Abstract:
Methods and apparatus for distressing a wooden plank give the plank an antique, aged appearance. The preferred method includes four independent steps. The plank is run through an inventive machine operative to impart a random saw blade distressing on the plank. This step is preferably carried out as a single stream in a machine having a plurality of saw arbors, each driven by its own rotating cam. To impart the most random pattern, each cam preferably has a different shape and rotates at a different speed. The plank is preferably fed into a roller having raised portions operative to produce random dents and impressions into the plank. This step is preferably carried out in multiple streams using a machine having a large roller or drum with protrusions affixed thereto. The plank is then fed into a profile sander having one or more wire wheels operative to apply a surface texture to the plank, then sanding and smoothing the plank with abrasive wheels. Finally, a surface finish is applied to the plank which simulates an antique wood floor. In the preferred embodiment, the edges and ends of the plank are beveled and stained darker than the rest of the plank. In addition, assuming the plank has areas of hard grain and areas of soft grain, the technique preferably includes the steps of darkening the soft grain while lightening the hard grain to yield an aged appearance.
Abstract:
A dual-sided circuit board module designed for an operating position that is not perpendicular to a system motherboard will be coupled to the motherboard by leads having at least two different lengths. Because leads of differing lengths have differing associated inductance, the operating characteristics of the leads and therefore the devices coupled to the leads will differ. In order to improve the operating characteristics of the module, integrated circuit packages are selected based on the inductive (and possibly other) qualities of the leads to which the respective packages are coupled. In one embodiment, leads having a larger inductance are coupled to integrated circuit (IC) packages having a smaller inductance and vice versa, which allows the inductive characteristics of the various components of the module to have more closely matching inductive characteristics than would otherwise be possible.