公开(公告)号：US08076181B1

公开(公告)日：2011-12-13

申请号：US12910676

申请日：2010-10-22

申请人： David A. Pruitt ,  Lothar Maier

发明人： David A. Pruitt ,  Lothar Maier

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L21/46

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/495 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48639 ,  H01L2224/48839 ,  H01L2224/49 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A packaging technique is described for QFNs, DFN, and other surface mount packages that allows the sides of leads to be plated with a wettable metal prior to the lead frames being singulated from the lead frame sheet. The leads of the lead frames in the sheet are shorted together and to the body of the lead frame sheet by a sacrificial interconnect structure. Chips are mounted to the lead frames and encapsulated, leaving the bottoms of the leads exposed. The lead frame sheet is then sawed along boundaries of the lead frames but not sawed through the interconnect structure. The sawing exposes at least a portion of the sides of the leads. The leads are then electroplated while the leads are biased with a bias voltage via the interconnect structure. After the plating, the lead frame sheet is sawed completely thorough the interconnect structure to singulate the lead frames and prevent the interconnect structure from shorting the leads together.

摘要翻译： 描述了用于QFN，DFN和其他表面贴装封装的封装技术，其允许引线的两侧在引线框架从引线框架片材分割之前镀有可湿性金属。 片材中的引线框架的引线通过牺牲互连结构短路在引线框架片体的主体上。 芯片安装到引线框架并封装，使引线的底部露出。 然后，引线框架片沿着引线框架的边界锯切，但是没有通过互连结构锯切。 锯切暴露引线的至少一部分侧面。 然后将引线电镀，同时引线通过互连结构以偏置电压偏置。 电镀后，引线框架板完全穿过互连结构，以对引线框架进行切割，并防止互连结构将引线连接在一起。

公开(公告)号：US06703692B1

公开(公告)日：2004-03-09

申请号：US10066030

申请日：2002-01-31

申请人： David A. Pruitt

发明人： David A. Pruitt

IPC分类号： H01L23495

CPC分类号： H01L23/49503 ,  H01L23/49551 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A leadframe is disclosed. The leadframe comprises a frame characterized by a substantially rectangular outline, a die paddle with a receiving surface, and a plurality of support members that connect the frame to the die paddle. The leadframe further comprises a plurality of leads connected to the frame, that will eventually serve to electrically connect an integrated circuit mounted on the die paddle to an external electrical device. The die paddle lies in a lower horizontal plane. A plurality of support members connect the frame with the die paddle. As projected on to a vertical plane that is perpendicular to the side of the frame to which a support member is attached, the offset angle between the support member and a vertical axis is less than 45 degrees.

摘要翻译： 公开了引线框架。 引线框架包括以大致矩形轮廓为特征的框架，具有接收表面的模具板，以及将框架连接到模板上的多个支撑构件。 引线框还包括连接到框架的多个引线，其将最终用于将安装在管芯焊盘上的集成电路电连接到外部电气设备。 模板位于较低的水平面。 多个支撑构件将框架与模片连接。 当投影到垂直于与支撑构件附接到框架的侧面的垂直平面时，支撑构件和垂直轴之间的偏移角小于45度。

公开(公告)号：US08163643B1

公开(公告)日：2012-04-24

申请号：US12773477

申请日：2010-05-04

申请人： Maurice O. Othieno ,  Ramaswamy Ranganathan ,  Frederick E. Beville ,  David A. Pruitt ,  William D. Griffitts

发明人： Maurice O. Othieno ,  Ramaswamy Ranganathan ,  Frederick E. Beville ,  David A. Pruitt ,  William D. Griffitts

IPC分类号： H01L21/44

CPC分类号： H01L24/32 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32052 ,  H01L2224/32057 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83815 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3656 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/3512

摘要： A semiconductor device is disclosed that has a die and a substrate having a die attachment area with a perimeter. A layer of solder connects the substrate and the die, the solder layer having at least one vent channel connected to the perimeter of the die attachment area, wherein the maximum distance from any point in the solder layer to the nearest free surface of the solder at a vent channel or at the perimeter of the die is less than the distance from the center of the die to the nearest edge of the die.

摘要翻译： 公开了一种半导体器件，其具有管芯和具有周边的管芯附接区域的衬底。 焊料层连接衬底和管芯，焊料层具有连接到管芯附接区域的周边的至少一个排气通道，其中从焊料层中的任何点到焊料最近的自由表面的最大距离 排气通道或模具周边处的距离小于从模具中心到模具最近边缘的距离。

公开(公告)号：US5518684A

公开(公告)日：1996-05-21

申请号：US439115

申请日：1995-05-10

申请人： David A. Pruitt

发明人： David A. Pruitt

IPC分类号： H01L21/48 ,  H01L23/495 ,  B22F5/00 ,  B22F3/02

CPC分类号： H01L21/4821 ,  H01L23/49568 ,  H01L23/49579 ,  H01L2924/0002

摘要： A lead frame for use in an integrated circuit package is herein disclosed wherein the lead frame is produced by molding an electrically conductive material into a desired lead frame shape. There is also disclosed several possible arrangements for a lead frame produced using the molding method including, protrusions on the lead frame adapted to provide a mechanical connection to the integrated circuit package, a heat sink molded as an integral part of the lead frame with heat dissipating characteristics specific to the application in which the lead frame will be used, and an arrangement which provides a heat conducting portion adapted to thermally connect a component attached to the lead frame to an external heat sink.

摘要翻译： 本文公开了一种用于集成电路封装的引线框架，其中引线框架通过将导电材料模制成所需的引线框架形状来制造。 还公开了使用模制方法制造的引线框架的几种可能的布置，包括：引线框架上的凸起适于提供与集成电路封装件的机械连接;散热器，其作为引线框架的整体部分被模制成散热 特征于使用引线框架的应用的特征，以及提供适于将附接到引线框架的部件热连接到外部散热器的导热部分的布置。