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    Hybrid lens for controlled light distribution
    1.
    发明授权
    Hybrid lens for controlled light distribution 有权

    公开(公告)号：US10468566B2

    公开(公告)日：2019-11-05

    申请号：US15483096

    申请日：2017-04-10

    Applicant: Cree, Inc.

    Inventor： Eric Tarsa ,  Kurt Wilcox ,  Bin Hou ,  Ted Lowes

    IPC: H01L33/58 ,  F21V7/00 ,  F21V5/04 ,  F21V5/00 ,  G02B19/00 ,  H01L25/075 ,  F21Y115/10

    Abstract: A lens for distribution of light predominantly toward a preferential side from a light emitter having an emitter axis. The lens has a faceted output region, a smooth output surface and at least one reflective surface which reflects light through total-internal-reflection (TIR) toward the faceted output region. The faceted output region is formed by pairs of transverse surfaces each surface of which redirects the received light to provide a composite illuminance pattern. The lens may further have faceted input surfaces at least partially defining a light-input cavity about the emitter axis. The faceted input region is formed by pairs of transverse surfaces each surface of which redirects the received light.

    Tilted emission LED array
    3.
    发明授权
    Tilted emission LED array 有权

    公开(公告)号：US09786811B2

    公开(公告)日：2017-10-10

    申请号：US13833272

    申请日：2013-03-15

    Applicant: Cree, Inc.

    Inventor： Fabian Rol ,  Eric Tarsa ,  Bernd Keller ,  Theodore D. Lowes ,  David T. Emerson

    IPC: H01L29/18 ,  H01L33/00 ,  H01L33/08 ,  H01L25/075 ,  H01L33/58 ,  H01L33/20 ,  H01L33/54

    CPC classification number: H01L33/08 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present disclosure is directed to LED components, and systems using such components, having a light emission profile that may be controlled independently of the lens shape by varying the position and/or orientation of LED chips with respect to one or both of an overlying lens and the surface of the component. For example, the optical centers of the LED emitting surface and the lens, which are normally aligned, may be offset from each other to generate a controlled and predictable emission profile. The LED chips may be positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The use of offset emitters allows for LED components with shifted or tilted emission patterns, without causing output at high angles of the components. This is beneficial as it allows a lighting system to have tilted emission from the LED component and primary optics.

    LED PACKAGE WITH ENCAPSULANT HAVING PLANAR SURFACES
    6.
    发明申请
    LED PACKAGE WITH ENCAPSULANT HAVING PLANAR SURFACES 有权
    LED包装与具有平面表面的包装

    公开(公告)号：US20150194580A1

    公开(公告)日：2015-07-09

    申请号：US14661874

    申请日：2015-03-18

    Applicant: CREE, INC.

    Inventor： THEODORE LOWES ,  Eric Tarsa ,  Sten Heikman ,  Bernd Keller ,  Jesse Reiherzer ,  Hormoz Benjamin

    IPC: H01L33/54 ,  H01L33/60 ,  H01L33/50

    CPC classification number: H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can also comprise a submount with one or more LEDs, and a blanket conversion material layer on the one or more LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it will be absorbed and emitted omnidirectionally. This allows for reflected light to now escape from the encapsulant. This allows for efficient emission and a broader emission profile, for example when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility in using the packages in different applications.

    Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装还可以包括具有一个或多个LED的底座以及一个或多个LED和底座上的毯子转换材料层。 密封剂可以在底座上，LED上方，并且在密封剂内部反射的光将到达转换材料，并将其全向吸收和发射。 这允许反射光现在从密封剂中逸出。 这允许例如当与具有半球密封剂或透镜的传统封装相比时，有效地发射和更宽的发射特征。 在某些实施例中，LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂，LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系，使得在不同应用中使用封装更具灵活性。

    LED BASED PEDESTAL-TYPE LIGHTING STRUCTURE
    7.
    发明申请
    LED BASED PEDESTAL-TYPE LIGHTING STRUCTURE 有权
    基于LED的PEDESTAL型照明结构

    公开(公告)号：US20140003048A1

    公开(公告)日：2014-01-02

    申请号：US14014272

    申请日：2013-08-29

    Applicant: Cree, Inc.

