公开(公告)号：US20220154325A1

公开(公告)日：2022-05-19

申请号：US17527228

申请日：2021-11-16

Applicant: ENTEGRIS, INC.

Inventor： Nilesh Gunda ,  Jijun Lao ,  Samuel J. Angeloni ,  Wolfram Neff

IPC: C23C14/34 ,  H01L21/285 ,  H01L21/324 ,  H01L21/02 ,  H01L23/00

Abstract: Articles and methods relating to coatings having superior plasma etch-resistance and which can prolong the life of RIE components are provided. An article has a vacuum compatible substrate and a protective film overlying at least a portion of the substrate. The film comprises a fluorinated metal oxide containing yttrium wherein the yttrium oxide is deposited using an AC power source. The film has a fluorine atomic % of at least 10 at a depth of 30% of the total thickness of the film and the film has no subsurface cracks below the surface of the film visible when using a laser confocal microscope to view the full depth of the film at a magnification of 1000×.

公开(公告)号：US20250109483A1

公开(公告)日：2025-04-03

申请号：US18980228

申请日：2024-12-13

Applicant: ENTEGRIS, INC.

Inventor： Nilesh Gunda ,  Jijun Lao ,  Samuel J. Angeloni ,  Wolfram Neff

IPC: C23C14/34 ,  C23C14/08 ,  C23C14/58 ,  C23C28/04 ,  H01L21/02 ,  H01L21/285 ,  H01L21/324 ,  H01L23/00

Abstract: Articles and methods relating to coatings having superior plasma etch-resistance and which can prolong the life of RIE components are provided. An article has a vacuum compatible substrate and a protective film overlying at least a portion of the substrate. The film comprises a fluorinated metal oxide containing yttrium wherein the yttrium oxide is deposited using an AC power source. The film has a fluorine atomic % of at least 10 at a depth of 30% of the total thickness of the film and the film has no subsurface cracks below the surface of the film visible when using a laser confocal microscope to view the full depth of the film at a magnification of 1000×.

公开(公告)号：US20160336210A1

公开(公告)日：2016-11-17

申请号：US15111591

申请日：2015-02-06

Applicant: ENTEGRIS, INC.

Inventor： Richard A. Cooke ,  Wolfram Neff ,  Carlo Waldfried ,  Jakub Rybczynski ,  Michael Hanagan ,  Wade Krull

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67248 ,  H01L21/6831

Abstract: An electrostatic chuck includes a ceramic structural element, at least one electrode disposed on the ceramic structural element, and a surface dielectric layer disposed over the at least one electrode, the surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface dielectric layer comprises: (i) an insulator layer of amorphous alumina, of a thickness of less than about 5 microns, disposed over the at least one electrode; and (ii) a stack of dielectric layers disposed over the insulator layer. The stack of dielectric layers includes: (a) at least one dielectric layer including aluminum oxynitride; and (b) at least one dielectric layer including at least one of silicon oxide and silicon oxynitride.

Abstract translation: 静电卡盘包括陶瓷结构元件，设置在陶瓷结构元件上的至少一个电极和设置在至少一个电极上的表面电介质层，该表面层由电极中的电压激活以形成静电电荷 将基板夹紧到静电卡盘。 所述表面介电层包括：（i）厚度小于约5微米的无定形氧化铝绝缘体层，设置在所述至少一个电极上; 和（ii）设置在绝缘体层之上的一叠电介质层。 电介质层的叠层包括：（a）至少一个介电层，包括氮氧化铝; 和（b）至少一个包括氧化硅和氮氧化硅中的至少一种的电介质层。