公开(公告)号：US20220085994A1

公开(公告)日：2022-03-17

申请号：US17020895

申请日：2020-09-15

Applicant: GLOBALFOUNDRIES INC.

Inventor： Romain H. A. Feuillette ,  David C. Pritchard ,  Bernhard J. Wunder ,  Elizabeth Strehlow

IPC: H04L9/08 ,  H04L9/32

Abstract: Methods and systems generate seeds for public-private key pairs by determining a timestamp value associated with a process design kit (PDK) when a user of the PDK triggers a tool of the PDK while designing an integrated circuit device to have a physical unclonable function device (PUF). The methods and systems generate a first value by mapping the timestamp value to data of the user, generate a second value by mapping the timestamp value to configuration data of the PDK, and generate a third value by mapping the timestamp value to layout data of the PDK. A random number is then generated by applying a function to the first value, the second value, and the third value. A public-private encryption key pair is generated using the random number as a first seed number and using a second number generated by the number generation device as a second seed number.

公开(公告)号：US20210057558A1

公开(公告)日：2021-02-25

申请号：US16548518

申请日：2019-08-22

Applicant: GLOBALFOUNDRIES Inc.

Inventor： David Pritchard ,  Heng Yang ,  Hongru Ren ,  Neha Nayyar ,  Manjunatha Prabhu ,  Elizabeth Strehlow ,  Salvatore Cimino

IPC: H01L29/76 ,  H01L29/10 ,  H01L29/08

Abstract: A planar transistor device is disclosed including a gate structure positioned above a semiconductor substrate, the semiconductor substrate comprising a substantially planar upper surface, a channel region, a source region, a drain region, and at least one layer of a two-dimensional (2D) material that is positioned in at least one of the source region, the drain region or the channel region, wherein the layer of 2D material has a substantially planar upper surface, a substantially planar bottom surface and a substantially uniform vertical thickness across an entire length of the layer of 2D material in the gate length direction and across an entire width of the layer of 2D material in the gate width direction, wherein the substantially planar upper surface and the substantially planar bottom surface of the layer of 2D material are positioned approximately parallel to a substantially planar surface of the semiconductor substrate.