    Inventor： Tao Tong ,  Ronan LeToquin ,  Bernd Keller ,  Theodore Lowes ,  Eric Tarsa ,  Mark Youmans

    IPC: F21K99/00

    CPC classification number: F21K9/56 ,  F21K9/00 ,  F21K9/232 ,  F21K9/64 ,  F21V3/00 ,  F21V3/04 ,  F21V29/773 ,  F21Y2107/00 ,  F21Y2107/40 ,  F21Y2115/10 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: LED based lamps and bulbs are disclosed that comprise a pedestal having a plurality of LEDs, wherein the pedestal at least partially comprises a thermally conductive material. A heat sink structure is included with the pedestal thermally coupled to the heat sink structure. A remote phosphor is arranged in relation to the LEDs so that at least some light from the LEDs passes through the remote phosphor and is converted to a different wavelength of light. Some lamp or bulb embodiments can emit a white light combination of light from the LEDs and the remote phosphor. These can include LEDs emitting blue light with the remote phosphor having a material that absorbs blue light and emits yellow or green light. A diffuser can be included to diffuse the emitting light into the desired pattern, such as omnidirectional.

    Abstract translation: 公开了基于LED的灯和灯泡，其包括具有多个LED的基座，其中所述基座至少部分地包括导热材料。 散热器结构包括在与散热器结构热耦合的基座上。 相对于LED布置远程荧光体，使得来自LED的至少一些光穿过远程荧光体并被转换成不同波长的光。 一些灯泡或灯泡实施例可以发出来自LED和远程荧光体的光的白光组合。 这些可以包括发射蓝光的LED，远程荧光体具有吸收蓝色光并发出黄色或绿色光的材料。 可以包括扩散器以将发射光扩散到所需的图案，例如全向的。

    SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING SUPERSTRATES WITH PATTERNED SURFACES
    8.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICES INCLUDING SUPERSTRATES WITH PATTERNED SURFACES 审中-公开

    公开(公告)号：US20190326484A1

    公开(公告)日：2019-10-24

    申请号：US16390714

    申请日：2019-04-22

    Applicant: Cree, Inc.

    Inventor： Erin Welch ,  Paul Thomas Fini ,  Eric Tarsa ,  Kenneth Morgan Davis

    IPC: H01L33/50 ,  H01L33/58

    Abstract: A semiconductor light emitting device includes a light emitting diode (LED) chip, a recipient luminophoric medium on the LED chip, a patterned superstrate on the recipient luminophoric medium opposite the LED chip, the patterned superstrate comprising a patterned superstrate on the recipient luminophoric medium opposite the LED chip, the patterned superstrate comprising a patterned surface that is configured to reduce a variation in a color point of a light emitted by the semiconductor light emitting device as a function of an angle off an optical axis of the LED chip.

    UNIFORM EMISSION LED PACKAGE
    9.
    发明申请
    UNIFORM EMISSION LED PACKAGE 审中-公开
    均匀排放LED包装

    公开(公告)号：US20150129921A1

    公开(公告)日：2015-05-14

    申请号：US14600813

    申请日：2015-01-20

    Applicant: CREE, INC.

    Inventor： Gerald Negley ,  Michael Leung ,  Maryanne Underwood ,  Eric Tarsa ,  Peter Andrews

    IPC: H01L33/54 ,  H01L33/58 ,  H01L33/50 ,  H01L33/48

    CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00

    Abstract: An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.

    Abstract translation: 一种发射器封装，包括安装在底座表面的发光二极管（LED），该表面具有围绕LED的第一弯液面形成特征。 表面包含基质密封剂并覆盖LED。 靠近表面的基质密封剂的外边缘由弯液面形成特征限定，并且密封剂在所述LED上形成基本上圆顶形的覆盖物。 一种通过向身体提供具有第一弯液面保持特征的表面来制造LED封装的方法。 LED在LED周围安装有弯液面保持功能的表面。 在LED和表面上引入液体基质密封剂，第一弯液面保持特征将液体基质密封剂保持在LED上的圆顶形状。 然后固化基质密封剂。

    Low profile lighting module
    10.
    发明授权
    Low profile lighting module 有权

    公开(公告)号：US10288261B2

    公开(公告)日：2019-05-14

    申请号：US14696902

    申请日：2015-04-27

    Applicant: CREE, INC.

    Inventor： James Ibbetson ,  Bernd Keller ,  Eric Tarsa ,  Zongjie Yuan

    IPC: H01L27/15 ,  F21V11/00 ,  F21K9/00 ,  F21K9/60 ,  F21V3/00 ,  H01L33/54 ,  F21Y105/10 ,  F21Y103/10 ,  F21Y115/10

    Abstract: A low profile lighting module. Devices according to this disclosure can produce a uniform light intensity output profile, limiting the perceived appearance of individual point sources, from direct lighting modules comprising several light emitting diodes. Individual lighting device components are disclosed that can contribute to this uniform profile, including: primary optics, secondary optics, and contoured housing elements. These components can interact with and control emitted light, thus adjusting its pattern. These components can alter the direction of emitted light, providing a more uniform light intensity over a wider range of viewing angle.

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