公开(公告)号：US09585257B2

公开(公告)日：2017-02-28

申请号：US14668031

申请日：2015-03-25

Applicant: GLOBALFOUNDRIES INC.

Inventor： Jeffrey P. Gambino ,  Richard S. Graf ,  Sudeep Mandal ,  David J. Russell

IPC: H05K3/02 ,  H05K3/00 ,  H01L21/48 ,  H01L21/768 ,  H01L23/373 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H01L21/60

CPC classification number: H05K3/0094 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76877 ,  H01L23/15 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3738 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2021/60007 ,  H01L2224/16225 ,  H05K1/0201 ,  H05K1/115 ,  H05K3/4038

Abstract: The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having thermally conductive vias in addition to electrically conductive vias. The thermally conductive vias help dissipate heat from one or more IC chips, through the glass interposer, into an organic carrying, and then, into an underlying substrate where it can be dissipated.

Abstract translation: 本发明一般涉及集成电路（IC）芯片封装，更具体地，涉及一种形成具有导电通孔的玻璃插入件以及导电通孔的结构和方法。 导热通孔有助于从一个或多个IC芯片（通过玻璃插入件）将热量散发到有机载体中，然后进入可以被耗散的底层基板。