LOW WARP FAN-OUT PROCESSING METHOD AND PRODUCTION OF SUBSTRATES THEREFOR

    公开(公告)号:US20230044556A1

    公开(公告)日:2023-02-09

    申请号:US17967354

    申请日:2022-10-17

    Inventor: Jin Su Kim Yu Xiao

    Abstract: A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion αcore, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion αclad, where αclad>αcore; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.

    Low warp fan-out processing method and production of substrates therefor

    公开(公告)号:US11508575B2

    公开(公告)日:2022-11-22

    申请号:US16916385

    申请日:2020-06-30

    Inventor: Jin Su Kim Yu Xiao

    Abstract: A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion αcore, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion αclad, where αclad>αcore; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.

Patent Agency Ranking