公开(公告)号：US20210090967A1

公开(公告)日：2021-03-25

申请号：US17116269

申请日：2020-12-09

Applicant: DENSO CORPORATION

Inventor： Wataru KOBAYASHI ,  Kazuki KODA

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  B23K26/354 ,  B29C65/00 ,  H01L23/50 ,  B23K26/00

Abstract: An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.

公开(公告)号：US20210364443A1

公开(公告)日：2021-11-25

申请号：US17394289

申请日：2021-08-04

Applicant: DENSO CORPORATION

Inventor： Hodaka MORI ,  Kazuki KODA ,  Kazuaki MAWATARI

IPC: G01N21/65 ,  G01N33/02

Abstract: A server including a storage and a controller is communicably connected with a communication terminal. The storage is configured to store a processing data and an analysis data for each of a plurality of analysis targets. The processing data relates to a processing condition for forming a concavo-convex structure on a detection substrate to be used in performing a spectroscopic analysis. The analysis data is used to analyze the analysis target from a spectroscopic spectrum of the analysis target obtained by the spectroscopy analysis. Upon receiving a signal requesting the processing data, the controller is configured to select the processing data corresponding to the analysis target and transmit the selected processing data to the communication terminal. Upon receiving a spectroscopic spectrum, the controller is configured to use the analysis data to analyze the spectroscopic spectrum.

公开(公告)号：US20190237378A1

公开(公告)日：2019-08-01

申请号：US16382323

申请日：2019-04-12

Applicant: DENSO CORPORATION

Inventor： Wataru KOBAYASHI ,  Kazuki KODA

IPC: H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/3142 ,  B23K26/00 ,  B23K26/354 ,  B29C65/00 ,  H01L21/4821 ,  H01L23/28 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/50 ,  H01L24/32 ,  H01L2224/27013 ,  H01L2224/32245

Abstract: An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.

公开(公告)号：US20190206761A1

公开(公告)日：2019-07-04

申请号：US16296868

申请日：2019-03-08

Applicant: DENSO CORPORATION

Inventor： Takumi NOMURA ,  Wataru KOBAYASHI ,  Kazuki KODA

IPC: H01L23/367 ,  H01L23/13 ,  H01L21/48 ,  H01L23/29 ,  H01L23/31 ,  H01L23/373 ,  H01L21/56 ,  H05K7/20 ,  B23K26/354 ,  F28F3/02 ,  B29C65/70

Abstract: A metal member includes a metal substrate and a porous metal layer. A composite includes the metal member and a resin member. The metal substrate has one surface, is made of a metal material, and has a region formed as an uneven layer having an uneven shape with respect to the one surface. The porous metal layer has a mesh-like shape and is formed on the uneven layer. The uneven layer includes a plurality of protrusions protruding in a direction normal to the one surface.

公开(公告)号：US20200043835A1

公开(公告)日：2020-02-06

申请号：US16596897

申请日：2019-10-09

Applicant: DENSO CORPORATION

Inventor： Takumi NOMURA ,  Wataru KOBAYASHI ,  Kazuki KODA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L21/48 ,  H01L21/56

Abstract: A base material includes one surface, and a side surface continuous with the one surface. Each of the one surface and the side surface has a sealed region to be sealed with mold resin. The one surface has a one surface rough region in the sealed region thereof. The side surface has a side surface rough region in the sealed region thereof.

公开(公告)号：US20240146139A1

公开(公告)日：2024-05-02

申请号：US18405533

申请日：2024-01-05

Applicant: DENSO CORPORATION

Inventor： Kazuki KODA ,  Hideaki SHIRAI ,  Tsuguya SHIMOSAKAMOTO

IPC: H02K3/47 ,  H02K15/06

CPC classification number: H02K3/47 ,  H02K15/061

Abstract: A joined assembly comprises a wire bundle and a metallic member joined to the wire bundle. The wire bundle includes a bundle of a plurality of conductive wires which are isolated from each other using inter-wire insulating layers and adhered to each other, the inter-wire insulating layers being made from insulating resin. The wire bundle includes a head portion and a head extension. The head portion is arranged on a first side of the wire bundle in a lengthwise direction (Da) thereof. The head extension extends from the head portion to a second side of the wire bundle away from the first side in the lengthwise direction. The metallic member includes a metallic member connecting portion arranged in contact with the head extension. The conductive wires are kept adhered to each other through the inter-wire insulating layers in the head extension and fusion-joined in the head portion to a portion of the metallic member connecting portion. The head portion of the wire bundle has the inter-wire insulating layers removed therefrom.

公开(公告)号：US20200328132A1

公开(公告)日：2020-10-15

申请号：US16914903

申请日：2020-06-29

Applicant: DENSO CORPORATION

Inventor： Wataru KOBAYASHI ,  Kazuki KODA

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  B23K26/354 ,  B29C65/00 ,  H01L23/50 ,  B23K26/00

Abstract: An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.