公开(公告)号：US09638581B2

公开(公告)日：2017-05-02

申请号：US14302934

申请日：2014-06-12

Applicant: GLOBALFOUNDRIES INC.

Inventor： Nicholas G. Clore ,  Kendra A. Lyons ,  Andrew H. Norfleet ,  Jared P. Yanofsky

IPC: G01R31/26 ,  H01L21/66 ,  G01J5/08 ,  G01J5/02 ,  G01J5/00 ,  G01J5/28

CPC classification number: G01J5/0878 ,  G01J5/0007 ,  G01J5/025 ,  G01J2005/0085 ,  G01J2005/283 ,  H01L22/12 ,  H01L22/20 ,  H01L22/34

Abstract: According to embodiments of the present invention, a semiconductor substrate is formed on at least a portion of a surface of a semiconductor substrate. The emitting layer is excited for a first predetermined time period. A first luminescent intensity value of the emitting layer is determined. In response to exposing the semiconductor substrate and the emitting layer to a condition for a second predetermined time period, a second luminescent intensity value of the emitting layer is determined. A thermal profile of at least the portion of the surface of the semiconductor substrate is determined utilizing the first luminescent intensity value and the second luminescent intensity value of the emitting layer. The thermal profile at least reflects information about one or more of the condition and the semiconductor substrate subsequent to exposure to the condition.

公开(公告)号：US09478473B2

公开(公告)日：2016-10-25

申请号：US13898597

申请日：2013-05-21

Applicant: GLOBALFOUNDRIES INC.

Inventor： Nicholas G. Clore

IPC: H01L23/04 ,  H01L23/10 ,  H01L23/36 ,  H01L23/373 ,  H01L23/40 ,  H01L21/50 ,  H01L23/24

CPC classification number: H01L23/24 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/36 ,  H01L23/373 ,  H01L23/3735 ,  H01L23/40 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for fabrication of a lid for a microelectronic device is described, wherein the microelectronic device comprises of a die and a laminate. A gel is formed having a coefficient of thermal expansion (CTE) within a threshold percentage value of either a CTE of the die or a CTE of the laminate of the microelectronics device. A metal piece is inserted into the gel to form a lid.

Abstract translation: 描述了一种用于制造微电子器件盖的方法，其中微电子器件包括模具和层压体。 形成具有在模具的CTE或微电子器件的层叠体的CTE的阈值百分比内的热膨胀系数（CTE）的凝胶。 将金属片插入凝胶中以形成盖子。