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    PHOTONICS CHIP AND OPTICAL APPARATUS INCLUDING THE SAME
    1.
    发明申请
    PHOTONICS CHIP AND OPTICAL APPARATUS INCLUDING THE SAME 有权
    光电芯片和光学设备，包括它们

    公开(公告)号：US20120121218A1

    公开(公告)日：2012-05-17

    申请号：US13190403

    申请日：2011-07-25

    Applicant: Do Won Kim ,  Gyungock Kim ,  JunYeong Lee

    Inventor： Do Won Kim ,  Gyungock Kim ,  JunYeong Lee

    IPC: G02B6/12

    CPC classification number: G02B6/4292 ,  G02B6/3644 ,  G02B6/3652 ,  G02B6/3885

    Abstract: Provided are a photonics chip and an optical apparatus including the same. The chip may include a substrate, an optical waveguide, an optical coupler, and a plurality of alignment units. The optical waveguide is formed on the substrate. The optical coupler is formed at the optical waveguide. The alignment units align an optical connector which fixes at least one optical fiber coupled to the optical coupler, on the substrate.

    Abstract translation: 提供了一种光子学芯片和包括其的光学装置。 芯片可以包括基板，光波导，光耦合器和多个对准单元。 光波导形成在基板上。 光耦合器形成在光波导处。 对准单元对准在衬底上固定耦合到光耦合器的至少一个光纤的光连接器。

    Optical connector and optical device having the same
    2.
    发明授权
    Optical connector and optical device having the same 有权
    光连接器和具有该光连接器的光学装置

    公开(公告)号：US09063302B2

    公开(公告)日：2015-06-23

    申请号：US13443843

    申请日：2012-04-10

    Applicant: Do Won Kim ,  Gyungock Kim

    Inventor： Do Won Kim ,  Gyungock Kim

    IPC: G02B6/36 ,  G02B6/38 ,  G02B6/42 ,  G02B6/12

    CPC classification number: G02B6/3897 ,  G02B6/423 ,  G02B6/4249 ,  G02B6/4292 ,  G02B2006/12107

    Abstract: Provided are an optical connector capable of improving optical alignment efficiency and an optical device having the same. The connector may include a body having a top surface and a bottom surface facing each other, through holes penetrating the body to connect the top and bottom surfaces, and alignment keys provided on at least side surface of the body to be parallel to the through holes.

    Abstract translation: 提供能够提高光取向效率的光连接器和具有该光连接器的光学装置。 连接器可以包括具有顶表面和底表面彼此面对的主体，穿过穿过主体以连接顶表面和底表面的孔以及设置在主体的至少侧表面上以与通孔平行的对准键 。

    Optical coupling devices and silicon photonics chips having the same
    3.
    发明授权
    Optical coupling devices and silicon photonics chips having the same 有权
    具有相同光耦合器件和硅光子芯片

    公开(公告)号：US09025920B2

    公开(公告)日：2015-05-05

    申请号：US13620560

    申请日：2012-09-14

    Applicant: Do Won Kim ,  Gyungock Kim

    Inventor： Do Won Kim ,  Gyungock Kim

    IPC: G02B6/26 ,  G02B6/42 ,  G02B6/30 ,  G02B6/122

    CPC classification number: G02B6/305 ,  G02B6/1228 ,  G02B2006/12061

    Abstract: Provided are optical coupling devices and silicon photonics chips having the same. the optical coupling device may include a lower layer having a first region and a second region, a first core layer disposed on the lower layer, the first core layer including first and second waveguides disposed on the first and second regions, respectively, a clad layer covering the first waveguide, and a second core layer interposed between the clad layer and the lower layer to cover the second waveguide. The second waveguide has a width decreasing with increasing distance from the first region and a vertical thickness greater than that of the first waveguide.

    Abstract translation: 提供了具有其的光耦合器件和硅光子芯片。 光耦合装置可以包括具有第一区域和第二区域的下层，设置在下层上的第一芯层，第一芯层分别包括设置在第一和第二区域上的第一和第二波导，包层 覆盖第一波导，以及插入在包层和下层之间以覆盖第二波导的第二芯层。 第二波导的宽度随着距离第一区域的距离增加而减小，并且垂直厚度大于第一波导的垂直厚度。

    OPTICAL COUPLING DEVICES AND SILICON PHOTONICS CHIPS HAVING THE SAME
    6.
    发明申请
    OPTICAL COUPLING DEVICES AND SILICON PHOTONICS CHIPS HAVING THE SAME 有权
    光耦合器件和具有相同功能的硅光电子器件

    公开(公告)号：US20130156370A1

    公开(公告)日：2013-06-20

    申请号：US13620560

    申请日：2012-09-14

    Applicant: Do Won Kim ,  Gyungock Kim

    Inventor： Do Won Kim ,  Gyungock Kim

    IPC: G02B6/12 ,  G02B6/26

    CPC classification number: G02B6/305 ,  G02B6/1228 ,  G02B2006/12061

    Abstract: Provided are optical coupling devices and silicon photonics chips having the same. the optical coupling device may include a lower layer having a first region and a second region, a first core layer disposed on the lower layer, the first core layer including first and second waveguides disposed on the first and second regions, respectively, a clad layer covering the first waveguide, and a second core layer interposed between the clad layer and the lower layer to cover the second waveguide. The second waveguide has a width decreasing with increasing distance from the first region and a vertical thickness greater than that of the first waveguide.

