Abstract:
The present invention has an object to provide a pattern peeling method which is excellent in peelability and causes less damage to a substrate, a method for manufacturing an electronic device, including the pattern peeling method, and an electronic device manufactured by the method for manufacturing an electronic device. The present invention includes a resist film forming step of applying an actinic ray-sensitive or radiation-sensitive resin composition onto a substrate to form a resist film; an exposing step of exposing the resist film; a developing step of developing the exposed resist film using a developing liquid containing an organic solvent to form a negative-type pattern; and a peeling step of peeling the negative-type pattern using the following liquid A or B: A: a liquid containing a sulfoxide compound and/or an amide compound; or B: a liquid containing sulfuric acid and hydrogen peroxide.
Abstract:
An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive composition which has excellent heat stability and makes it possible to achieve high sensitivity and good roughness characteristics. The actinic ray-sensitive or radiation-sensitive composition according to the present invention contains (A) a compound in which in an organic/inorganic composite composition containing a metal or metalloid element, the aggregated domain size of the metal or metalloid element is 1 to 5 nm, and 1.2 to 2.0 mol times of a carboxylic acid and/or a carboxylic acid derivative with respect to the metal or metalloid element exists to form a coordinated structure; (B) a compound (Q) capable of generating an acid upon irradiation with actinic rays or radiation; and (C) an organic solvent.
Abstract:
There are provided a pattern formation method, including: (1) forming a film using an active light-sensitive or radiation-sensitive resin composition; (2) exposing the film to active light or radiation; and (3) developing the exposed film using a developer including an organic solvent, wherein the active light-sensitive or radiation-sensitive resin composition contains a resin (A) having specific repeating units, and a crosslinking agent (C).
Abstract:
The invention provides a photosensitive resin composition that includes titanium black, a photopolymerizable compound, a resin A having an acid value of from 70 mgKOH/g to 250 mgKOH/g, a resin B having an acid value of from 26 mgKOH/g to 65 mgKOH/g, a photopolymerization initiator, and a solvent, the photopolymerization initiator including an oxime photopolymerization compound.