公开(公告)号：US20180044800A1

公开(公告)日：2018-02-15

申请号：US15550630

申请日：2016-02-13

Applicant: Entegris, Inc.

Inventor： Bryan C. Hendrix ,  David W. Peters ,  Weimin Li ,  Carlo Waldfried ,  Richard A. Cooke ,  Nilesh Gunda ,  I-Kuan Lin

IPC: C23C28/04 ,  C23C16/40 ,  C23C16/455 ,  C23C14/24 ,  C23C14/50

CPC classification number: C23C28/044 ,  C23C14/243 ,  C23C14/50 ,  C23C16/042 ,  C23C16/403 ,  C23C16/404 ,  C23C16/405 ,  C23C16/4404 ,  C23C16/4412 ,  C23C16/45525 ,  C23C16/45555 ,  C23C16/56 ,  C23C28/042

Abstract: Coatings applicable to a variety of substrate articles, structures, materials, and equipment are described. In various applications, the substrate includes metal surface susceptible to formation of oxide, nitride, fluoride, or chloride of such metal thereon, wherein the metal surface is configured to be contacted in use with gas, solid, or liquid that is reactive therewith to form a reaction product that is deleterious to the substrate article, structure, material, or equipment. The metal surface is coated with a protective coating preventing reaction of the coated surface with the reactive gas, and/or otherwise improving the electrical, chemical, thermal, or structural properties of the substrate article or equipment. Various methods of coating the metal surface are described, and for selecting the coating material that is utilized.

公开(公告)号：US20250109483A1

公开(公告)日：2025-04-03

申请号：US18980228

申请日：2024-12-13

Applicant: ENTEGRIS, INC.

Inventor： Nilesh Gunda ,  Jijun Lao ,  Samuel J. Angeloni ,  Wolfram Neff

IPC: C23C14/34 ,  C23C14/08 ,  C23C14/58 ,  C23C28/04 ,  H01L21/02 ,  H01L21/285 ,  H01L21/324 ,  H01L23/00

Abstract: Articles and methods relating to coatings having superior plasma etch-resistance and which can prolong the life of RIE components are provided. An article has a vacuum compatible substrate and a protective film overlying at least a portion of the substrate. The film comprises a fluorinated metal oxide containing yttrium wherein the yttrium oxide is deposited using an AC power source. The film has a fluorine atomic % of at least 10 at a depth of 30% of the total thickness of the film and the film has no subsurface cracks below the surface of the film visible when using a laser confocal microscope to view the full depth of the film at a magnification of 1000×.

公开(公告)号：US20230323248A1

公开(公告)日：2023-10-12

申请号：US18124355

申请日：2023-03-21

Applicant: ENTEGRIS, INC.

Inventor： Volley Wang ,  Atanu K. Das ,  Michael L. White ,  Chun-I Lee ,  Nilesh Gunda ,  Daniela White ,  Donald Frye

IPC: C11D3/30 ,  C11D3/43 ,  C11D17/00 ,  C11D1/66 ,  C11D3/00 ,  C11D3/24 ,  C11D11/00

CPC classification number: C11D3/0042 ,  C11D1/66 ,  C11D3/245 ,  C11D3/30 ,  C11D3/43 ,  C11D11/0047 ,  C11D17/0008

Abstract: The invention provides compositions useful in post-CMP cleaning operations where ceria is present. In one aspect, the invention provides a composition comprising a reducing agent; a chelating agent; an amino(C6-C12 alkyl)alcohol; and water; wherein the composition has a pH of less than about 8. The compositions of the invention were found to show improved ceria removal on, for example, poly silicon (poly Si) substrates. Also provided is a method for cleaning a microelectronic device substrate using such compositions and a kit comprising, in one or more containers, selected components of the compositions.

公开(公告)号：US20220298639A1

公开(公告)日：2022-09-22

申请号：US17696101

申请日：2022-03-16

Applicant: ENTEGRIS, INC.

Inventor： Nilesh Gunda ,  Jayasri Narayanamoorthy ,  Carlo Waldfried

IPC: C23C16/455 ,  C23C16/40 ,  C23C14/08 ,  H01L21/02 ,  C23C16/56

Abstract: Described are substrates that include high aspect ratio surfaces and non-high aspect ratio surfaces, at least two coatings, one coating at high aspect ratio surfaces and a second coating at non-high aspect ratio surfaces, and having fluorinated outer surfaces; methods of preparing these coatings; and substrates, surfaces, equipment, and components of equipment that include the coatings.

公开(公告)号：US12084778B2

公开(公告)日：2024-09-10

申请号：US16898149

申请日：2020-06-10

Applicant: Entegris, Inc.

Inventor： Bryan C. Hendrix ,  David W. Peters ,  Weimin Li ,  Carlo Waldfried ,  Richard A. Cooke ,  Nilesh Gunda ,  I-Kuan Lin

IPC: C23C28/04 ,  B01D39/20 ,  B01D67/00 ,  C23C14/24 ,  C23C14/50 ,  C23C16/04 ,  C23C16/40 ,  C23C16/44 ,  C23C16/455 ,  C23C16/56

CPC classification number: C23C28/044 ,  B01D39/2027 ,  B01D67/00 ,  C23C14/243 ,  C23C14/50 ,  C23C16/042 ,  C23C16/403 ,  C23C16/404 ,  C23C16/405 ,  C23C16/4404 ,  C23C16/4412 ,  C23C16/45525 ,  C23C16/45555 ,  C23C16/56 ,  C23C28/042 ,  B01D2239/0478 ,  B01D2239/1216

Abstract: Coatings applicable to a variety of substrate articles, structures, materials, and equipment are described. In various applications, the substrate includes metal surface susceptible to formation of oxide, nitride, fluoride, or chloride of such metal thereon, wherein the metal surface is configured to be contacted in use with gas, solid, or liquid that is reactive therewith to form a reaction product that is deleterious to the substrate article, structure, material, or equipment. The metal surface is coated with a protective coating preventing reaction of the coated surface with the reactive gas, and/or otherwise improving the electrical, chemical, thermal, or structural properties of the substrate article or equipment. Various methods of coating the metal surface are described, and for selecting the coating material that is utilized.

