公开(公告)号：US20130321018A1

公开(公告)日：2013-12-05

申请号：US13901328

申请日：2013-05-23

Applicant: Cascade Microtech, Inc.

Inventor： Reed Gleason ,  Michael A. Bayne ,  Kenneth Smith ,  Timothy Lesher ,  Martin Koxxy

IPC: G01R1/073

CPC classification number: G01R1/0735 ,  G01R1/06733 ,  G01R1/06738 ,  G01R3/00 ,  H01R13/2414 ,  H01R13/2464 ,  H01R43/16 ,  H05K3/20 ,  H05K3/4007 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/49815 ,  Y10T29/49824 ,  Y10T29/49826 ,  Y10T29/53509

Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Abstract translation: 优选由延性材料构成的基板和具有用于接触测试装置上的接触焊盘的所得装置的所需形状的工具与基板接触。 该工具优选地由比基板更硬的材料构成，使得可以容易地在其中形成凹陷。 优选图案化的电介质（绝缘）层由衬底支撑。 导电材料位于凹陷内，然后优选地研磨以从电介质层的顶表面去除多余的并提供平整的整个表面。 在电介质层和导电材料上形成迹线。 然后优选在整个表面上图案化聚酰亚胺层。 然后通过任何合适的方法去除衬底。