公开(公告)号：US20030027499A1

公开(公告)日：2003-02-06

申请号：US10072413

申请日：2002-02-05

Applicant: Cabot Microelectronics Corporation

Inventor： Mingming Fang ,  Christopher C. Streinz ,  Shumin Wang

IPC: B24B001/00

CPC classification number: G11B23/505 ,  B24B37/044

Abstract: A method for polishing computer rigid disks comprising bringing at least one surface of the rigid disk into contact with a polishing pad and applying a composition to the rigid disk comprising at least one hydroxylamine additive and colloidal silica to give a polished rigid disk.

公开(公告)号：US20030134575A1

公开(公告)日：2003-07-17

申请号：US09975335

申请日：2001-10-11

Applicant: Cabot Microelectronics Corporation

Inventor： Mingming Fang

IPC: B24B001/00

CPC classification number: C09G1/02 ,  C09K3/1463 ,  H01L21/3212

Abstract: The invention provides a chemical-mechanical polishing system for a substrate comprising a liquid carrier, a polishing pad and/or an abrasive, a per-type oxidizer, and a phosphono group-containing additive, as well as a method of using the same to polish substrates, particularly nickel-containing substrates.

Abstract translation: 本发明提供了一种用于基材的化学机械抛光系统，其包括液体载体，抛光垫和/或研磨剂，每种类型的氧化剂和含有膦酰基的添加剂，以及其使用方法 抛光底物，特别是含镍底物。

公开(公告)号：US20030124852A1

公开(公告)日：2003-07-03

申请号：US10340561

申请日：2003-01-10

Applicant: Cabot Microelectronics Corporation

Inventor： Mingming Fang ,  Brian L. Mueller ,  James A. Dirksen

IPC: H01L021/302 ,  H01L021/461

CPC classification number: C09G1/02 ,  C09K3/1463 ,  G11B5/8404 ,  H01L21/3212

Abstract: A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.

Abstract translation: 提供了一种用该组合物对表面进行平面化或抛光的组合物和方法。 组合物包含液体载体，化学促进剂和包含约5-90wt。 ％的热解金属氧化物，和约10-95wt。 ％的磨料颗粒，其中约90％或更多的磨料颗粒（数量）具有不大于100nm的粒度。 本发明的组合物可用于以高抛光效率，均匀性和去除速率平坦化或抛光表面，并且具有最小的缺陷性，例如下面的结构和形貌的场损失。