Single mode surface emitting laser
    1.
    发明授权
    Single mode surface emitting laser 有权
    单模表面发射激光器

    公开(公告)号:US06343090B1

    公开(公告)日:2002-01-29

    申请号:US09141794

    申请日:1998-08-28

    Abstract: A single mode surface emitting laser and its manufacturing method are provided. The surface emitting laser which has a characteristic of single transverse mode radiation in the broad region using reflectivity distribution of a reflector layer with an antiguide clad is provided. The single mode surface emitting laser comprises an n-type semiconductor substrate having an n-type lower electrode and an antireflection film thereunder, a laser pillar formed on the semiconductor substrate, the laser pillar having a bottom DBR, an active layer and a top DBR, a control layer formed on said laser pillar, the control layer consisting of a compound semiconductor of which energy gap is larger than radiation wavelength, an antiguide clad layer covering an outer portion of the laser pillar including the control layer and has higher reflective index than those of the active layer or the top DBR forming the laser pillar, a top electrode formed on the antiguide clad layer and the control layer, and an insulation film between the antiguide clad layer and the top electrode.

    Abstract translation: 提供单模表面发射激光器及其制造方法。 提供了具有使用具有防反射层的反射层的反射率分布的广域中具有单横模辐射特性的表面发射激光器。 单模面发光激光器包括在其上具有n型下电极和抗反射膜的n型半导体衬底,形成在半导体衬底上的激光柱,具有底部DBR的激光柱,有源层和顶部DBR 形成在所述激光柱上的控制层,所述控制层由能隙大于辐射波长的化合物半导体构成,覆盖所述控制层的所述激光柱的外部的反射覆盖层具有比所述控制层更高的反射指数 形成激光柱的有源层或顶部DBR,形成在防反射覆层和控制层上的顶部电极,以及在防反射覆盖层和顶部电极之间的绝缘膜。

    Compact optical logic operator array
    2.
    发明授权
    Compact optical logic operator array 失效
    紧凑型光逻辑运算器阵列

    公开(公告)号:US5770851A

    公开(公告)日:1998-06-23

    申请号:US713535

    申请日:1996-09-13

    CPC classification number: G02F3/028 G02B6/43

    Abstract: An improved parallel optical logic operator provides a path for light to pass through substrates in which a light source and an optical logic device are arranged. An optical logic device operates by transmission of light forwarded to a predetermined direction. This increases integration efficiency of the system by eliminating optical parts for changing the light path. A unit chip includes a laser array for generating a predetermined light in accordance with an electrical signal for a logic process, a laser array substrate on which via holes are formed for passing light, a microlens array for converting the light beam emitted from each laser device of the laser array into a parallel light beam for passing through the via hole, and an optical logic circuit array formed with a combination of an S-SEED which performs a logic function by transmission of the light signal through an optical window in S-SEED. A plurality of unit chips are laminated so that the light emitted from the laser device of one of the unit chips passes through an optical logic circuit of a corresponding unit chip and can be made incident on the optical logic circuit in the next unit chip through a via hole.

    Abstract translation: 改进的并行光逻辑运算器提供光通过其中布置光源和光逻辑器件的衬底的路径。 光逻辑器件通过传输转发到预定方向的光来操作。 这通过消除用于改变光路的光学部件来提高系统的集成效率。 单元芯片包括用于根据用于逻辑处理的电信号产生预定光的激光阵列,其上形成有用于通过光的通孔的激光阵列基板,用于转换从每个激光装置发射的光束的微透镜阵列 的激光器阵列的平行光束通过通孔;以及光学逻辑电路阵列,其形成有S-SEED的组合,S-SEED通过S-SEED中的光学窗口传输光信号来执行逻辑功能 。 多个单位芯片被层叠,使得从单个芯片之一的激光装置发射的光通过相应的单元芯片的光学逻辑电路,并且可以通过一个单元芯片入射到下一个单元芯片中的光学逻辑电路上 通孔。

