公开(公告)号：US20160043485A1

公开(公告)日：2016-02-11

申请号：US14817791

申请日：2015-08-04

Applicant: Delphi International Operations Luxembourg S.A.R.L.

Inventor： Peter Stoermer

IPC: H01R12/70

CPC classification number: H01R12/7076 ,  H01R12/7088 ,  H01R12/714 ,  H01R12/75 ,  H01R12/88 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/117 ,  H05K2201/066 ,  H05K2201/10356 ,  H05K2201/10393 ,  H05K2201/10598 ,  H05K2201/10969

Abstract: A connection arrangement includes a printed circuit board, a semiconductor component arranged on a first surface, a first side, of the printed circuit board, a connection means arranged on a second surface, a second side, of the printed circuit board, a contact element contactable with the connection means and an electrical line, wherein the connection means is arranged opposite the semiconductor component.

Abstract translation: 连接装置包括印刷电路板，布置在印刷电路板的第一表面，第一侧的半导体部件，布置在印刷电路板的第二表面，第二侧上的连接装置，接触元件 可与所述连接装置和电线接触，其中所述连接装置布置成与所述半导体部件相对。

公开(公告)号：US20170273218A1

公开(公告)日：2017-09-21

申请号：US15451690

申请日：2017-03-07

Applicant: Delphi International Operations Luxembourg S.A.R.L.

Inventor： Peter Stoermer ,  Marcel Fruend

IPC: H05K7/20 ,  H05K1/02 ,  H05K5/03 ,  H05K7/14

CPC classification number: H05K7/20436 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/433 ,  H05K1/0203 ,  H05K5/03 ,  H05K7/1427 ,  H05K7/20418 ,  H05K7/20445 ,  H05K7/20854 ,  H05K2201/066

Abstract: An electronic device for motor vehicles comprises a heat-conducting housing containing a printed circuit board and an element producing heat mounted on the printed circuit board. The housing comprises a housing base on which the printed circuit board is mounted and comprises a cover opposite to the housing base. A first heat-dissipating metal structure is mounted on the element producing heat, and a second heat-dissipating metal structure, formed as part of the cover of the housing and protruding into the housing, is coupled with the first heat-dissipating metal structure, in such a manner as to facilitate the dissipation of the thermal energy from the element producing heat towards the outside of the housing.

公开(公告)号：US09620873B2

公开(公告)日：2017-04-11

申请号：US14817791

申请日：2015-08-04

Applicant: Delphi International Operations Luxembourg S.A.R.L.

Inventor： Peter Stoermer

IPC: H05K7/20 ,  H01R12/70 ,  H01R12/71 ,  H01R12/75 ,  H05K1/02 ,  H05K1/11 ,  H01R12/88

CPC classification number: H01R12/7076 ,  H01R12/7088 ,  H01R12/714 ,  H01R12/75 ,  H01R12/88 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/117 ,  H05K2201/066 ,  H05K2201/10356 ,  H05K2201/10393 ,  H05K2201/10598 ,  H05K2201/10969

Abstract: A connection arrangement includes a printed circuit board, a semiconductor component arranged on a first surface, a first side, of the printed circuit board, a connection means arranged on a second surface, a second side, of the printed circuit board, a contact element contactable with the connection means and an electrical line, wherein the connection means is arranged opposite the semiconductor component.