公开(公告)号：US20170051181A1

公开(公告)日：2017-02-23

申请号：US15346835

申请日：2016-11-09

Applicant: Cabot Microelectronics Corporation

Inventor： Steven GRUMBINE ,  Shoutian LI ,  William WARD ,  Pankaj SINGH ,  Jeffrey DYSARD

IPC: C09G1/02 ,  C09K3/14 ,  B24B37/04 ,  H01L21/3105

Abstract: The inventive method comprises chemically-mechanically polishing a substrate with an inventive polishing composition comprising a liquid carrier and abrasive particles that have been treated with a compound.

Abstract translation: 本发明的方法包括用本发明的抛光组合物对基材进行化学机械抛光，所述抛光组合物包含液体载体和已经用化合物处理的磨料颗粒。