    USB compatible apparatus for connecting between optical USB device and electrical USB device
    3.
    发明授权
    USB compatible apparatus for connecting between optical USB device and electrical USB device 有权
    USB兼容设备,用于连接光学USB设备和电气USB设备

    公开(公告)号:US08224185B2

    公开(公告)日:2012-07-17

    申请号:US12635036

    申请日:2009-12-10

    CPC classification number: G06F13/409

    Abstract: A USB compatible apparatus for connecting an optical universal serial bus (USB) (or an optical serial bus; OSB) device and an electrical USB device, and a structure of the apparatus are provided. More particularly, a USB compatible apparatus for guaranteeing a connection between an optical USB device for inputting/outputting an optical signal and an electrical USB device for inputting/outputting an electrical signal, for example, signal transmission and reception between an electrical USB device (e.g., an electrical USB memory) and an optical USB device (e.g., a computer) having an optical USB port, and a structure of the USB compatible apparatus (a first exemplary embodiment), and a USB compatible apparatus for guaranteeing signal transmission and reception between an optical USB device (e.g., an optical USB memory) and an electrical USB device (e.g., a portable telephone) having an electrical USB port, and a structure of the USB compatible apparatus (a second exemplary embodiment) are provided.

    Abstract translation: 提供了用于连接光通用串行总线(USB)(或光串行总线,OSB)设备和电USB设备的USB兼容设备以及该设备的结构。 更具体地说,一种用于保证用于输入/输出光信号的光学USB设备与用于输入/输出电信号的电USB设备之间的连接的USB兼容设备,例如电USB设备之间的信号传输和接收(例如, ,USB电子USB存储器)和具有光学USB端口的光学USB设备(例如,计算机),以及USB兼容设备(第一示例性实施例)的结构,以及用于保证在USB兼容设备之间的信号发送和接收的USB兼容设备 提供具有电USB端口的光学USB设备(例如,光学USB存储器)和具有USB的USB设备(例如,便携式电话),以及USB兼容设备(第二示例性实施例)的结构。

    OPTICAL TRANSMISSION AND RECEPTION CONTROL APPARATUS
    4.
    发明申请
    OPTICAL TRANSMISSION AND RECEPTION CONTROL APPARATUS 审中-公开
    光传输和接收控制装置

    公开(公告)号:US20110142454A1

    公开(公告)日:2011-06-16

    申请号:US12696621

    申请日:2010-01-29

    CPC classification number: H04B10/032

    Abstract: An optical transmission and reception control apparatus is provided. The present invention relates to an optical transmission and reception control apparatus for enabling smooth optical transmission and reception when a photo diode and/or a laser diode fail. The apparatus includes a plurality of laser diodes, a laser driver, a first switching unit, a plurality of photo diodes, an optical power amplifier, a second switching unit, an optical power detection module, and a control module.

    Abstract translation: 提供光发送和接收控制装置。 本发明涉及光发射和接收控制装置,用于当光电二极管和/或激光二极管失效时能够平滑地进行光传输和接收。 该装置包括多个激光二极管,激光驱动器,第一开关单元,多个光电二极管,光功率放大器,第二开关单元,光功率检测模块和控制模块。

    EXPRESS INTERFACE APPARATUS USING OPTICAL CONNECTION
    5.
    发明申请
    EXPRESS INTERFACE APPARATUS USING OPTICAL CONNECTION 审中-公开
    使用光学连接的EXPRESS接口设备

    公开(公告)号:US20110116807A1

    公开(公告)日:2011-05-19

    申请号:US12696668

    申请日:2010-01-29

    CPC classification number: H04B10/801

    Abstract: An express interface apparatus using an optical connection is provided. The apparatus connects between a central processing unit (CPU) in a computer system and an external device supporting optical signal transfer using a peripheral component interconnect express (PCIE) supporting high-speed signal processing. The apparatus includes an optical connection module for connecting the external device so that an optical signal is input/output; an optical-to-electrical conversion module for converting the optical signal from the optical connection module into an electrical signal or converting an electrical signal into an optical signal; a signal processing module connected to the optical-to-electrical conversion module for performing signal processing to divide or merge the electrical signal; and a PCIE control module for controlling a processed signal from the signal processing module to deliver the signal to the CPU via a PCIE slot and controlling high-speed data transmitted and received between the CPU and the external device, such that a signal can be transmitted and received without a distortion or bottleneck phenomenon in high-speed data transfer.

