Abstract:
A single mode surface emitting laser and its manufacturing method are provided. The surface emitting laser which has a characteristic of single transverse mode radiation in the broad region using reflectivity distribution of a reflector layer with an antiguide clad is provided. The single mode surface emitting laser comprises an n-type semiconductor substrate having an n-type lower electrode and an antireflection film thereunder, a laser pillar formed on the semiconductor substrate, the laser pillar having a bottom DBR, an active layer and a top DBR, a control layer formed on said laser pillar, the control layer consisting of a compound semiconductor of which energy gap is larger than radiation wavelength, an antiguide clad layer covering an outer portion of the laser pillar including the control layer and has higher reflective index than those of the active layer or the top DBR forming the laser pillar, a top electrode formed on the antiguide clad layer and the control layer, and an insulation film between the antiguide clad layer and the top electrode.
Abstract:
An improved parallel optical logic operator provides a path for light to pass through substrates in which a light source and an optical logic device are arranged. An optical logic device operates by transmission of light forwarded to a predetermined direction. This increases integration efficiency of the system by eliminating optical parts for changing the light path. A unit chip includes a laser array for generating a predetermined light in accordance with an electrical signal for a logic process, a laser array substrate on which via holes are formed for passing light, a microlens array for converting the light beam emitted from each laser device of the laser array into a parallel light beam for passing through the via hole, and an optical logic circuit array formed with a combination of an S-SEED which performs a logic function by transmission of the light signal through an optical window in S-SEED. A plurality of unit chips are laminated so that the light emitted from the laser device of one of the unit chips passes through an optical logic circuit of a corresponding unit chip and can be made incident on the optical logic circuit in the next unit chip through a via hole.
Abstract:
A USB compatible apparatus for connecting an optical universal serial bus (USB) (or an optical serial bus; OSB) device and an electrical USB device, and a structure of the apparatus are provided. More particularly, a USB compatible apparatus for guaranteeing a connection between an optical USB device for inputting/outputting an optical signal and an electrical USB device for inputting/outputting an electrical signal, for example, signal transmission and reception between an electrical USB device (e.g., an electrical USB memory) and an optical USB device (e.g., a computer) having an optical USB port, and a structure of the USB compatible apparatus (a first exemplary embodiment), and a USB compatible apparatus for guaranteeing signal transmission and reception between an optical USB device (e.g., an optical USB memory) and an electrical USB device (e.g., a portable telephone) having an electrical USB port, and a structure of the USB compatible apparatus (a second exemplary embodiment) are provided.
Abstract:
An optical transmission and reception control apparatus is provided. The present invention relates to an optical transmission and reception control apparatus for enabling smooth optical transmission and reception when a photo diode and/or a laser diode fail. The apparatus includes a plurality of laser diodes, a laser driver, a first switching unit, a plurality of photo diodes, an optical power amplifier, a second switching unit, an optical power detection module, and a control module.
Abstract:
An express interface apparatus using an optical connection is provided. The apparatus connects between a central processing unit (CPU) in a computer system and an external device supporting optical signal transfer using a peripheral component interconnect express (PCIE) supporting high-speed signal processing. The apparatus includes an optical connection module for connecting the external device so that an optical signal is input/output; an optical-to-electrical conversion module for converting the optical signal from the optical connection module into an electrical signal or converting an electrical signal into an optical signal; a signal processing module connected to the optical-to-electrical conversion module for performing signal processing to divide or merge the electrical signal; and a PCIE control module for controlling a processed signal from the signal processing module to deliver the signal to the CPU via a PCIE slot and controlling high-speed data transmitted and received between the CPU and the external device, such that a signal can be transmitted and received without a distortion or bottleneck phenomenon in high-speed data transfer.
Abstract:
An optical interconnection system is provided. The optical interconnection system includes an optical printed circuit board (PCB) that includes transmitter-unit and receiver-unit optical interconnection blocks for bending an optical path by a predetermined angle, an one-unit optical waveguide including an optical waveguide which is inserted into each of the optical interconnection blocks so as to connect optical paths of the transmitter-unit and receiver-unit optical interconnection blocks, and a PCB having the one-unit optical waveguide integrated therein; a light emitting element that is formed in-line with the optical waveguide on an upper surface of the transmitter-unit optical interconnection block exposed to an upper surface of the optical PCB; a driver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light emitting element and the optical PCB; a light receiving element that is formed in-line with the optical waveguide on an upper surface of the receiver-unit optical interconnection block exposed to the upper surface of the optical PCB; and a receiver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light receiving element and the optical PCB. The upper surfaces of the respective optical interconnection blocks are substantially aligned with the upper surface of the PCB
Abstract:
A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.
Abstract:
A method of manufacturing a polarization switching surface-emitting laser in which a laser resonance wavelength depends on changing the polarization of the laser, by changing the refractivity of a compound semiconductor mirror layer of the laser depending on polarizations using an electro-optic effect of compound semiconductor materials such as GsAs and applying an electric field thereto.
Abstract:
The present invention is a vertical resonant surface-emitting laser, and more particularly, a method for making a micro-laser that can be emitted to the upper surface of resonance structures by forming electrodes on the side surface of the resonance structures. By forming the electrodes injecting the current to the active layer on the side surface of resonators, the electrodes may be formed more easily on the fine micro-laser. Moreover, the current is more efficiently injected to the inside the active layer due to the side electrode surrounding an upper glass layer and emitter, and the laser may be operated even with a smaller start current, and serial resistance of the resonators may be reduced.
Abstract:
An optical interconnection system is provided and includes an optical printed circuit board (PCB) that includes transmitter-unit and receiver-unit optical interconnection blocks for bending an optical path by a predetermined angle, a one-unit optical waveguide including an optical waveguide which is inserted into each of the optical interconnection blocks so as to connect optical paths of the transmitter-unit and receiver-unit optical interconnection blocks, and a PCB having the one-unit optical waveguide integrated therein; a light emitting element that is formed in-line with the optical waveguide on an upper surface of the transmitter-unit optical interconnection block exposed to an upper surface of the optical PCB; a driver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light emitting element and the optical PCB; a light receiving element that is formed in-line with the optical waveguide on an upper surface of the receiver-unit optical interconnection block exposed to the upper surface of the optical PCB; and a receiver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light receiving element and the optical PCB.