公开(公告)号：US20250144746A1

公开(公告)日：2025-05-08

申请号：US18900625

申请日：2024-09-27

Applicant: ENTEGRIS, INC.

Inventor： Doruk Yener ,  Jakub Rybczynski ,  Isaac J. Parker ,  Nilesh Gunda ,  Christopher J. Yannetta ,  Supil Raina ,  Chandrasekaran Venkatraman

IPC: B23K26/40 ,  B23K101/36

Abstract: Electrostatic chucks and methods for forming electrostatic chucks are provided. A method comprises obtaining a substrate comprising an etch resistant coating layer; ablating, with a laser, the etch resistant coating layer so as to remove at least a portion of the etch resistant coating layer so as to provide one or more exposed portions of the substrate; and forming an electrostatic chuck, wherein, when measuring an electrical resistance across the one or more exposed portions of the substrate between two metallized portions, the electrostatic chuck exhibits an electrical isolation of 300 GΩ or more. An electrostatic chuck comprises a substrate having at least one etch resistant coating layer comprising a laser ablated pattern, wherein the laser ablated pattern comprises one or more exposed portions of the substrate spanning distances of at least 0.5 mm.

公开(公告)号：US12270104B2

公开(公告)日：2025-04-08

申请号：US17696101

申请日：2022-03-16

Applicant: ENTEGRIS, INC.

Inventor： Nilesh Gunda ,  Jayasri Narayanamoorthy ,  Carlo Waldfried

IPC: C23C16/56 ,  C23C14/08 ,  C23C16/40 ,  C23C16/455 ,  H01L21/02

Abstract: Described are substrates that include high aspect ratio surfaces and non-high aspect ratio surfaces, at least two coatings, one coating at high aspect ratio surfaces and a second coating at non-high aspect ratio surfaces, and having fluorinated outer surfaces; methods of preparing these coatings; and substrates, surfaces, equipment, and components of equipment that include the coatings.

公开(公告)号：US10961617B2

公开(公告)日：2021-03-30

申请号：US14870981

申请日：2015-09-30

Applicant: Entegris, Inc.

Inventor： I-Kuan Lin ,  Nilesh Gunda ,  Dennis Radgowski ,  Chandra Venkatraman

IPC: C23C14/48 ,  C23C14/58 ,  C23C14/08 ,  H01J37/32

Abstract: Articles and methods relating to coatings having superior plasma etch-resistance and which can prolong the life of RIE components are provided. An article has a vacuum compatible substrate and a protective film overlying at least a portion of the substrate. The film comprises a fluorinated metal oxide containing yttrium.

公开(公告)号：US20170338082A1

公开(公告)日：2017-11-23

申请号：US15671429

申请日：2017-08-08

Applicant: Entegris, Inc.

Inventor： Nilesh Gunda

IPC: H01J37/32 ,  C23C14/00 ,  C23C14/08 ,  C23C14/06 ,  C23C14/35 ,  C23C14/34

CPC classification number: H01J37/32495 ,  C23C14/0021 ,  C23C14/0676 ,  C23C14/083 ,  C23C14/3485 ,  C23C14/35 ,  H01J37/32477 ,  Y10T428/265

Abstract: A fluorine plasma resistant coating on a substrate being a component in a semiconductor manufacturing system is disclosed. In one embodiment the composition includes an AlON coating that overlies a substrate, and an optional yttria coating layer that overlies the AlON coating, with a total coating thickness of about 5-6 microns.

公开(公告)号：US12018382B2

公开(公告)日：2024-06-25

申请号：US16123149

申请日：2018-09-06

Applicant: Entegris, Inc.

Inventor： Bryan C. Hendrix ,  David W. Peters ,  Weimin Li ,  Carlo Waldfried ,  Richard A. Cooke ,  Nilesh Gunda ,  I-Kuan Lin

IPC: C23C16/44 ,  B01D39/20 ,  B01D67/00 ,  C23C14/24 ,  C23C14/50 ,  C23C16/04 ,  C23C16/40 ,  C23C16/455 ,  C23C16/56 ,  C23C28/04

CPC classification number: C23C28/044 ,  B01D39/2027 ,  B01D67/00 ,  C23C14/243 ,  C23C14/50 ,  C23C16/042 ,  C23C16/403 ,  C23C16/404 ,  C23C16/405 ,  C23C16/4404 ,  C23C16/4412 ,  C23C16/45525 ,  C23C16/45555 ,  C23C16/56 ,  C23C28/042 ,  B01D2239/0478 ,  B01D2239/1216

Abstract: Coatings applicable to a variety of substrate articles, structures, materials, and equipment are described. In various applications, the substrate includes metal surface susceptible to formation of oxide, nitride, fluoride, or chloride of such metal thereon, wherein the metal surface is configured to be contacted in use with gas, solid, or liquid that is reactive therewith to form a reaction product that deleterious to the substrate article, structure material, or equipment. The metal surface is coated with a protective coating preventing reaction of the coated surface with the reactive gas, and/or otherwise improving the electrical, chemical, thermal, or structural properties of the substrate article or equipment. Various methods of coating the metal surface are described, and for selecting the coating material that is utilized.