    Abstract translation: 提供了一种使用光学连接的快速接口装置。 该装置连接在计算机系统中的中央处理单元(CPU)和支持光信号传输的外部设备之间,该外部设备使用支持高速信号处理的外围组件互连快速(PCIE)。 该装置包括用于连接外部设备以使光信号被输入/输出的光学连接模块; 光电转换模块,用于将来自光连接模块的光信号转换为电信号或将电信号转换为光信号; 连接到光电转换模块的信号处理模块,用于执行信号处理以分割或合并电信号; 以及PCIE控制模块,用于控制来自信号处理模块的经处理的信号,以经由PCIE插槽向CPU发送信号,并控制在CPU和外部设备之间发送和接收的高速数据,使得可以发送信号 并在高速数据传输中没有发生失真或瓶颈现象。

    Optical interconnection system using optical waveguide-integrated optical printed circuit board
    6.
    发明申请
    Optical interconnection system using optical waveguide-integrated optical printed circuit board 失效
    光互连系统采用光波导集成光电印刷电路板

    公开(公告)号:US20100232741A1

    公开(公告)日:2010-09-16

    申请号:US12227995

    申请日:2008-09-22

    CPC classification number: G02B6/43 G02B6/4214 H05K1/0274

    Abstract: An optical interconnection system is provided. The optical interconnection system includes an optical printed circuit board (PCB) that includes transmitter-unit and receiver-unit optical interconnection blocks for bending an optical path by a predetermined angle, an one-unit optical waveguide including an optical waveguide which is inserted into each of the optical interconnection blocks so as to connect optical paths of the transmitter-unit and receiver-unit optical interconnection blocks, and a PCB having the one-unit optical waveguide integrated therein; a light emitting element that is formed in-line with the optical waveguide on an upper surface of the transmitter-unit optical interconnection block exposed to an upper surface of the optical PCB; a driver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light emitting element and the optical PCB; a light receiving element that is formed in-line with the optical waveguide on an upper surface of the receiver-unit optical interconnection block exposed to the upper surface of the optical PCB; and a receiver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light receiving element and the optical PCB. The upper surfaces of the respective optical interconnection blocks are substantially aligned with the upper surface of the PCB

    Abstract translation: 提供光互连系统。 光互连系统包括光学印刷电路板(PCB),其包括用于将光路弯曲预定角度的发射器单元和接收器单元光学互连块,包括插入每个光路中的光波导的单个单元光波导 以连接发射机单元和接收机单元光学互连块的光路,以及将其中集成有单一单元光波导的PCB连接在一起; 在与所述光学PCB的上表面露出的所述发射单元光互连块的上表面上与所述光波导成一行的发光元件; 驱动器集成电路,其形成在所述光学PCB的上表面上并电连接到所述发光元件和所述光学PCB; 光接收元件,其在与所述光学PCB的上表面接触的所述接收器单元光互连块的上表面上与所述光波导成一直线; 以及形成在光学PCB的上表面并电连接到光接收元件和光学PCB的接收器集成电路。 各个光互连块的上表面基本上与PCB的上表面对齐

    Packaging apparatus for optical interconnection on optical printed circuit board
    7.
    发明授权
    Packaging apparatus for optical interconnection on optical printed circuit board 有权
    光学印刷电路板上光学互连的包装设备

    公开(公告)号:US07239767B2

    公开(公告)日:2007-07-03

    申请号:US10795612

    申请日:2004-03-08

    CPC classification number: G02B6/42 G02B6/4214 H05K1/0274

    Abstract: A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.

