis , Govindarajan Natarajan , Yu Xiao , Chunhe Zhang
CPC classification number: B32B17/061 , B32B7/02 , B32B7/10 , B32B7/12 , B32B15/18 , B32B15/20 , B32B2307/558 , Y10T428/24942 , Y10T428/24967 , Y10T428/26 , Y10T428/266
Abstract: A laminated glass structure comprising a non-glass substrate and a glass sheet bonded to the non-glass substrate to form the laminated glass structure, wherein the laminated glass structure withstands a ball drop test wherein a 535 g stainless steel ball is dropped from a height of 0.8 m onto the laminated glass structure, with the glass sheet being impacted by the ball. The glass sheet has a thickness such that the glass sheet exhibits, without cracking, deformation to adapt to any shape change of the non-glass substrate as imparted by the ball of the ball drop test.
Abstract translation: 一种夹层玻璃结构，其包括非玻璃基板和与非玻璃基板接合以形成夹层玻璃结构的玻璃板，其中夹层玻璃结构可承受球滴试验，其中535g不锈钢球从高度 为0.8米，夹在玻璃结构上，玻璃板受到球的冲击。 玻璃板的厚度使得玻璃板在没有开裂的情况下显示变形以适应由球滴试验球赋予的非玻璃基板的任何形状变化。
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公开(公告)号：US12084373B2
公开(公告)日：2024-09-10
申请号：US17435539
申请日：2020-02-24
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Timothy Michael Gross , Jin Su Kim , Jesse Kohl , Hung Cheng Lu , Yu Xiao , Liying Zhang , Lu Zhang
CPC classification number: C03B17/02 , B32B17/06 , C03B17/064 , C03C3/091 , C03C3/093 , B32B2307/30
Abstract: Methods for manufacturing glass articles having a target effective coefficient of thermal expansion CTETeff averaged over a temperature range comprise selecting a glass core composition having an average core glass coefficient of thermal expansion CTEcore that is greater than the target effective CTETeff and a glass clad composition having an average clad glass coefficient of thermal expansion CTEclad that is less than the target effective CTETeff; and manufacturing a glass laminate comprising a glass core layer formed from the glass core composition and two or more glass cladding layers fused to the glass core layer, each of the two or more glass cladding layers formed from the glass clad composition such that a ratio of a thickness of the glass core layer to a total thickness of the two or more glass cladding layers is selected to produce the glass laminate having an effective coefficient of thermal expansion CTEeff that is within ±0.5 ppm/° C. of the target effective CTETeff.
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公开(公告)号：US11875993B2
公开(公告)日：2024-01-16
申请号：US17967354
申请日：2022-10-17
Applicant: CORNING INCORPORATED
Inventor： Jin Su Kim , Yu Xiao
CPC classification number: H01L21/02422 , C03B33/076
Abstract: A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion αcore, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion αclad, where αclad>αcore; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.
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公开(公告)号：US20220149004A1
公开(公告)日：2022-05-12
申请号：US17435574
申请日：2020-02-24
Applicant: CORNING INCORPORATED
Inventor： Jin Su Kim , Yu Xiao
Abstract: A wafer- or panel-level encapsulated package comprises a glass substrate comprising a glass cladding layer (105) fused to a glass core layer (110), the glass substrate comprising a cavity (425), wherein the glass cladding layer has a higher etch rate in an etchant than the glass core layer. The wafer- or panel-level encapsulated package further comprises a microelectronic component (700) disposed in the cavity, and an encapsulant (702) sealed to the glass substrate such that the microelectronic component is encapsulated within the cavity. Methods for forming the wafer- or panel-level encapsulated package, including etching a cavity into a glass substrate, depositing a microelectronic component into the cavity, and sealing an encapsulant to the glass substrate such that the microelectronic component is encapsulated within the cavity are also provided.
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