公开(公告)号：US20040107568A1

公开(公告)日：2004-06-10

申请号：US10310791

申请日：2002-12-06

Applicant: FormFactor, Inc.

Inventor： Igor Y. Khandros ,  Gaetan L. Mathieu ,  Carl V. Reynolds

IPC: H05K001/00 ,  B23P019/00 ,  H05K003/30

CPC classification number: G01R3/00 ,  G01R1/0433 ,  G01R1/0483 ,  G01R1/07378 ,  G01R31/2863 ,  H01L24/13 ,  H01L2224/131 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  Y10T29/49197 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/49224 ,  Y10T29/53217 ,  Y10T29/53265 ,  H01L2924/014

Abstract: A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.

Abstract translation: 互连结构廉价地制造并且容易地插入到插座中。 通过形成具有由具有与空腔对应的开口的掩模材料覆盖的空腔的牺牲基板来制造互连结构。 通过沉积导电材料，然后在开口内连接线并通过沉积更多导电材料进行另一电镀工艺来执行第一电镀工艺。 通过首先去除掩模材料和牺牲衬底来完成互连结构。 电线的端部与现在形成的接触结构相对联接到电路板。 要完成插座，支持设备耦合到电路板以保持测试的集成电路。

公开(公告)号：US20040016119A1

公开(公告)日：2004-01-29

申请号：US10202712

申请日：2002-07-24

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Carl V. Reynolds

IPC: H01R043/20 ,  H05K003/30

CPC classification number: G01R1/06744 ,  G01R1/06733 ,  G01R3/00 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/49224

Abstract: A method of making a microelectronic spring contact array comprises forming a plurality of spring contacts on a sacrificial substrate and then releasing the spring contacts from the sacrificial substrate. Each of the spring contacts has an elongated beam having a base end. The method of making the array includes attaching the spring contacts at their base ends to a base substrate after they have been released entirely from the sacrificial substrate, so that each contact extends from the base substrate to a distal end of its beams. The distal ends are aligned with a predetermined array of tip positions. In an embodiment of the invention, the spring contacts are formed by patterning contours of the spring contacts in a sacrificial layer on the sacrificial substrate. The walls of patterned recesses in the sacrificial layer define side profiles of the spring contacts, and a conductive material is deposited in the recesses to form the elongated beams of the spring contacts.

Abstract translation: 制造微电子弹簧接触阵列的方法包括在牺牲衬底上形成多个弹簧触点，然后从牺牲衬底释放弹簧触头。 每个弹簧触点具有带有基端的细长梁。 制造阵列的方法包括在它们已经从牺牲基板完全释放之后将其基端处的弹簧触点附接到基底基板，使得每个触点从基底延伸到其波束的远端。 远端与预定阵列的尖端位置对准。 在本发明的一个实施例中，通过在牺牲衬底上的牺牲层中图形地形成弹簧触点的轮廓来形成弹簧触点。 牺牲层中的图案化凹槽的壁限定弹簧触点的侧面轮廓，并且导电材料沉积在凹部中以形成弹簧触点的细长梁。