    Abstract translation: 提供了具有其的光耦合器件和硅光子芯片。 光耦合装置可以包括具有第一区域和第二区域的下层，设置在下层上的第一芯层，第一芯层分别包括设置在第一和第二区域上的第一和第二波导，包层 覆盖第一波导，以及插入在包层和下层之间以覆盖第二波导的第二芯层。 第二波导的宽度随着距离第一区域的距离增加而减小，并且垂直厚度大于第一波导的垂直厚度。

    Optical Printed Circuit Board and An Optical Module Connected to the Optical Printed Circuit Board
    9.
    发明申请
    Optical Printed Circuit Board and An Optical Module Connected to the Optical Printed Circuit Board 审中-公开
    光学印刷电路板和连接到光学印刷电路板的光学模块

    公开(公告)号：US20090214158A1

    公开(公告)日：2009-08-27

    申请号：US12346305

    申请日：2008-12-30

    Applicant: Tae Woo Lee ,  Hyo Hoon Park ,  Do Won Kim

    Inventor： Tae Woo Lee ,  Hyo Hoon Park ,  Do Won Kim

    IPC: G02B6/12 ,  G02B6/38 ,  B23P11/00

    CPC classification number: G02B6/43 ,  G02B6/3608 ,  G02B6/3885 ,  G02B6/3897 ,  H05K1/0274 ,  Y10T29/49826

    Abstract: An optical printed circuit board having an optical waveguide of at least one channel formed therein is provided. The optical waveguide of the at least one channel is stacked in the optical printed circuit board, and has both ends exposed on a surface of the optical printed circuit board and a predetermined length. An optical module is provided which can be optically aligned with the optical printed circuit board or another optical component through guide pins inserted into guide holes.

    Abstract translation: 提供了具有形成在其中的至少一个通道的光波导的光学印刷电路板。 将至少一个通道的光波导堆叠在光学印刷电路板中，并且其两端都露出在光学印刷电路板的表面上并具有预定的长度。 提供了一种光学模块，其可以通过插入引导孔的引导销与光学印刷电路板或另一个光学部件光学对准。

    Optical interconnection system using optical waveguide-integrated optical printed circuit board
    10.
    发明申请
    Optical interconnection system using optical waveguide-integrated optical printed circuit board 失效
    光互连系统采用光波导集成光电印刷电路板

    公开(公告)号：US20100232741A1

    公开(公告)日：2010-09-16

    申请号：US12227995

    申请日：2008-09-22

    Applicant: Do Won Kim ,  Tae Woo Lee ,  Hyo Hoon Park

    Inventor： Do Won Kim ,  Tae Woo Lee ,  Hyo Hoon Park

    IPC: G02B6/12 ,  G02B6/43

    CPC classification number: G02B6/43 ,  G02B6/4214 ,  H05K1/0274

    Abstract: An optical interconnection system is provided. The optical interconnection system includes an optical printed circuit board (PCB) that includes transmitter-unit and receiver-unit optical interconnection blocks for bending an optical path by a predetermined angle, an one-unit optical waveguide including an optical waveguide which is inserted into each of the optical interconnection blocks so as to connect optical paths of the transmitter-unit and receiver-unit optical interconnection blocks, and a PCB having the one-unit optical waveguide integrated therein; a light emitting element that is formed in-line with the optical waveguide on an upper surface of the transmitter-unit optical interconnection block exposed to an upper surface of the optical PCB; a driver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light emitting element and the optical PCB; a light receiving element that is formed in-line with the optical waveguide on an upper surface of the receiver-unit optical interconnection block exposed to the upper surface of the optical PCB; and a receiver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light receiving element and the optical PCB. The upper surfaces of the respective optical interconnection blocks are substantially aligned with the upper surface of the PCB

    Abstract translation: 提供光互连系统。 光互连系统包括光学印刷电路板（PCB），其包括用于将光路弯曲预定角度的发射器单元和接收器单元光学互连块，包括插入每个光路中的光波导的单个单元光波导 以连接发射机单元和接收机单元光学互连块的光路，以及将其中集成有单一单元光波导的PCB连接在一起; 在与所述光学PCB的上表面露出的所述发射单元光互连块的上表面上与所述光波导成一行的发光元件; 驱动器集成电路，其形成在所述光学PCB的上表面上并电连接到所述发光元件和所述光学PCB; 光接收元件，其在与所述光学PCB的上表面接触的所述接收器单元光互连块的上表面上与所述光波导成一直线; 以及形成在光学PCB的上表面并电连接到光接收元件和光学PCB的接收器集成电路。 各个光互连块的上表面基本上与PCB的上表面对齐

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