公开(公告)号：US11164738B2

公开(公告)日：2021-11-02

申请号：US15874388

申请日：2018-01-18

Applicant: Entegris, Inc.

Inventor： Daniela White ,  Thomas Parson ,  Michael White ,  Emanuel I. Cooper ,  Atanu Das

IPC: C09G1/04 ,  H01L21/02 ,  H01L21/321 ,  C08L33/08 ,  C08L33/10 ,  C09G1/16

Abstract: A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The composition achieves highly efficacious removal of the ceria particles and CMP contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, or tungsten-containing materials.

公开(公告)号：US20180204736A1

公开(公告)日：2018-07-19

申请号：US15874388

申请日：2018-01-18

Applicant: Entegris, Inc.

Inventor： Daniela White ,  Thomas Parson ,  Michael White ,  Emmanuel I. Cooper ,  Atanu Das

IPC: H01L21/321 ,  C09G1/16 ,  C09G1/04 ,  C01F17/00 ,  C08L33/10 ,  C08L33/08

Abstract: A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The composition achieves highly efficacious removal of the ceria particles and CMP contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, or tungsten-containing materials.