公开(公告)号：US20170051181A1

公开(公告)日：2017-02-23

申请号：US15346835

申请日：2016-11-09

Applicant: Cabot Microelectronics Corporation

Inventor： Steven GRUMBINE ,  Shoutian LI ,  William WARD ,  Pankaj SINGH ,  Jeffrey DYSARD

IPC: C09G1/02 ,  C09K3/14 ,  B24B37/04 ,  H01L21/3105

Abstract: The inventive method comprises chemically-mechanically polishing a substrate with an inventive polishing composition comprising a liquid carrier and abrasive particles that have been treated with a compound.

Abstract translation: 本发明的方法包括用本发明的抛光组合物对基材进行化学机械抛光，所述抛光组合物包含液体载体和已经用化合物处理的磨料颗粒。

公开(公告)号：US20150221520A1

公开(公告)日：2015-08-06

申请号：US14686988

申请日：2015-04-15

Applicant: Cabot Microelectronics Corporation

Inventor： Pankaj SINGH ,  Lamon JONES

IPC: H01L21/306 ,  C09G1/02

CPC classification number: H01L21/30625 ,  C09G1/02 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/3212

Abstract: The present invention provides compositions and methods for polishing a molybdenum metal-containing surface. A polishing composition (slurry) described herein comprises an abrasive concentration of an inorganic particulate abrasive material (e.g., alumina or silica) suspended in an acidic aqueous medium containing a water soluble surface active material and an oxidizing agent. The surface active material is selected based on the zeta potential of the particulate abrasive, such that when the abrasive has a positive zeta potential, the surface active material comprises a cationic material, and when the particulate abrasive has a negative zeta potential, the surface active material comprises an anionic material, a non-ionic material, or a combination thereof.

Abstract translation: 本发明提供了用于研磨含有金属钼的表面的组合物和方法。 本文所述的抛光组合物（浆料）包含悬浮在含有水溶性表面活性物质和氧化剂的酸性含水介质中的无机颗粒磨料（例如氧化铝或二氧化硅）的磨料浓度。 基于颗粒磨料的ζ电位选择表面活性材料，使得当研磨剂具有正ζ电位时，表面活性材料包含阳离子材料，并且当颗粒磨料具有负ζ电位时，表面活性物质 材料包括阴离子材料，非离子材料或其组合。

公开(公告)号：US20130327977A1

公开(公告)日：2013-12-12

申请号：US13913721

申请日：2013-06-10

Applicant: Cabot Microelectronics Corporation

Inventor： Pankaj SINGH ,  Lamon JONES

IPC: H01L21/306 ,  C09G1/02

CPC classification number: H01L21/30625 ,  C09G1/02 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/3212

Abstract: The present invention provides compositions and methods for polishing a molybdenum metal-containing surface. A polishing composition (slurry) described herein comprises an abrasive concentration of an inorganic particulate abrasive material (e.g., alumina or silica) suspended in an acidic aqueous medium containing a water soluble surface active material and an oxidizing agent. The surface active material is selected based on the zeta potential of the particulate abrasive, such that when the abrasive has a positive zeta potential, the surface active material comprises a cationic material, and when the particulate abrasive has a negative zeta potential, the surface active material comprises an anionic material, a nonionic material, or a combination thereof.

Abstract translation: 本发明提供了用于研磨含有金属钼的表面的组合物和方法。 本文所述的抛光组合物（浆料）包含悬浮在含有水溶性表面活性物质和氧化剂的酸性含水介质中的无机颗粒磨料（例如氧化铝或二氧化硅）的磨料浓度。 基于颗粒磨料的ζ电位选择表面活性材料，使得当研磨剂具有正ζ电位时，表面活性材料包含阳离子材料，并且当颗粒磨料具有负ζ电位时，表面活性物质 材料包括阴离子材料，非离子材料或其组合。