公开(公告)号：US20210332267A1

公开(公告)日：2021-10-28

申请号：US17369743

申请日：2021-07-07

Applicant: DENSO CORPORATION

Inventor： Masami SAITO ,  Koji KONDO ,  Hirotaka MIYANO

IPC: C09J5/02 ,  C09J5/06 ,  C09J163/00

Abstract: A bonded structure has a first substrate composed of aluminum or an aluminum alloy, a first thin film layer formed on the surface of the first substrate, and a resin adhesive layer bonded to the surface of the first thin film layer. The first thin film layer is composed of silicate glass that has a metal element with different valency from Si as a solid solution. The resin adhesive layer includes a resin including a structural site derived from ionic polymerization or a resin capable of dehydration condensation.

公开(公告)号：US20230098430A1

公开(公告)日：2023-03-30

申请号：US17948318

申请日：2022-09-20

Applicant: DENSO CORPORATION

Inventor： Hirotaka MIYANO ,  Masami SAITO ,  Kazuhiro MORITA ,  Taiga HANDA ,  Katsuhito MORI ,  Kunio MORI

IPC: C09J5/04

Abstract: A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.

公开(公告)号：US20220340797A1

公开(公告)日：2022-10-27

申请号：US17859448

申请日：2022-07-07

Applicant: DENSO CORPORATION

Inventor： Masami SAITO

IPC: C09J183/04 ,  C09J163/00

Abstract: A structure includes an aluminum base and an adhesive layer that is made of an adhesive resin adhering to a surface of the aluminum base. The adhesive layer includes a hard layer that abuts against an adhesive interface where the hard layer is adhered to the aluminum base, and a body layer that abuts against the hard layer. The hard layer is harder than the body layer.

公开(公告)号：US20210138763A1

公开(公告)日：2021-05-13

申请号：US17150057

申请日：2021-01-15

Applicant: DENSO CORPORATION

Inventor： Masami SAITO ,  Koji KONDO ,  Masashi TOTOKAWA ,  Hirotaka MIYANO ,  Yoshitake SUGANUMA ,  Kenichi YAGI ,  Yuichi KATO ,  Kunio MORI ,  Katsuhito MORI ,  Taiga HANDA

IPC: B32B7/12 ,  F28F1/32 ,  F28F21/08 ,  H01L23/36 ,  H05K7/20 ,  B32B37/14 ,  B32B15/08

Abstract: A bonded structure has a first bonded member with a first bonding surface, a second bonded member with a second bonding surface, and a bonding resin layer containing a polymer, disposed between the first bonding surface and the second bonding surface. The polymer in the bonding resin layer has polymer main chains oriented in an intersecting direction that intersects with the first bonding surface and the second bonding surface. The intersecting direction preferably extends along the thickness direction of the bonding resin layer. A heat exchanger has the bonded structure, and the first bonded member serves as a tubular member, and the second bonded member serves as a heat dissipation fin.