    Abstract translation: 一种用于光学PCB上的光学互连的封装装置,包括:第一基板,其具有形成在其中的通孔,并且其中形成有光波导;光学互连块,其下端插入通孔的反射平面;第二基板 翻转接合到第一基板的上表面,以及光学活性元件,其被翻转接合到第二基板的下表面并对准以进行光通信。

    Method for making a vertical resonant surface-emitting micro-laser
    9.
    发明授权
    Method for making a vertical resonant surface-emitting micro-laser 失效
    制造垂直共振表面发射微激光器的方法

    公开(公告)号:US5554061A

    公开(公告)日:1996-09-10

    申请号:US359200

    申请日:1994-12-19

    CPC classification number: H01S5/18347 H01S2301/176 H01S5/0425 H01S5/423

    Abstract: The present invention is a vertical resonant surface-emitting laser, and more particularly, a method for making a micro-laser that can be emitted to the upper surface of resonance structures by forming electrodes on the side surface of the resonance structures. By forming the electrodes injecting the current to the active layer on the side surface of resonators, the electrodes may be formed more easily on the fine micro-laser. Moreover, the current is more efficiently injected to the inside the active layer due to the side electrode surrounding an upper glass layer and emitter, and the laser may be operated even with a smaller start current, and serial resistance of the resonators may be reduced.

    Abstract translation: 本发明是一种垂直共振表面发射激光器,更具体地说,涉及一种通过在谐振结构的侧面上形成电极而能够发射到谐振结构的上表面的微型激光器的制造方法。 通过形成将电流注入谐振器侧面的有源层的电极,可以在微细的微激光器上更容易地形成电极。 此外,由于侧电极围绕上玻璃层和发射极,电流更有效地注入到有源层的内部,并且激光器甚至可以以更小的启动电流工作,并且谐振器的串联电阻可能降低。

    Optical interconnection system using optical printed circuit board having one-unit optical waveguide integrated therein
    10.
    发明授权
    Optical interconnection system using optical printed circuit board having one-unit optical waveguide integrated therein 失效
    使用其中集成有单位光波导的光学印刷电路板的光互连系统

    公开(公告)号:US08285087B2

    公开(公告)日:2012-10-09

    申请号:US12227995

    申请日:2008-09-22

    CPC classification number: G02B6/43 G02B6/4214 H05K1/0274

    Abstract: An optical interconnection system is provided and includes an optical printed circuit board (PCB) that includes transmitter-unit and receiver-unit optical interconnection blocks for bending an optical path by a predetermined angle, a one-unit optical waveguide including an optical waveguide which is inserted into each of the optical interconnection blocks so as to connect optical paths of the transmitter-unit and receiver-unit optical interconnection blocks, and a PCB having the one-unit optical waveguide integrated therein; a light emitting element that is formed in-line with the optical waveguide on an upper surface of the transmitter-unit optical interconnection block exposed to an upper surface of the optical PCB; a driver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light emitting element and the optical PCB; a light receiving element that is formed in-line with the optical waveguide on an upper surface of the receiver-unit optical interconnection block exposed to the upper surface of the optical PCB; and a receiver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light receiving element and the optical PCB.

    Abstract translation: 提供了一种光学互连系统,其包括:光学印刷电路板(PCB),其包括用于将光路弯曲预定角度的发射器单元和接收器单元光学互连块,包括光波导的单个单元光波导, 插入到每个光互连块中,以便连接发射机单元和接收机单元光互连块的光路,以及集成有单一单元光波导的PCB; 在与所述光学PCB的上表面露出的所述发射单元光互连块的上表面上与所述光波导成一行的发光元件; 驱动器集成电路,其形成在所述光学PCB的上表面上并电连接到所述发光元件和所述光学PCB; 光接收元件,其在与所述光学PCB的上表面接触的所述接收器单元光互连块的上表面上与所述光波导成一直线; 以及形成在光学PCB的上表面并电连接到光接收元件和光学PCB的接收器集成电路。

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