公开(公告)号：US20130341653A1

公开(公告)日：2013-12-26

申请号：US13971547

申请日：2013-08-20

Applicant: Cree, Inc.

Inventor： THOMAS YUAN ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Abstract translation: 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。