公开(公告)号：USD843996S1

公开(公告)日：2019-03-26

申请号：US29614800

申请日：2017-08-23

Applicant: GENERAL ELECTRIC COMPANY

Designer： Andrew Louis Krivonak ,  Theodore Clark Brown ,  Shreenath Shekar Perlaguri ,  Rajendra Yammanuru ,  Michael Jay Grutkowski ,  Arunpandi Radhakrishnan

公开(公告)号：US10032693B2

公开(公告)日：2018-07-24

申请号：US14918082

申请日：2015-10-20

Applicant: General Electric Company

Inventor： Andrew Louis Krivonak ,  Shreenath Shekar Perlaguri ,  Rajendra Yammanuru ,  Arunpandi Radhakrishnan ,  Theodore Clark Brown

IPC: H01L23/40 ,  H01L23/467 ,  H01L23/473 ,  B23K1/00 ,  H05K7/20

Abstract: A system includes a front plate, a manifold cover, and bridge heat sinks. The manifold cover is secured to the front plate to define a fluid distribution chamber along a front side of the front plate. The manifold cover defines a port opening through which a cooling fluid is received from outside of the manifold cover. The bridge heat sinks extend rearward from a back side of the front plate. The bridge heat sinks define fluid channels that are fluidly connected with the fluid distribution chamber through corresponding slots in the front plate. The fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.

公开(公告)号：USD802582S1

公开(公告)日：2017-11-14

申请号：US29573548

申请日：2016-08-08

Applicant: GENERAL ELECTRIC COMPANY

Designer： Andrew Louis Krivonak ,  Theodore Clark Brown ,  Shreenath Shekar Perlaguri ,  Rajendra Yammanuru ,  Michael Jay Grutkowski ,  Arunpandi Radhakrishnan

公开(公告)号：US10383261B2

公开(公告)日：2019-08-13

申请号：US15222478

申请日：2016-07-28

Applicant: General Electric Company

Inventor： Andrew Louis Krivonak ,  Theodore Clark Brown ,  Shreenath Shekar Perlaguri ,  Brian Magann Rush ,  Rajendra Yammanuru ,  Naveenan Thiagarajan ,  Arunpandi Radhakrishnan

IPC: H05K7/20 ,  H01L23/467 ,  H01L23/473

Abstract: A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.

公开(公告)号：USD825463S1

公开(公告)日：2018-08-14

申请号：US29628414

申请日：2017-12-05

Applicant: GENERAL ELECTRIC COMPANY

Designer： Andrew Louis Krivonak ,  Shreenath Shekar Perlaguri ,  Rajendra Yammanuru ,  Arunpandi Radhakrishnan

公开(公告)号：USD807824S1

公开(公告)日：2018-01-16

申请号：US29571352

申请日：2016-07-18

Applicant: GENERAL ELECTRIC COMPANY

Designer： Andrew Louis Krivonak ,  Shreenath Shekar Perlaguri ,  Rajendra Yammanuru ,  Arunpandi Radhakrishnan

公开(公告)号：US20170112020A1

公开(公告)日：2017-04-20

申请号：US14918082

申请日：2015-10-20

Applicant: General Electric Company

Inventor： Andrew Louis Krivonak ,  Shreenath Shekar Perlaguri ,  Rajendra Yammanuru ,  Arunpandi Radhakrishnan ,  Theodore Clark Brown

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H01L23/467 ,  B23K1/00 ,  B23K1/0012 ,  B23K2101/14 ,  B23K2101/36 ,  H01L23/473 ,  H05K7/20918 ,  H05K7/20927

Abstract: A system includes a front plate, a manifold cover, and bridge heat sinks. The manifold cover is secured to the front plate to define a fluid distribution chamber along a front side of the front plate. The manifold cover defines a port opening through which a cooling fluid is received from outside of the manifold cover. The bridge heat sinks extend rearward from a back side of the front plate. The bridge heat sinks define fluid channels that are fluidly connected with the fluid distribution chamber through corresponding slots in the front plate. The fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.

公开(公告)号：US20170112018A1

公开(公告)日：2017-04-20

申请号：US15222478

申请日：2016-07-28

Applicant: General Electric Company

Inventor： Andrew Louis Krivonak ,  Theodore Clark Brown ,  Shreenath Shekar Perlaguri ,  Brian Magann Rush ,  Rajendra Yammanuru ,  Naveenan Thiagarajan ,  Arunpandi Radhakrishnan

IPC: H05K7/20

CPC classification number: H05K7/20927 ,  H01L23/467 ,  H01L23/473 ,  H05K7/20263 ,  H05K7/20336 ,  H05K7/20881

Abstract: A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.